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    JESD22A121 MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACES FINISHES Search Results

    JESD22A121 MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACES FINISHES Result Highlights (5)

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    JESD22A121 MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACES FINISHES Datasheets Context Search

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    JESD22A121

    Abstract: IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031
    Contextual Info: Application Report SZZA051B – August 2005 – Revised August 2005 Whisker Evaluation of Pb-Free Component Leads Donald C. Abbott, Stu Grenney, Larry Nye, Douglas W. Romm . SLL Logic ABSTRACT Integrated circuits ICs with both tin-lead (SnPb) and Pb-free finished leads were


    Original
    SZZA051B JESD22A121 IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031 PDF