JEDEC TRAY STANDARD Search Results

EIA and EIAJ tape standards

Abstract: TR3000MT TR-3000MT EIA and EIAJ standards
Contextual Info: TAPE AND REEL EQUIPMENT REEL-TECH TR-3000MT • ■ ■ ■ ■ ■ ■ ■ Dual pick-and-place probes 3400 UPH tray-to-tape Continuous operation 8-inch high stack of JEDEC trays Easy PC control Quick, accurate changeovers Mark, implied lead and pin #1 Vision

trays

Abstract: QFN Shipping Trays PEAK TRAY bga
Contextual Info: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad

Teradyne connector

Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Contextual Info: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight

JEDEC TRAY DIMENSIONS

Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

SMT CONNECTOR

Abstract: JEDEC tray standard
Contextual Info: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles

MO-160

Abstract: MO-190 JEDEC tray standard
Contextual Info: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles

1-1735438-2

Abstract: DDR3 DIMM 6-1773454-7 PEAK TRAY 2-2013289-1 2013289-1 1735438-2 1735438-4 2-2013289 2-2013287-2 2-2013287-3
Contextual Info: DDR3 DIMM Sockets The Tyco Electronics’ DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to

2013310-2

Abstract: JEDEC tray standard DIMM 240 2013298-1 2-2013310-1 2013289-1
Contextual Info: DDR3 DIMM Sockets TE Connectivity’ DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to

JEDEC dip profile

Contextual Info: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles

LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

ANSI/EOS ESD S11.11-2001

Abstract: EIA-625 1x10E-8 EIA-541 SSTV16857 SSYA010 abstract for "metal detector" 1x10e9
Contextual Info: Application Report SZZA047 - July 2004 Semiconductor Packing Material Electrostatic Discharge ESD Protection Albert Escusa and Lance Wright Standard Linear and Logic ABSTRACT Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI)

10GBASE-T

Contextual Info: PULSEJACK 10GBASE-T MAGNETICS MODULE TM www.pulseeng.com Designed to Support 10GBASE-T Transceivers Compliant with IEEE 802.3 standard Qualified with top 10Gig PHY Manufacturers RoHS peak temperature per IPC/JEDEC J-STD-020C Low profile package for PCI Express

4558 DX

Abstract: 4558 DX dip 8 78lr05 njm 4558 sip ic 4558 NJM2233 data sheet ic 4558 ic njm 4558 78LR NJU6408
Contextual Info: ORDERING INFORMATION NJRC ICs are named by NJRC Naming Standard. Please order our ICs by their full names. NJRC Naming Standard 1. SILICON IC 1.1 Bipolar : standard Example : NJM 4558 M - A T1 1 2 3 4 5 Item 1 Classification of items NJM - Bipolar monolithic IC

JTH-0001NL

Abstract: JT0-0001NL
Contextual Info: PULSEJACK 10GBASE-T MAGNETICS MODULE TM www.pulseeng.com Designed to Support 10GBASE-T Transceivers Compliant with IEEE 802.3 standard Qualified with top 10Gig PHY Manufacturers RoHS peak temperature per IPC/JEDEC J-STD-020C Low profile package for PCI Express

IC JRC 4558

Abstract: JRC 4558 D JRC 4558 T 7201 JRC 78LR 4558 JRC 78lr05 JRC IC JRC 4558 JRC 7201
Contextual Info: ORDERING INFORMATION New JRC ICs are named by New JRC Naming Standard. Please order our ICs by their full names. New JRC Naming Standard 1. SILICON IC 1.1 Bipolar : standard Example : NJM 4558 M - A T1 1 2 3 4 5 Item 1 Classification of items NJM - Bipolar monolithic IC

KU82596CA33

Abstract: n177 ng88c196ecdb KU80386EXTC25 KU80386EXTC33 pqfp132 KU80486SXSA33 KU82596CA25 KU80386EXTB25 NG88C196EC
Contextual Info: Product Change Notification # 948 Rev. 1 Information in this document is provided in connection with Intel  products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as

HT 1200-4

Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

IC JRC 4558

Abstract: 4558 DX 4558 DX jrc JRC 7201 ic njm 4558 4558 DX dip 8 4558 jrc 7201 JRC JRC 4558 JRC 4558 D
Contextual Info: ORDERING INFORMATION New JRC ICs are named by New JRC Naming Standard. Please order our ICs by their full names. New JRC Naming Standard 1. SILICON IC 1.1 Bipolar : standard Example : NJM 4558 M - A T1 1 2 3 4 5 Item 1 Classification of items NJM - Bipolar monolithic IC

IPC-J-STD-001

Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide DAEWON tray 48 optical Pick-Up head venturi meter R08-01-FOGO
Contextual Info: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.5 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Process Procedures

Contextual Info: Features and Benefits • Zero insertion force contacts improve socket and module contact life and provide for fast on-line assembly ■ Guaranteed 2 points of contact per readout with standard ■ ■ ■ ■ JEDEC module Anti-overstress latch feature provides extra protection

4558 DX jrc

Abstract: IC JRC 4558 4558 DX 4558 DX dip 8 JRC 7201 78lr05 4558 sx ic njm 4558 4558 JRC 78LR
Contextual Info: ORDERING INFORMATION New JRC ICs are named by New JRC Naming Standard. Please order our ICs by their full names. New JRC Naming Standard 1. SILICON IC 1.1 Bipolar : standard Example : NJM 4558 M - A T1 1 2 3 4 5 Item 1 Classification of items NJM - Bipolar monolithic IC

Contextual Info: 1.27mm .050" Pitch SIMM Socket Sockets and Edge Connectors FEATURES AND SPECIFICATIONS E Features and Benefits • Zero insertion force contacts improve socket and module contact life and provide for fast on-line assembly ■ Guaranteed 2 points of contact per readout with standard

10 mhz clock 14 pin dip

Abstract: j-std-020 MXO45HSLV-3C-32M7680 MXO45LV MXO45LV-3C-32M7680
Contextual Info: MXO45LV/MXO45HSLV METAL DIP CLOCK OSCILLATOR FEATURES • • • • • • • • • Standard 14 Pin or 8 Pin DIP Footprint HCMOS/TTL Compatible Fundamental and 3RD Overtone Crystals Frequency Range 1.0 – 50.0 MHz Frequency Stability, ±50 ppm Standard

Contextual Info: Features and Benefits Electrical • Accepts JEDEC standard 1.27mm modules Voltage: 125V E Metal board locks ensure SMT tails are fu lly seated on PCB Current: 1.0A H Solderable board locks for added retention Contact Resistance: 40m£2 max. ■ Tower and latch provide pre-alignment of module during