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    JESD201 B Search Results

    JESD201 B Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    J-STD-020 MSL Rating

    Abstract: mil J-STD-020
    Contextual Info: KEMET Surface Mount Ceramic Revision D, 03 November 2006 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer


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    2002/95/EC, 2005/618/EC. J-STD-020 MSL Rating mil J-STD-020 PDF

    kemet CWR29 datasheet

    Abstract: JESD22a121 cwr29 capacitor code MCV CWR29 MAR 618 transistor T496 T497 T498 T499
    Contextual Info: KEMET Surface Mount Tantalum Revision E, 15 January 2007 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party


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    2002/95/EC 2002/95/EC, 2005/618/EC. kemet CWR29 datasheet JESD22a121 cwr29 capacitor code MCV CWR29 MAR 618 transistor T496 T497 T498 T499 PDF

    Contextual Info: Enhancing Long-Term Reliability with Copper Leadframes One of the points to consider when selecting a semiconductor device is the package reliability, relative to the expected operating conditions of the electronics application. With this in mind, ISSI now includes


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    Alloy42 64Mbit 512Mbit. 16Mbit. PDF

    Contextual Info: Enhancing Long-Term Reliability with Copper Leadframes One of the points to consider when selecting a semiconductor device is the package reliability, relative to the operating conditions of the electronics application. With this in mind, ISSI recently added synchronous


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    Alloy42 64Mbit 512Mbit. 16Mbit) 256Kbit) PDF

    BFG95

    Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


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    UG112 UG072, UG075, XAPP427, BFG95 PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF