JP002 CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE Search Results

JP002 CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE Datasheets Context Search

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Whisker growth Abstract: JESD22a121 JP002 Current tin whiskers theory and mitigation practices guideline JP002 QFN leadframe IC-HAUS BGA cte Contextual Info: ASiC / ASSP CUSTOMER INFORMATION #10 Seite 1/1 Whisker growth in RoHS-compliant packages The growth of whiskers on tin-plated surfaces is a phenomenon engineers are familiar with and one which can pose a risk to electronics units if, for example, neighboring pins short circuit. It is believed that these crystalline	Original	JESD22A121 D-55294 Whisker growth JP002 Current tin whiskers theory and mitigation practices guideline JP002 QFN leadframe IC-HAUS BGA cte	PDF

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Whisker growth

Abstract: JESD22a121 JP002 Current tin whiskers theory and mitigation practices guideline JP002 QFN leadframe IC-HAUS BGA cte
Contextual Info: ASiC / ASSP CUSTOMER INFORMATION #10 Seite 1/1 Whisker growth in RoHS-compliant packages The growth of whiskers on tin-plated surfaces is a phenomenon engineers are familiar with and one which can pose a risk to electronics units if, for example, neighboring pins short circuit. It is believed that these crystalline

Original

JESD22A121 D-55294 Whisker growth JP002 Current tin whiskers theory and mitigation practices guideline JP002 QFN leadframe IC-HAUS BGA cte

PDF