JIS D 1601 Search Results

dbl 2052

Abstract: ba 5839 fp sj 2252 ba 5839 fb KSD 302 SCR 131- 6 WJ 66 SCR 131- 6 WJ 60 BR 5254 SCR 131- 6 WJ 69 KL SN 102 lcd
Contextual Info: HD66732 Graphics Liquid Crystal Display Controller/Driver Supporting JIS L evel-1 and Level-2 Kanji ROM HITACHI Rev 1.0 Jun. 1st, 1998 Description T he H D 66732 is a dot-m atrix liquid crystal display (LC D ) controller and driv er LSI that displays 1 l-b y -1 2

IPBT

Abstract: 174053-2
Contextual Info: 4 C2 1 .13 in in o ± 0 .3 A f N X o H* û. m * 1J ÜJ «“ s 1 2 3 , $i in I r\ N i ° O i * O E E ] » * & . Æ cn 2 mmcnlîlH'C'W'JÆ . o u i- t~ 3E J^fci I ,6mm -^ ¿j : 174046 HiSfcflîU’tt-}- *ali : JIS 01 1 15, B1 122 * '> f ^ 2 ft Dït/'ii 3 > * 5 7 mmlsJL_t ( « W l t h

portland cement

Abstract: K2203 JASO d 605 ANT- FREEZE
Contextual Info: Product Specification 040 Series Multli-Lock Connector -| 08-5352 wire to wire type 26JAN00 Rev A1 1.Scope: 1.1 Contents This specification covers the requirements for product performance, test methods and quality assurance provisions of .040 Series Multilock Connector, contacts and housings of the part num­

Contextual Info: s e MIKRD n Types V r rm V 1500 1600 1700 SEMICELL C A L - Diode Chips3 SKCD 47 C 1501 SKCD 47 C 1601 SKCD 47 C 1701 SKCD 47C 150.1701 6,9x6,9 mm; 40 A4>;1500.1700V Absolute Maximum Ratings Symbol Conditions ' If s m > 6 bondwires 300 jim 0 ) tp = 10 ms; sin; Tj = 150 °C

JIS D 5500

Abstract: ip5216 IS-287J kojiri JASO 7002 JIS D 0203 portland cement
Contextual Info: Product Specification 108-5216-2 M ; m I oo .070 Multi-Lock I/O Connector MLC for Wire-to-Board Termination 1. Scope: o This specification provides performance requirements and test methods for .070 Series AMP Multi-Lock I/O Connector (MLC) for wire-to-board termination, of the part numbers specified in Para.2

C2680

Abstract: C5210
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT 32,00 1,25 14,85 ±0,05 0,585 ±0,002 0,000 0,00 8 19,05 -0,25 0,750 -0,010 1 TOP OF PCB LP 17,80 0,701 1 19,60 0,772 8 16,00 0,630 16,00 0,630 8,1 0,318 INLINE COUPLER 14,5 0,570 22,80 0,898

TAG 740

Abstract: iec 807-3 C5210 sh C5210 iec 512-2 SUS301
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT 27,46 1,081 19,45 0,15 14,85 ±0,05 0,585 ±0,002 TOP OF PCB LP 18,54 0,730 14,48 0,570 19,09 0,752 WIRING DIAGRAM 18,80 0,740 16,13 0,635 8 +0,40 1 20,60 -0,40 0,811 -0,016 +0,016 17,54 0,691

752 48 09 ng

Abstract: C5210 740 48 09 ng
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT 19,05 -0,25 0,750 -0,010 0,000 14,85 ±0,05 0,585 ±0,002 27,46 1,081 0,00 TOP OF PCB LP 1:1 18,54 0,730 9,90 0,390 6 14,48 0,570 18,80 0,740 1 16,13 0,635 19,09 0,752 6 1 WIRING DIAGRAM 1 9,90 0,390

10R-02

Abstract: 10P10 DY 645 10P10C C2680 C5210
Contextual Info: 17,16 0,676 RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT RECOMMENDED PCB LAYOUT COMPONENT SIDE VIEW EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE) TOL. 0.05 [0.002] UNLESS NOTED 2,54 0,100 1,27 0,050 2,54 0,100 15,66 0,617 0,89 ±0,07 0,035 ±0,003 X10

JIS C-3406

Abstract: JASO d 605 JIS 3406 wire spec R5210 jis d 0203 JIS D 1601 liquid silicone rubber 109-5311
Contextual Info: Product Specification 108-5365 17OCT08 製品規格 Rev. Ｂ1 040 Series Sealed PAIR MATE Connectors 1. Scope 1.1 Contents This specification covers the requirements for product performance, test methods, and quality assurance provisions of 040 Series Sealed PAIR MATE Connectors. Applicable product description and part numbers are as

C2680

Abstract: C5210
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT RECOMMENDED PCB LAYOUT COMPONENT SIDE VIEW EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE) TOL. 0.05 [0.002] UNLESS NOTED 8 1,60 ±0,07 0,063 ±0,003 X2 0,64 0,025 3,25 ±0,07 0,128 ±0,003 X2

C2680

Abstract: C5210 iec 512-3 IEC 807-3
Contextual Info: RECOMMENDED PCB LAYOUT COMPONENT SIDE VIEW EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE) TOL. 0.05 [0.002] UNLESS NOTED 2,54 0,100 2,54 0,100 1,27 0,050 1,27 0,050 0,64 0,025 16,66 0,656 TOP OF PCB LP 12,67 0,499 0,38 ±0,10 0,015 ±0,004 RECOMMENDED PANEL CUTOUT

C2680

Abstract: C5210
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT 25,40 1,000 RECOMMENDED PCB LAYOUT COMPONENT SIDE VIEW EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE) TOL. 0.05 [0.002] UNLESS NOTED 32,54 1,281 24,13 0,950 10,16 0,400 3 2 6 5 1 8 1 8 4,57 0,180

133496

Abstract: C2680 C5210
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT RECOMMENDED PCB LAYOUT COMPONENT SIDE VIEW EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE) TOL. 0.05 [0.002] UNLESS NOTED 59,97 ±0,20 2,361 ±0,008 52,07 2,050 40,64 1,600 38,10 1,500 14,42 0,568

C2680

Abstract: C5210
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT RECOMMENDED PCB LAYOUT COMPONENT SIDE VIEW EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE) TOL. 0.05 [0.002] UNLESS NOTED 0,76 0,030 11,47 0,452 TOP OF PCB LP 1,27 0,050 15,74 0,620 8 3,30 ±0,07 0,130 ±0,003 X2

din 7167

Abstract: DIN ISO 2768-M C2680 C5210 DIN ISO 2768-M Al
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT 39,37 ±0,13 1,550 ±0,005 RECOMMENDED PCB LAYOUT COMPONENT SIDE VIEW EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE) TOL. 0.05 [0.002] UNLESS NOTED 45,81 1,804 38,10 1,500 24,13 0,950 1 8

C2680

Abstract: C5210
Contextual Info: 17,16 0,676 RECOMMENDED PCB LAYOUT COMPONENT SIDE VIEW EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE) TOL ±0,05 mm unless noted 16,43 0,647 2,54 0,100 2,54 0,100 1,27 0,050 17,08 0,672 0,635 0,025 2 4 6 8 0,89 0,035 x8 1 3 5 7 4,05 0,159 1,60 0,063 x2

din 7167

Abstract: DIN ISO 2768-M DIN ISO 2768-M Al C2680 C5210 max5997
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT 53,34 ±0,13 2,100 ±0,005 RECOMMENDED PCB LAYOUT COMPONENT SIDE VIEW EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE) TOL. 0.05 [0.002] UNLESS NOTED TOP OF PCB LP 52,07 2,050 14,42 0,568 0,10 0,004

C2680

Abstract: C5210
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT 14,89 0,586 0,38 ±0,10 0,015 ±0,004 21,27 0,837 87,95 ±0,20 3,463 ±0,008 TOP OF PCB LP 8 1 8 1 8 1 8 1 1 8 8 13,60 0,535 1 3,40 ±0,30 0,134 ±0,012 87,00 3,425 5 X 13.97 =69,85 2,750 81,28 ±0,13 3,200 ±0,005

C2680

Abstract: C5210
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT 0,38 ±0,10 0,015 ±0,004 TOP OF PCB LP 14,89 0,586 21,59 0,850 87,95 ±0,20 3,463 ±0,008 87,00 3,425 8 1 8 1 8 1 8 1 8 1 8 IMPROVED CONTACT DESIGN PRE BEND 13,80 0,543 1 3,20 ±0,30 0,126 ±0,012

C2680

Abstract: C5210
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT TOP OF PCB LP 14,89 0,586 21,59 0,850 MAX 0,38 ±0,10 0,015 ±0,004 115,95±0,20 4,565 ±0,008 114,94 4,525 8 1 8 1 8 1 8 1 8 1 8 1 8 1 8 13,80 0,543 1 3,20 ±0,3 0,126 ±0,012 7 X 13,97 = 97,79

C2680

Abstract: C5210
Contextual Info: 115,95±0,20 4,565 ±0,008 0,38 ±0,10 0,015 ±0,004 TOP OF PCB LP 14,89 0,586 21,59 0,850 MAX RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT 114,94 4,525 8 1 8 1 8 1 8 1 8 1 8 1 8 1 8 13,80 0,543 1 3,20 ±0,30 0,126 ±0,012 7 X 13,97 =97,79

HS 153 SP

Abstract: C2680 C5210 133786
Contextual Info: 21,39 0,842 82,55 ±0,13 3,250 ±0,005 STANDOFF ABSTAND 82,55 ±0,13 3,250 ±0,005 170,82 ±0,13 6,725 ±0,005 1 8 1 8 1 8 1 8 1 8 1 8 1 8 1 8 1 8 1 8 1 1 8 13,80 0,543 11 x 13.97 = 153,67 6,050 8 3,20 ±0,20 0,126 ±0,008 3,68 RECOMMENDED PANEL CUTOUT

C2680

Abstract: C5210
Contextual Info: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN-AUSSCHNITT 0,38 ±0,10 0,015 ±0,004 TOP OF PCB LP 14,89 0,586 21,59 0,850 87,95 ±0,20 3,463 ±0,008 1 8 1 8 1 8 1 8 1 8 1 8 4,10 ±0,30 0,161±0,012 13,80 0,543 87,00 3,425 2,750 5 X 13.97 =69,85 IMPROVED CONTACT DESIGN