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L77HDA26SVF
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, Flash Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock |
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L177HDA26SD1CH4F
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock |
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L177HDA26SVF
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock |
PDF
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L177HDA26S
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
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L77HDA26SOL2C309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
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