JEDEC TRAY STANDARD Search Results

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
Contextual Info: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /

Contextual Info: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78954 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A

Contextual Info: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78968 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A

EIA and EIAJ tape standards

Abstract: TR3000MT TR-3000MT EIA and EIAJ standards
Contextual Info: TAPE AND REEL EQUIPMENT REEL-TECH TR-3000MT • ■ ■ ■ ■ ■ ■ ■ Dual pick-and-place probes 3400 UPH tray-to-tape Continuous operation 8-inch high stack of JEDEC trays Easy PC control Quick, accurate changeovers Mark, implied lead and pin #1 Vision

trays

Abstract: QFN Shipping Trays PEAK TRAY bga
Contextual Info: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad

Teradyne connector

Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Contextual Info: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight

JEDEC TRAY DIMENSIONS

Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

MIL-STD-81705

Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
Contextual Info: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes

MQFP Shipping Trays

Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

EIA and EIAJ standards 783

Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
Contextual Info: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare

JEDEC Matrix Tray outlines

Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
Contextual Info: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare

EIA and EIAJ standards 783

Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
Contextual Info: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to

SMT CONNECTOR

Abstract: JEDEC tray standard
Contextual Info: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles

MO-160

Abstract: MO-190 JEDEC tray standard
Contextual Info: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles

Contextual Info: m o le x Sockets a n d Edge C onnecto rs FEATURES A N D SPECIFICATIONS Features and Benefits Electrical • Zero insertion force contacts improve socket and module contact life ond provide fo r fast on-line assembly ■ Guaranteed 2 points of contact per readout with standard

2013310-2

Abstract: JEDEC tray standard DIMM 240 2013298-1 2-2013310-1 2013289-1
Contextual Info: DDR3 DIMM Sockets TE Connectivity’ DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to

IR 9530

Contextual Info: Sockets and Edge Connectors FEATURES ANDSPECMCAHOHS features and Benefits • Zero insertion farce contacts improve socket and module contact life and provide fo r fast on-line assembly ■ Guaranteed 2 points of contact per readout with standard JEDEC module

GS-14-899

Abstract: MO-269 DDR3 memory DDR3 sodimm socket DDR3 rDIMM DDR3 pcb design GS-12-486 ddr3 dimm connector sc007
Contextual Info: BOARD-TO-BOARD CONNECTORS FCÎ, DDR3 MEMORY MODULE SOCKETS DESCRIPTION Memory module sockets from FCI are designed to accept most industry standard memory types DDR, DDR2, DDR3 and form factors such as DIMM, SO-DIMM or VLP DIMM. The sockets allow convenient memory

JEDEC dip profile

Contextual Info: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles

LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

TQFP 100 pin ic

Abstract: 208ld
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

Contextual Info: S o c k e ts a n d E d g e C o n n e c to rs FEATURES AMD SPECIFICATIONS Features and Benefits • Zero insertion force contacts improve socket and module contact life and provide for fast on-line assembly ■ Guaranteed 2 points of contact per readout with standard

Contextual Info: • Guaranteed 2 points o f contact per readout with standard JEDEC module m o l e x 2.54mm x 12.70mm Flectrical .100 x .500" Pitch Voltage: 2S0V SIMM Classic Current: 1.0A Contact Resistance: 30mC2 max. SIMM Socket Dielectric Withstanding Voltage: 1000V AC

ANSI/EOS ESD S11.11-2001

Abstract: EIA-625 1x10E-8 EIA-541 SSTV16857 SSYA010 abstract for "metal detector" 1x10e9
Contextual Info: Application Report SZZA047 - July 2004 Semiconductor Packing Material Electrostatic Discharge ESD Protection Albert Escusa and Lance Wright Standard Linear and Logic ABSTRACT Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI)