JEDEC MS-013 AB Search Results

MS-013

Abstract: WOMC
Contextual Info: Vishay Thin Film Molded, 50 Mil Pitch, Dual In-Line Resistor Networks, Wide Body FEATURES • Lead Pb -free available • Standard 16 and 20 Pin Counts (0.300" Wide Body) JEDEC MS-013 • Rugged, molded case construction • High stable thin film element

MS-013

Abstract: WOMC
Contextual Info: Vishay Thin Film Molded, 50 Mil Pitch, Dual In-Line Resistor Networks, Wide Body FEATURES • Lead Pb -free available • Standard 16 and 20 Pin Counts (0.300" Wide Body) JEDEC MS-013 • Rugged, molded case construction • High stable thin film element

MS-013

Contextual Info: WOMC Vishay Thin Film Molded, 50 mil Pitch, Dual In-Line Resistor, Wide Body, Surface Mount Network FEATURES • Standard 16 pins and 20 pins counts 0.300" wide body JEDEC MS-013 variation AA and AC • Rugged, molded case construction • High stable thin film element ratio stability

jedec ms-013 ab

Abstract: MS-013-AB
Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M18.3 (JEDEC MS-013-AB ISSUE C) N INDEX AREA 18 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M

MS-013-AE

Abstract: 28 MS-013 Package
Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- h x 45o A D -C- e

jedec ms-013 ad

Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M24.3 (JEDEC MS-013-AD ISSUE C) N INDEX AREA 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1

Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- A D h x 45o a e A1

MS-013-AC

Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M

MS-013-AA

Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.3 (JEDEC MS-013-AA ISSUE C) N INDEX AREA 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M

Mlx16

Abstract: Regulated Power Supply abstract MLX4/16 pdf/MLX16
Contextual Info: MLX81100 LIN Slave for FET Control Features CPU o o MelexCM CPU o Dual RISC CPU MLX4/16 – 5MIPS o 4-bit LIN protocol controller o 16-bit application CPU Internal RC-Oscillator Memories o o 2kbyte RAM, 32kbyte Flash, 128 byte EEPROM Flash for series production

Contextual Info: -Ï V U A >: a •''< S2A - S2M Features • Easy pick and place. • Low forward Voltage Drop. • High Current Capability. SMB/DO-214AA • High Surge Current Capability. C O LO R BAND D EN O TES C ATHO DE 1.5 Ampere Glass Passivated Rectifiers Absolute Maximum Ratings*

Contextual Info: S E M IC O N D U C T O R tm S3A - S3M Features • Low profile package. • Glass passivated junction. SMC/DO-214AB 3.0 Ampere General Purpose Rectifiers Absolute Maximum RâtinÇjS Symbol T a = 2 5°C unless o th e rw ise noted Parameter Value Units 3.0 A

J 3305-1

Abstract: T-108 T108 at-108
Contextual Info: Voltage Variable Absorptive Attenuator. 40 dB 0.5-2 GHZ ^July '93 AT-108 Features SO-8 • Single Positive Voltage Control • 40 dB Attenuation Range at 0.9 G H z "« .2284-,2440 n s o 'io m <5'80-6-20 hot • ±2 dB Linearity from B.S.L. • Low DC Power Consumption

Contextual Info: CS290/291 CS290/291 Ignition Controller Features Description The CS290/291 are integrated circuits to be used in the automotive ignition system. The application diagram shown below highlights the CS290. The CS291 is identical with the differential input replaced

p525

Abstract: 2N4398 2N6124 OM7662SC OM7663SC OM7664SC
Contextual Info: OM7662SC OM7663SC OM7664SC ISOLATED HERMETIC TO-258AA FIXED POSITIVE VOLTAGE REGULATORS Three Term inal, Fixed Positive Voltage, 3.0 Am p Precision Positive Regulator In Herm etic JED EC TO -258AA Package FEATURES • • • • • • Isolated Hermetic Package. JEDEC TO-258AA Outline

MLX81150

Abstract: transistor smd code marking KEY marking code E2 p SMD Transistor ISO-7637-2 pulse 5 high voltage adc QFN32 pad SMD TRANSISTOR MARKING 3B 12v 4-pin DC MOTOR SPEED CONtrol ic 7637-2 pulse 1 jedec MS-026 ABA
Contextual Info: MLX81150 LIN-Slave for relay and DC motor control Features Microcontroller: MLX16x8 RISC CPU o o o 16 bit RISC-CPU Co-processor for fast multiplication and division In-circuit debug and emulation Memories o o o 32 kByte Flash with ECC 2 kByte RAM 384 Byte EEPROM with ECC for customer purpose

Contextual Info: PI6C2409-1H Zero-Delay Clock Bufer Description Features • • • • • • The PI6C2409-1H is a PLL based, zero-delay buffer, with the ability to distribute nine outputs of up to 133 MHz at 3.3V. All the outputs are distributed from a single clock input CLKIN and

Contextual Info: PI6C2409-1H Zero-Delay Clock Buffer Description Features • • • • • • The PI6C2409-1H is a PLL based, zero-delay buffer, with the ability to distribute nine outputs of up to 133 MHz at 3.3V. All the outputs are distributed from a single clock input CLKIN and

Contextual Info: ACT-SF128K16 High Speed 128Kx16 SRAM/FLASH Multichip Module AEROFLEX CIRCUIT TECHNOLOGY www.aeroflex.com FEATURES • 2 - 128K x 8 SRAMs & 2 - 128K x 8 Flash Die in One MCM ■ Access Times of 25ns SRAM and 60ns (Flash) o r 35ns (SRAM) and 70 or 90ns (Flash)

39F1

Contextual Info: il il il il il il il il M ACT-SF512K16 High Speed 5“I2!Kx16 SRAM/FLASH Multichip Me C u le . Q er o flex CIRCUIT TECHNOLOGY www.aeroflex.com FEATURES • 2 - 512K x 8 SRAMs & 2 - 512K x 8 Flash Die in One MCM

Contextual Info: — — — I— I— I— I— I— I— I— I— I— I— I— I— I— I— I— I— I— — I ACT-SF2816 High Speed I 128Kx16 SRAM / 512Kx16 FLASH Multichio Module Q er o flex CIRCUIT TECHNOLOGY www.aeroflex.com FEATURES • 2 - 128K x 8 SRAMs & 2 - 512K x 8 Flash Die in

PS8613

Contextual Info: PI6C2409-1 Zero-Delay Clock Buffer Description Features • • • • • • The PI6C2409-1 is a PLL based, zero-delay buffer, with the ability to distribute nine outputs of up to 133 MHz at 3.3V. All the outputs are distributed from a single clock input CLKIN and

ft28c16

Abstract: 24P6
Contextual Info: Features • Fast Read Access Time - 150 ns • Fast Byte Write - 200 µs or 1 ms • Self-Timed Byte Write Cycle • • • • • • • – Internal Address and Data Latches – Internal Control Timer – Automatic Clear Before Write Direct Microprocessor Control

Contextual Info: PI6C2409-1 Zero-Delay Clock Bufer Description Features • • • • • • The PI6C2409-1 is a PLL based, zero-delay buffer, with the ability to distribute nine outputs of up to 133 MHz at 3.3V. All the outputs are distributed from a single clock input CLKIN and