JEDEC HAST Search Results

AEC-Q100-004

Abstract: JESD22-A113 HDJD-J822
Contextual Info: HDJD-J822 Color Management System Feedback Controller Data Sheet Description Failure Rate Prediction The following cumulative test results have been obtained from testing performed at Avago Technologies in accordance with the latest revision of JEDEC. Avago

KM23V32205

Contextual Info: Preliminary Synch. MROM KM23SV32205T 1M x32 Synchronous MASKROM FEATURES GENERAL DESCRIPTION • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Switchable organization 2,097,152 x 16 word mode / 1,048,576 x 32(double word mode)

Contextual Info: CY7C1331 CY7C1332 ADVANCED INFORMATION 64K x 18 Synchronous Cache 3.3 V RAM Direct interface with the processor and external cache controller Asynchronous output enable JEDEC-standard pinout 52-pin PLCC and PQFP packaging Features • Supports 66-MHz Pentium proces­

jesd 51-7

Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Contextual Info: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs

Contextual Info: THS1408-EP 14-BIT, 3/8 MSPS DSP-COMPATIBLE ANALOG-TO-DIGITAL CONVERTER WITH INTERNAL REFERENCE AND PGA SGLS129B − JULY 2002 − REVISED FEBRUARY 2010 Features D Controlled Baseline D D D D D D D Component qualification in accordance with JEDEC and industry

Contextual Info: THS1408-EP 14-BIT, 3/8 MSPS DSP-COMPATIBLE ANALOG-TO-DIGITAL CONVERTER WITH INTERNAL REFERENCE AND PGA SGLS129B − JULY 2002 − REVISED FEBRUARY 2010 Features D Controlled Baseline D D D D D D D Component qualification in accordance with JEDEC and industry

Contextual Info: THS1408-EP 14-BIT, 3/8 MSPS DSP-COMPATIBLE ANALOG-TO-DIGITAL CONVERTER WITH INTERNAL REFERENCE AND PGA SGLS129B − JULY 2002 − REVISED FEBRUARY 2010 Features D Controlled Baseline D D D D D D D Component qualification in accordance with JEDEC and industry

Contextual Info: THS1408-EP 14-BIT, 3/8 MSPS DSP-COMPATIBLE ANALOG-TO-DIGITAL CONVERTER WITH INTERNAL REFERENCE AND PGA SGLS129B − JULY 2002 − REVISED FEBRUARY 2010 Features D Controlled Baseline D D D D D D D Component qualification in accordance with JEDEC and industry

LV 1084 73

Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
Contextual Info: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA

56QN50T18080

Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Contextual Info: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages

48 ball VFBGA

Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
Contextual Info: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated

Contextual Info: TL16C752B-EP www.ti.com SGLS153B – FEBRUARY 2003 – REVISED DECEMBER 2007 3.3 V DUAL UART WITH 64-BYTE FIFO Check for Samples: TL16C752B-EP FEATURES 1 • • • • • • • • • • • • • • • • 1 Component qualification in accordance with JEDEC and

Contextual Info: TL16C752B-EP www.ti.com SGLS153B – FEBRUARY 2003 – REVISED DECEMBER 2007 3.3 V DUAL UART WITH 64-BYTE FIFO Check for Samples: TL16C752B-EP FEATURES 1 • • • • • • • • • • • • • • • • 1 Component qualification in accordance with JEDEC and

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Abstract: 2SA1194
Contextual Info: HITACHI 2SA1194 SILICO N PNP EP ITAXIAL 1 1 ¡S o 12 HIGH GAIN AM PLIFIER 1. Em itter 2. C o li m a r V Hast D im ensions in m m (JEDEC TO-126 MOD.) M AXIM UM C O LLEC TO R DISSIPATION CURVE ABSO LU TE M AXIM UM RATING S (Ta=25°C) Item Symbol 2 S A I19 4 ®

lathes

Abstract: ST16C2550 TL16C752B TL16C752B-EP TL16C752BLPTREP TL16C752BTPTREP MCR-3
Contextual Info: TL16C752B-EP 3.3 V DUAL UART WITH 64-BYTE FIFO www.ti.com SGLS153B – FEBRUARY 2003 – REVISED DECEMBER 2007 FEATURES 1 • • • • • • • • • • • • • • • • 1 Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an

TLV3701-EP

Contextual Info: TLV3701ĆEP SGLS170 − JUNE 2003 NANOPOWER PUSHĆPULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly

TLV3701-EP

Contextual Info: TLV3701-EP SGLS170 – JUNE 2003 NANOPOWER PUSH-PULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly

SLOU060

Abstract: TLV3701-EP
Contextual Info: TLV3701-EP SGLS170 – JUNE 2003 NANOPOWER PUSH-PULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly

TLV3701-EP

Contextual Info: TLV3701-EP SGLS170 – JUNE 2003 NANOPOWER PUSH-PULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly

TLV3701-EP

Contextual Info: TLV3701ĆEP SGLS170 − JUNE 2003 NANOPOWER PUSHĆPULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly

RX2 pin DIAGRAM

Contextual Info: TL16C752B-EP 3.3-V DUAL UART WITH 64-BYTE FIFO www.ti.com SGLS153A – FEBRUARY 2003 – REVISED MARCH 2007 FEATURES • • • • • • • • • • • • • • • • 1 Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an

TLV3701-EP

Contextual Info: TLV3701-EP SGLS170 – JUNE 2003 NANOPOWER PUSH-PULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly

Contextual Info: TL16C752B-EP 3.3 V DUAL UART WITH 64-BYTE FIFO www.ti.com SGLS153B – FEBRUARY 2003 – REVISED DECEMBER 2007 FEATURES 1 • • • • • • • • • • • • • • • • 1 Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an

TLV3701-EP

Contextual Info: TLV3701-EP SGLS170 – JUNE 2003 NANOPOWER PUSH-PULL OUTPUT COMPARATOR FEATURES D Controlled Baseline D D D D D D D D D D † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly