JEDEC TRAY 10 X 10 Search Results

JEDEC TRAY DIMENSIONS

Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

tqfp 7x7 tray

Abstract: DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10
Contextual Info: 12_ I_ y _ I_ 10_ I_9_ I_ 8_ I_7_ I_ 6_ I_ 5_ I_4_ I_ 3_ I_2_ I_1

DAEWON JEDEC TRAY 10 X 10

Abstract: DAEWON JEDEC TRAY DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing DAEWON drawing daewon tray 41AL daewon JEDEC TRAY 10 X 10
Contextual Info: M IE APPROVED 06/85/99 SB KVMC — 6.35 rx l /“ SEE DETAIL 'D' 10.20 0 a zq O.gQWlAlXj — 7.62 in 311.15- • +0.25 -0.13 - 132.08- -I +0.25 -0.13 +0.25 -0.13 311.66 -■ +0.25 -0.13 - 132.59- - 0.20(H lA|xq <IH0.20 (R) 1A1Z (R) 92.1 SECTIDN 'X-X*

DAEWON tray drawing

Abstract: daewon 7x7 DAEWON JEDEC TRAY IA7 B DAEWON JEDEC TRAY 10 X 10 KY 717 atmel 717 daewon tray 7x7 atmel 367 daewon CABGA
Contextual Info: MIE APPROVAL 02/24/98 KY KW SEE DETAIL 'D' — 6.35 ►0.20 0 A Xd •0.20(0) A ZQ — 7.62 - 311.15-+0.25 -0.13 -132.08- +0.25 -0.13 +0.25 -0.13 - 311.66 - - +0.25 -0.13 - 132.59 - - ^10.20(0)1 A| X(R)| •0-10.20(0)1A|Z(0)| 135.9 92.1 SECTIDN

TB-2082

Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
Contextual Info: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02

2N6284G

Abstract: 2N6287G 2N6284 2N6286 2N6286G 2N6287 JEDEC tray dimension
Contextual Info: 2N6284 NPN ; 2N6286, 2N6287 (PNP) Preferred Device Darlington Complementary Silicon Power Transistors These packages are designed for general−purpose amplifier and low−frequency switching applications. Features • High DC Current Gain @ IC = 10 Adc −

Teradyne connector

Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Contextual Info: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight

JEP95 MS-028

Contextual Info: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm

Contextual Info: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Balｌ • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm

Contextual Info: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm

1152 BGA tray

Abstract: tray datasheet bga jedec bga tray tray bga 117-pin JEDEC tray standard JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER 135° C MAX. A 10.5 12.80 10.35 FBGA14 x 10 ESP NEC 115.2 135.9 PPE 10 × 18=180 UNIT : mm A' 14.5 17.10 12.15 290.7 315.0 322.6 SECTION A-A' 14.50 (5.97) (5.62) 7.62 14.00 Applied Package 117-pin Plastic BGA (14×10) Quantity (pcs) 180 MAX.

SSOP12

Abstract: SOP package tray SOP JEDEC tray SSOP12 Package h740 JEDEC TRAY DIMENSIONS SSOP-12
Contextual Info: TRAY CONTAINER NEC 119.9 5.86 135° CMAX. 10.90 SSOP12.3 x 6.1A 8.00 135.9 PPE 12 × 20=240 UNIT : mm 12.70 15.50 10.25 294.5 315.0 322.6 SECTION A-A' 5.27 (6.35) 7.62 12.70 Applied Package 38-pin • Plastic Shrink SOP Quantity (pcs) 240 MAX. SSOP12.3 × 6.1A

JEDEC TRAY DIMENSIONS

Abstract: QFP JEDEC tray JEDEC tray standard SSD-A-H7437 JEDEC TRAY DIMENSIONS QFP14 QFP 14 14 tray QFP14 TRAY CONTAINER
Contextual Info: TRAY CONTAINER UNIT : mm 6 x 14=84 135° CMAX. 15.45 A' 18.30 21.50 17.75 18.30 NEC 105.0 QFP14 × 14 × 2.7 21.00 135.9 PPE A 279.5 315.0 322.6 SECTION A-A' 18.30 4.77 (6.35) 7.62 13.65 Applied Package 100-pin Plastic QFP (2.7mm thick) Quantity (pcs) 84 MAX.

27B1

Abstract: BGA27 BGA package tray 625-Pin
Contextual Info: TRAY CONTAINER UNIT : mm 4 x 10=40 87.6 135° C MAX. 27.25 24.15 NEC BGA27 × 27B-1 29.20 135.9 PPE A' A 27.25 29.20 26.10 262.8 315.0 322.6 SECTION A-A' 4.17 (6.35) 7.62 27.25 Applied Package Quantity (pcs) Tray BGA27×27B-1 624-pin Plastic BGA (27×27)

H7665

Abstract: SOP package tray SSOP36 SOP JEDEC tray H7665 DATA SHEET JEDEC TRAY DIMENSIONS JEDEC tray standard 490
Contextual Info: TRAY CONTAINER UNIT : mm 120.9 14 x 35=490 135° C MAX. 3.9 8.85 7.05 6.8 NEC A' 9.30 7.50 SSOP3.6 × 4.4A 135.9 PPE A 300.9 315.0 322.6 SECTION A-A' 5.92 6.35 7.62 3.90 Applied Package 10-pin Plastic Shrink SOP Quantity (pcs) 490 MAX. Tray SSOP3.6×4.4A

JEDEC qfn tray

Abstract: QFn Package tray JEDEC tray standard 13 QFN tray JEDEC TRAY QFN Package tray JEDEC TRAY DIMENSIONS QFN QFN JEDEC TRAY JEDEC tray standard JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER A' 7.39 10.00 7.50 7.39 A 135° C MAX. 10.10 7.35 QFN7x7B NEC 121.2 135.9 PPE 13 × 31=403 UNIT : mm 300.0 315.0 322.6 SECTION A-A' 5.92 6.35 7.62 7.39 Applied Package Quantity (pcs) 48-pin Plastic WQFN (7×7) 403 MAX. Tray QFN 7×7B Material

JEDEC tray standard 13

Abstract: c 129 transistor JEDEC FBGA 144PIN JEDEC TRAY DIMENSIONS FBGA
Contextual Info: TRAY CONTAINER UNIT : mm 13 x 32=416 118.2 135° C MAX. NEC FBGA7 × 7ESP 7.35 8.85 9.85 A' 7.35 9.60 297.6 315.0 322.6 8.70 7.35 Section A – A' (5.62) (5.77) 7.00 7.62 135.9 PPE A Applied Package Quantity (pcs) 48-pin Plastic FBGA (7×7) 109-pin Tape FBGA (7×7)

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Contextual Info: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)

JEDEC TRAY DIMENSIONS

Abstract: PACKAGE TRAY jedec bga tray tray jedec BGA tray bga JEDEC tray standard
Contextual Info: TRAY CONTAINER UNIT : mm 6x15=90 17.25 107.0 NEC 135°C MAX. A' 14.45 21.40 FBGA17×17A-1 135.9 PPE A 20.50 17.25 287.0 14.00 315.0 322.6 SECTION A – A' 17.25 (6.05) (5.62) 7.62 17.00 Applied Package 256-pin Plastic BGA (17×17) Quantity (pcs) 90 MAX.

284069

Abstract: 952050 284044 E83005 IEC60664 TR64 284656 374044
Contextual Info: 2,54 mm Einreihiger Steckverbinder SRC MaxiBridge www.erni.com Katalog D 074592 074518 Ausgabe 3, 03/05 02/10 Ausgabe www.erni.com 7 1 www.erni.com Katalog D 074592 02/10 Ausgabe 7 2,54 mm Einreihige Steckverbinder (SRC) MaxiBridge™ Inhaltsverzeichnis

LQFP Package tray

Abstract: TQFP14X14X1 LQFP "100 pin" PACKAGE LQFP Package 128-pin 128-PIN tray container dimensions TRAY CONTAINER LQFP14 100-PIN PLASTIC LQFP NEC tqfp14x14x1.4
Contextual Info: TRAY CONTAINER 7 15.45 16.7 6x15=90 21.00 A' A 150°C MAX. PPE 105.0 TQFP14X14X1.4 15.40 16.7 20.30 284.2 315.0 322.6 Section A – A' 16.7 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 80-pin Plastic LQFP (1.4mm thick) 100-pin Plastic LQFP (1.4mm thick)

FBGA 12x12 TRAY

Abstract: nec 1230 JEDEC TRAY DIMENSIONS FBGA
Contextual Info: TRAY CONTAINER UNIT : mm 8x20=160 135°C MAX. 16.40 A' 12.30 114.8 FBGA12×12B 10.55 12.30 15.50 294.5 10.25 315.0 322.6 SECTION A – A' (6.35) (6.29) 12.30 12.00 7.62 135.9 PPE A Applied Package 209-pin Plastic FBGA (12×12) Quantity (pcs) 160 MAX. FBGA 12×12B

fBGA package tray

Contextual Info: TRAY CONTAINER NEC 119.6 7 FBGA8x6ESP 135°C MAX. A' 6.50 9.20 A 8.50 10.60 296.8 9.10 315.0 322.6 8.50 8.00 (5.62) (5.91) Section A – A' 7.62 8.15 135.9 PPE 14×29=406 UNIT : mm Applied Package 48-pin Plastic FBGA (8×6) Quantity (pcs) 406 MAX. Tray

LQFP100 tray dimension

Abstract: JESD97 Classification E3
Contextual Info: ARM-based Flash MCU SAM4E16E SAM4E8E SAM4E16C SAM4E8C SUMMARY DATASHEET Description The Atmel SAM4E series of Flash microcontrollers is based on the high-performance 32-bit ARM Cortex®-M4 RISC processor and includes a floating point unit FPU . It operates at a maximum speed of 120 MHz and features up to 1024 Kbytes of Flash,