J-LEAD, QFP Search Results

camtex trays

Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

Contextual Info: P re lim in a ry 32 + 22 Channel Matrix Printhead Driver Ordering Information Package Options Device 68 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack Die 68 J - Lead Ceramic Quad Flatpack MIL-STD-883 Processed* HV33 HV3304DJ HV3304PJ HV3304X

Contextual Info: yjj S u p er t e x inc. Preliminary 32 + 22 Channel Matrix Printhead Driver Ordering Information Package Options Device 68 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack Die 68 J - Lead Ceramic Quad Flatpack MIL-STD-883 Processed* HV33

Contextual Info: SUPERTEX 3SE D INC • 07732=15 Q D G 2 5 G 0 1 B I S T X Preliminary ~T-5f~/5 32 + 22 Channel Matrix Printhead Driver Ordering Information Package Options * Device 68 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack Die 68 J - Lead Ceramic Quad Flatpack

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

Contextual Info: HV45 Oì Supertex inc. HV46 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information_ Package Options Device Recommended Operating VppMax 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad

Contextual Info: HV4522 HV4622 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information Package Options Device Recommended Operating VPP Max 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier 44 Quad Plastic Gullwing

HV4622

Abstract: HV4522 HV4522DJ HV4522PG HV4522PJ HV4522X HV4622DJ HV4622PG HV4622PJ HV4622X
Contextual Info: HV4522 HV4622 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information Package Options Device Recommended Operating VPP Max 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier 44 Quad Plastic Gullwing

HV4522

Abstract: HV4522DJ HV4522PJ HV4530 HV4530DJ HV4622 HV4622DJ HV4630 HV4630DJ push pull converter 300V
Contextual Info: HV4522/HV4530 HV4622/HV4630 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information * Package Options Device Recommended Operating VPP Max 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier 44 Quad Plastic

HV-45

Abstract: push pull converter 300V
Contextual Info: HV45 Mi Supertex inc. HV46 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information Package Options Device Recommended Operating Vpp Max 44 J-Lead Quad Ceramic Chip Carrier HV45 -300 -220 -300 HV46 -220 44 J-Lead Quad

HV46

Abstract: HV-45 push pull converter 300V HV4522DJ HV4522PJ HV4530DJ HV4530PG HV4530PJ HV4622DJ HV4622PJ
Contextual Info: HV45 HV46 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information Package Options Device Recommended Operating VPP Max 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier 44 Quad Plastic Gullwing Die

HV4522

Abstract: HV4522DJ HV4522PJ HV4530 HV4530DJ HV4622 HV4622DJ HV4630 HV4630DJ push pull converter 300V
Contextual Info: HV4522/HV4530 HV4622/HV4630 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information Package Options Device Recommended Operating VPP Max 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier 44 Quad Plastic

push pull converter 300V

Contextual Info: BACK HV4522/HV4530 HV4622/HV4630 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information Package Options Device Recommended Operating VPP Max 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier 44 Quad Plastic

Contextual Info: ^ S u p e r t e x HV45 HV46 i n c . 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information Device Recommended Operating Vpp Max HV45 HV46 _ Package Options 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad

HV4530

Contextual Info: S u p e r te x in c H V 4522/H V 4530 H V 4622/H V 4630 . 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information Package Options Device Recommended Operating V pp Max 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad

Contextual Info: CM O d E H-J K 0.50m m / mm K 25.35 28 . 1 0 '27.90' CN O © d E H-J K 0.50m m / mm H - J 31 . 4 5 30.95 0.02© © F R E E S C A L E SEMICONDUCTOR, ALL R I GH TS RESERVED. TITLEi 160 LEAD (08 INC. QFP F H-J K MECHANICAL POWER X 08 X 0.00 0 . 6 0 0 PI0CH

Contextual Info: ORDERING INFORMATION ORDERING INFORMATION FORMAT: W 241024A : K - 15 i L Low Power . Access Time -• Package ! Package Index: Blank: Plastic DIP K: Skinny DIP S: SOP Small Outline Package J: SOJ (Small Outline J Lead)

A4050

Contextual Info: 1C 234 SERIES qfp •Applicable 1C Dimensions A J FEATURES • Open top type sockets for QFP packages having a flat area shoulder at the side for lead contacts. • Protect the 1C lead solder area from foreign material. • Universal socket, accept both short and long 1C leads.

Contextual Info: ^ Supertexinc. HV65 32-Channel LCD Driver with Separate Backplane Output Ordering Information Package Options Device 44-J Lead Quad Plastic Chip Carrier HV65 HV6506PJ 44 Lead Quad Plastic Gullwing Dice in waffle pack HV6506PG HV6506X Features General Description

HV66

Abstract: HV66PG HV66PJ HV66X A03160
Contextual Info: HV66 32-Channel LCD Driver with Separate Backplane Output Ordering Information Package Options Device 44 Lead Quad Plastic Gullwing HV66 HV66PG 44 J-Lead Quad Plastic Chip Carrier HV66PJ HV66X Features General Description Processed with HVCMOS¨ technology

HV66

Abstract: HV66PG HV66PJ HV66X
Contextual Info: HV66 32-Channel LCD Driver with Separate Backplane Output Ordering Information Package Options Device 44 Lead Quad Plastic Gullwing HV66 HV66PG 44 J-Lead Quad Plastic Chip Carrier HV66PJ HV66X Features General Description Processed with HVCMOS¨ technology

4572 smd 8pin

Abstract: 100 PIN "PGA" ALTERA DIMENSION CMGA17-P100E 02D-00194 altera 24pin dip drawing
Contextual Info: Altera Device Package Outlines March 1995, ver. 5 In tro d u c tio n Data Sheet This data sheet provides package outlines for all Altera devices. Package outlines are listed here in ascending pin count order. Table 1 summarizes the maximum lead coplanarity for Altera J-lead and QFP packages:

Contextual Info: HV65 32-Channel LCD Driver with Separate Backplane Output Ordering Information Package Options Device 44-J Lead Quad Plastic Chip Carrier HV65 44 Lead Quad Plastic Gullwing H V 6506P J H V 6506P G P rocessed w ith HVCM OS te ch n o lo g y □ 32 push-pull C M O S o u tp u t up to 60V