| L177HDE15SVF |  | Amphenol Communications Solutions | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 15 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock | PDF |  | 
| L177HDE15SOL2 |  | Amphenol Communications Solutions | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 15 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock | PDF |  | 
| L77HDE15SD1CH4F |  | Amphenol Communications Solutions | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 15 Socket, Flash Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock | PDF |  | 
| L77HDE15SD1CH4FVGA |  | Amphenol Communications Solutions | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 15 Socket, Bright Tin Shell, Flash Gold, 4-40 Removable Front Screwlock, Ground Tab with Boardlock, VGA | PDF |  | 
| L77HDE15SC309 |  | Amphenol Communications Solutions | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 15 Socket, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock | PDF |  |