JEDEC TRAY Search Results

SMD Packages

Contextual Info: IPC/JEDEC J-STD-033A July 2002 Supersedes IPC/JEDEC J-STD-033 April 1999 JOINT INDUSTRY STANDARD Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of

A2ND

Contextual Info: JEDEC STANDARD Marking, Symbols, and Labels for Identification of Lead Pb Free Assemblies, Components, and Devices JESD97 MAY 2004 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and

JEDEC Jc-11 free

Abstract: Pub-95 TRANSISTOR Outlines JC11 JEP95 JEDEC diode Outlines IEC47D BGA OUTLINE DRAWING JEDEC bga case outline diode outlines
Contextual Info: JEDEC Publication 95 Microelectronic Package Standard Application Report 1999 Printed in U.S.A. 0199 SZZA006 JEDEC Publication 95 Microelectronic Package Standard SZZA006 January 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products

Contextual Info: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78968 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A

Contextual Info: 1.27mm .050" Pitch SIMM Socket FEATURES AND SPECIFICATIONS Reference Information Product Specification: PS-78954 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: JEDEC modules Designed In: Inches Electrical Voltage: 250V Current: 1.0A

SB865A

Abstract: SB866A ddr2 PLL JESD82 SSTUx32864 SSTU32868 JEDEC DDR2-400 2rx8 SB866 SN74SSTUB32866
Contextual Info: Application Report SCAA101 – March 2009 DDR2 Memory Interface Clocks and Registers – Overview Christian Schmoeller . CDC - Clock Distribution Circuits ABSTRACT This application report gives an overview of the existing JEDEC DDR2 Register and

EIA and EIAJ tape standards

Abstract: TR3000MT TR-3000MT EIA and EIAJ standards
Contextual Info: TAPE AND REEL EQUIPMENT REEL-TECH TR-3000MT • ■ ■ ■ ■ ■ ■ ■ Dual pick-and-place probes 3400 UPH tray-to-tape Continuous operation 8-inch high stack of JEDEC trays Easy PC control Quick, accurate changeovers Mark, implied lead and pin #1 Vision

Contextual Info: •&AEC INTERC0HNECT10N SPECIALISTS LCC SOCKETS FOR SMD JEDEC TYPE C DEVICES Typical Cellular Telephone Application (Patent Pending) Andon has developed a leadless ceramic chip socket contact providing excellent electrical conductivity and excellent mechanical security.

Package tray

Abstract: OT-007TM-01 PPO datasheet jedec Package QFP JEDEC tray JEDEC tray
Contextual Info: 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 252.8 315 322.6 <SECTION A - A'> 4.12 7.62 6.35 39.57 48.8 Tray Material Heat Proof Temp. Surface resistance OT-007TM-01 JEDEC Tray Carbon PPO 125°C less than 1x106Ω / Applied Package Quantity(PCS)

78730-1002

Abstract: 78726-1005
Contextual Info: Available in Press-fit, SMT and Through-hole mounting, DDR4 DIMM sockets offer significant assemblyprocessing compatibility and cost savings in high-speed server memory applications Meeting JEDEC specifications, Molex’s Vertical Press-fit, SMT and Through

2013310-2

Abstract: JEDEC tray standard DIMM 240 2013298-1 2-2013310-1 2013289-1
Contextual Info: DDR3 DIMM Sockets TE Connectivity’ DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to

Teradyne connector

Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Contextual Info: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
Contextual Info: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /

1-1735438-2

Abstract: DDR3 DIMM 6-1773454-7 PEAK TRAY 2-2013289-1 2013289-1 1735438-2 1735438-4 2-2013289 2-2013287-2 2-2013287-3
Contextual Info: DDR3 DIMM Sockets The Tyco Electronics’ DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

simm socket

Abstract: simm socket 40 socket, simm PS-78968
Contextual Info: Features and Benefits Electrical Voltage: 250V contact life and provide for fast on-line assembly Current: 1.0A Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max. JEDEC module Dielectric Withstanding Voltage: 1000V AC

JEDEC tray standard dimension

Abstract: simm socket jedec SIMM MO-116
Contextual Info: Features and Benefits Electrical Voltage: 250V contact life and provide for fast on-line assembly Current: 1.0A Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max. JEDEC module Dielectric Withstanding Voltage: 1000V AC

JEDEC tray standard dimension

Contextual Info: Features and Benefits Electrical Voltage: 250V contact life and provide for fast on-line assembly Current: 1.0A Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max. JEDEC module Dielectric Withstanding Voltage: 1000V AC

Contextual Info: Features and Benefits Electrical Voltage: 250V contact life and provide for fast on-line assembly Current: 1.0A Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max. JEDEC module Dielectric Withstanding Voltage: 1000V AC

54189

Contextual Info: Sockets and Edge Connectors FEATURES AND SPECIFICATIONS E Features and Benefits Sizes 144 circuits Mounted Height: 10.0mm Accepts JEDEC standard SGRAM modules Plastic latch prevents scratching of module, while metal anti-overstress feature protects latch from bending too

jedec SIMM MO-116

Abstract: 15-82-1175 78954 molex Molex 78962
Contextual Info: Features and Benefits Electrical Voltage: 250V contact life and provide for fast on-line assembly Current: 1.0A Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max. JEDEC module Dielectric Withstanding Voltage: 1000V AC

MO-160

Abstract: MO-190 JEDEC tray standard
Contextual Info: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles

SMT CONNECTOR

Abstract: JEDEC tray standard
Contextual Info: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles

JEDEC dip profile

Contextual Info: S.O. DIMM Connectors Features/Benefits SERIES 6401 Series 6401 is a right-angle SMT connector, conforming to JEDEC MO-160 standard of S.O. DIMM. TECHNICAL SPECIFICATIONS Application: Pitch: Number of Contacts: Height: Current Rating: Voltage Rating: Mating Cycles