JEDEC PACKAGE TFBGA 12 Search Results

jesd 51-7

Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Contextual Info: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs

LQFP100 tray dimension

Abstract: JESD97 Classification E3
Contextual Info: ARM-based Flash MCU SAM4E16E SAM4E8E SAM4E16C SAM4E8C SUMMARY DATASHEET Description The Atmel SAM4E series of Flash microcontrollers is based on the high-performance 32-bit ARM Cortex®-M4 RISC processor and includes a floating point unit FPU . It operates at a maximum speed of 120 MHz and features up to 1024 Kbytes of Flash,

tray lqfp

Abstract: JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
Contextual Info: ARM-based Flash MCU SAM4S Series SUMMARY DATASHEET Description The Atmel SAM4S series is a member of a family of Flash microcontrollers based on the high-performance 32-bit ARM Cortex ® -M4 RISC processor. It operates at a maximum speed of 120 MHz and features up to 2048 Kbytes of Flash, with optional

Contextual Info: IC62LV12816DL IC62LV12816DLL Document Title 128 K x 16 bit Low Voltage and Ultra Low Power CMOS Static RAM Revision History Revision No History Draft Date Remark 0A Initial Draft June 7,2002 Preliminary The attached datasheets are provided by ICSI. Integrated Circuit Solution Inc reserve the right to change the specifications and

Contextual Info: IS62LV12816L IS62LV12816LL IS62LV12816L IS62LV12816LL 128K x 16 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM FEATURES DESCRIPTION The 1+51 IS62LV12816L and IS62LV12816LL are high-speed, • High-speed access times: 55, 70, 100 ns • CMOS low power operation

Contextual Info: IC62LV12816L IC62LV12816LL IC62LV12816L IC62LV12816LL 128K x 16 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM FEATURES DESCRIPTION The 1+51 IC62LV12816L and IC62LV12816LL are high-speed, • High-speed access times: 55, 70, 100 ns • CMOS low power operation

A29L320ATV-70F

Abstract: 48pin flash programmer circuit 48pin TSOP A29L320ATV A29L320AUV-70UF A29L320ATV-70UF A29L320AUG-70F A29L320A
Contextual Info: A29L320A Series 4M X 8 Bit / 2M X 16 Bit CMOS 3.0 Volt-only, Boot Sector Flash Memory Document Title 4M X 8 Bit / 2M X 16 Bit CMOS 3.0 Volt-only, Boot Sector Flash Memory Revision History Rev. No. History Issue Date Remark 0.0 Initial issue April 12, 2006

A82DL1632TG-70UF

Abstract: DL1632
Contextual Info: A82DL16x2T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit

A82DL1632TG-70UF

Abstract: A82DL1632UG-70UF
Contextual Info: A82DL16x2T U Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Preliminary Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit

Contextual Info: SST39LF010/020/040 and SST39VF010/020/040 45 ns and B3KE EOL Supplemental Information EOL Data Sheet Description The SST39LF010, SST39LF020, SST39LF040 and SST39VF010, SST39VF020, SST39VF040 are 128K x8, 256K x8 and 5124K x8 CMOS Multi-Purpose Flash MPF manufactured with SST’s proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The

IC61LV6416-12T

Contextual Info: IC61LV6416 Document Title 64K x 16 Hight Speed SRAM with 3.3V 1 Revision History Revision No History Draft Date Remark 0A Initial Draft September 12,2001 2 3 4 5 6 7 8 9 10 11 12 The attached datasheets are provided by ICSI. Integrated Circuit Solution Inc reserve the right to change the specifications and

Contextual Info: IS61LV6416 64K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY FEATURES • High-speed access time: 8, 10, 12, and 15 ns • CMOS low power operation — 250 mW typical operating — 250 µW (typical) standby • TTL compatible interface levels • Single 3.3V power supply

IS61LV25616-12T

Contextual Info: IS61LV25616 256K x 16 HIGH SPEED ASYNCHRONOUS CMOS STATIC RAM WITH 3.3V SUPPLY FEATURES • • • • • High-speed access time: 8, 10, 12, and 15 ns CMOS low power operation TTL compatible interface levels Single 3.3V ± 10% power supply Fully static operation: no clock or refresh

jedec package TFBGA 12

Contextual Info: IS61LV12816 128K x 16 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY FEATURES • • • • • High-speed access time: 8, 10, 12, and 15 ns CMOS low power operation TTL and CMOS compatible interface levels Single 3.3V + 10%power supply Fully static operation: no clock or refresh

MIL-STD-750C

Abstract: SN 102 lcd tfbga TSOP 113 g EE-13 EE13 psi-celp JC11 C7021 ED-4701
Contextual Info: パッケージ動向 1-1 パッケージ実装動向 電子機器ニーズ 性能・外形・実装性の最適設計 多機能 性 高速 能 高出力 小形 外 薄形 形 軽量 実 自動化 装 システム化 性 高密度化 実装動向 パッケージ動向

A29L320AUV-70UF

Abstract: A29L320ATV-70UF A29L320ATG-70UF A29L320A A29L320ATV-70IF 29L160 0A8000
Contextual Info: A29L320A Series 4M X 8 Bit / 2M X 16 Bit CMOS 3.0 Volt-only, Boot Sector Flash Memory Document Title 4M X 8 Bit / 2M X 16 Bit CMOS 3.0 Volt-only, Boot Sector Flash Memory Revision History Rev. No. History Issue Date Remark 0.0 Initial issue April 12, 2006

Contextual Info: 2 Mbit / 4 Mbit / 8 Mbit x16 Multi-Purpose Flash SST39LF200A / SST39LF400A / SST39LF800A SST39VF200A / SST39VF400A / SST39VF800A SST39LF/VF200A / 400A / 800A3.0 & 2.7V 2Mb / 4Mb / 8Mb (x16) MPF memories Data Sheet FEATURES: • Organized as 128K x16 / 256K x16 / 512K x16

marking dh10

Abstract: transistor DB15 DH11 DH17 DH19 ICS83841 tfBGA PACKAGE thermal resistance DA5 marking MARKING A7 transistor MARKING DA3
Contextual Info: ICS83841 Integrated Circuit Systems, Inc. 20 BIT, DDR SDRAM 2:1 MUX GENERAL DESCRIPTION FEATURES The ICS83841 is a 20 Bit, DDR SDRAM 2:1 MUX and is a member of the HiPerClockS family of HiPerClockS™ High Performance Clock Solutions from ICS. The device has 20 host lines and each host line can

JESD51-9

Abstract: VFBGA package tray AN 7823 JESD51-2 vFBGA* 96 bALL WFBGA lfbga Encapsulation thermal resistance TRAY 15X15 tfBGA PACKAGE thermal resistance tray vfbga
Contextual Info: FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.40mm LFBGA , 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness • Laminate substrate based package which enables 2 and 4 layers of

800A

Contextual Info: 2 Mbit / 4 Mbit / 8 Mbit x16 Multi-Purpose Flash SST39LF200A / SST39LF400A / SST39LF800A SST39VF200A / SST39VF400A / SST39VF800A Preliminary Specifications FEATURES: • Organized as 128K x16 / 256K x16 / 512K x16 • Single Voltage Read and Write Operations

sdram schematic diagram

Abstract: CBTV4010 ICS252 ICS3840ALF ICS650-40A ICS83840 ICS83840AH ICS83840AHLF ICS83840AHLFT ICS83840AHT
Contextual Info: DATA SHEET ICS83840 ICS83840 Integrated DDR SDRAM MUX Circuit DDR SDRAM MUX Systems, Inc. GENERAL DESCRIPTION FEATURES The ICS83840 is a DDR SDRAM MUX and is a member of the HiPerClock S family of High HiPerClockS™ Performance Clock Solutions from ICS. The

Contextual Info: IC62LV51216L IC62LV51216LL Document Title 512 K x 16 bit Low Voltage and Ultra Low Power CMOS Static RAM Revision History Revision No History Draft Date 0A 0B Initial Draft January 3,2002 1. Add CE2 pin for 48 pin TF-BGA September 2,2002 2. Change for ICC: 35 mA to 30 mA for 55 ns Industrial product

Contextual Info: PI2DDR3212 1.35V/ 1.5V/1.8V 14 bit 2:1 DDR3/DDR4 Switch Features Description ÎÎ14 bit 2:1 switch that supports DDR3 800 2133Mbps, DDR4 This 14-bit DDR3/DDR4 switch is designed for 1.35V/ 1.5V/ 1.8V supply voltage, POD_12, SSTL_135, SSTL_15 or SSTL_18 signaling and CMOS select input signals. It is designed for

Contextual Info: Package Dimensions TFBGA 48 Chrontel Package Dimensions BOTTOM VIEW TOP VIEW A1 CORNER 0.08 M C 0.15 M C A B A1 CORNER 0.25 0.35 48X 6 5 4 3 2 1 1 2 3 4 5 6 A B C D E F G H A B C D E F G H D A C 0.20 C F 0.10 C E J I H B 0.15(4X) C G 48 Pin TFBGA Package