J-LEAD, PLCC Search Results

wsa1w

Abstract: MCS251 80C251SB16 80C251SQ16 83C251SA16 83C251SB16 83C251SP16 83C251SQ16 87C251SA16 87C251SB16
Contextual Info: 8XC251SA/SB/SP/SQ HIGH-PERFORMANCE CHMOS MICROCONTROLLER Commercial/Express J J J J J J J J Real Time and Programmed Wait State Bus Operation Binary-code Compatible with MCS 51 Pin Compatible with 44-lead PLCC and 40-lead PDIP MCS 51 Sockets ® Register-based MCS 251 Architecture

HV70

Abstract: HV7022-C HV7022DJ-C HV7022PJ-C HV7022X-C M0-112 RBHV7022DJ-C A03160
Contextual Info: HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022DJ-C HV7022PJ-C

camtex trays

Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

HV5522

Abstract: HV5522DJ HV5522PJ HV5530 HV5530DJ HV5622 HV5622DJ HV5630 HV5630DJ HV5522PG
Contextual Info: HV5522/HV5530 HV5622/HV5630 32-Channel Serial To Parallel Converter With Open Drain Outputs Ordering Information Package Options Device Recommended Operating VPP max 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier 44 Lead Quad Plastic Gullwing

44 pin jlcc socket

Abstract: QILE-84P-410T LCS-68 821575-1 84P-410T
Contextual Info: Selecting Sockets for J-Lead Packages A pplication Brief 46 M arch 1995, ver. 5 Introduction Altera offers ceramic and plastic J-lead chip carrier packages JLCC and PLCC for many devices to reduce the "real estate" demands of a system. These small packages are generally intended for surface mounting.

Contextual Info: HV4522 HV4622 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information Package Options Device Recommended Operating VPP Max 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier 44 Quad Plastic Gullwing

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

plcc socket

Contextual Info: Carrier Adaptor CA : 68 position PLCC production socket to 68 position PLCC J leaded SM foot. 2 pc. adaptor. 1.175" 1.172" 0.503" 0.833"Assembled 0.899" -J (surface-mountable J leaded foot) option Substrate: FR4/G10, 0.0625"±0.007" thick. PLCC Socket Pins: Phosphor Bronze, finish: 150 µ" Tin/lead (93/7) over 40µ" Nickel

EME-G700LX

Abstract: eme-g700l Q14939 6600CGL
Contextual Info: 28 Plastic Leaded Chip Carrier PLCC Lead Frame, Mold Compound & Die Attach Change Product Change Notice PCN1007 (v1.0) October 01, 2010 Overview This notice describes the changes to the 28 J-Lead PLCC Package for the ARINC 429 family of devices. Description

PLCC52

Abstract: ADAPTOR PLCC52 CA-PLCC52-D-J-01 CA-PLCC052-D-J plcc 52 SOCKET
Contextual Info: Carrier Adaptor CA : 52 position PLCC Production socket with test points to 52 position PLCC J leaded SM foot. 2 pc. adaptor. 1.170" 0.503" 0.833"Assembled 0.899" -J (Surface-mountable j leaded foot) option Substrate: FR4/G10, 0.0625"±0.007" thick. PLCC Socket Pins: Phosphor Bronze, finish: 150 µ" Tin/lead (93/7) over 40µ" Nickel

Contextual Info: PLASTIC LEADED CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index LCC-20P-M02 20-pin plastic QFJ PLCC Lead pitch 50 mil Package width x package length 353 × 353 mil Lead shape J bend Sealing method Plastic mold

QFJ084-P-S115-2

Abstract: c84052s LCC84
Contextual Info: PLASTIC LEADED CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 84 PIN PLASTIC LCC-84P-M02 EIAJ code :∗QFJ084-P-S115-2 84-pin plastic QFJ PLCC Lead pitch 50 mil Package width x package length 1153 × 1153 mil Lead shape J bend Sealing method Plastic mold

Contextual Info: ORDERING INFORMATION ORDERING INFORMATION FORMAT: W 241024A : K - 15 i L Low Power . Access Time -• Package ! Package Index: Blank: Plastic DIP K: Skinny DIP S: SOP Small Outline Package J: SOJ (Small Outline J Lead)

QFJ068-P-S953-2

Contextual Info: PLASTIC LEADED CHIP CARRIER 68 PIN PLASTIC LCC-68P-M02 EIAJ code : ∗QFJ068-P-S953-2 Lead pitch 50mil Package width x package length 953 × 953mil Lead shape J bend Sealing method Plastic mold 68-pin plastic QFJ PLCC (LCC-68P-M02) 68-pin plastic QFJ (PLCC)

331 transistor

Abstract: 331 DATASHEET C 331 Transistor transistor 331 8 transistor C 331
Contextual Info: PLASTIC LEADED CHIP CARRIER 20 PIN PLASTIC LCC-20P-M02 Lead pitch 50mil Package width x package length 353 × 353mil Lead shape J bend Sealing method Plastic mold 20-pin plastic QFJ PLCC (LCC-20P-M02) 20-pin plastic QFJ (PLCC) (LCC-20P-M02) +0.22 4.30 –0.11

QFJ018-P-R285-4

Contextual Info: PLASTIC LEADED CHIP CARRIER 18 PIN PLASTIC LCC-18P-M04 EIAJ code : ∗QFJ018-P-R285-4 Lead pitch 50mil Package width x package length 285 × 490mil Lead shape J bend Sealing method Plastic mold 18-pin plastic QFJ PLCC (LCC-18P-M04) 18-pin plastic QFJ (PLCC)

QFJ084-P-S115-2

Abstract: 84-p 84-PIN LCC-84P-M02
Contextual Info: PLASTIC LEADED CHIP CARRIER 84 PIN PLASTIC LCC-84P-M02 EIAJ code : ∗QFJ084-P-S115-2 Lead pitch 50mil Package width x package length 1153 × 1153mil Lead shape J bend Sealing method Plastic mold 84-pin plastic QFJ PLCC (LCC-84P-M02) 84-pin plastic QFJ (PLCC)

LCC 18 Pin Package

Abstract: QFJ018-P-R285-3
Contextual Info: PLASTIC LEADED CHIP CARRIER 18 PIN PLASTIC LCC-18P-M03 EIAJ code : ∗QFJ018-P-R285-3 Lead pitch 50mil Package width x package length 285 × 425mil Lead shape J bend Sealing method Plastic mold 18-pin plastic QFJ PLCC (LCC-18P-M03) 18-pin plastic QFJ (PLCC)

QFJ022-P-R285-2

Contextual Info: PLASTIC LEADED CHIP CARRIER 22 PIN PLASTIC LCC-22P-M02 EIAJ code : ∗QFJ022-P-R285-2 Lead pitch 50mil Package width x package length 285 × 490mil Lead shape J bend Sealing method Plastic mold 22-pin plastic QFJ PLCC (LCC-22P-M02) 22-pin plastic QFJ (PLCC)

QFJ068-P-S953-2

Abstract: LCC-68P-M02
Contextual Info: PLASTIC LEADED CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN PLASTIC LCC-68P-M02 EIAJ code :∗QFJ068-P-S953-2 68-pin plastic QFJ PLCC Lead pitch 50 mil Package width x package length 953 × 953 mil Lead shape J bend Sealing method Plastic mold (LCC-68P-M02)

QFJ044-P-S653-2

Contextual Info: PLASTIC LEADED CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC LCC-44P-M02 EIAJ code :∗QFJ044-P-S653-2 44-pin plastic QFJ PLCC Lead pitch 50 mil Package width x package length 653 × 653 mil Lead shape J bend Sealing method Plastic mold (LCC-44P-M02)

diode s453

Abstract: LCC-28P-M03 QFJ028-P-S453-2
Contextual Info: PLASTIC LEADED CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC LCC-28P-M03 EIAJ code :∗QFJ028-P-S453-2 28-pin plastic QFJ PLCC Lead pitch 50 mil Package width x package length 453 × 453 mil Lead shape J bend Sealing method Plastic mold (LCC-28P-M03)

LCC 18 Pin Package

Abstract: QFJ044-P-S653-2
Contextual Info: PLASTIC LEADED CHIP CARRIER 44 PIN PLASTIC LCC-44P-M02 EIAJ code : ∗QFJ044-P-S653-2 Lead pitch 50mil Package width x package length 653 × 653mil Lead shape J bend Sealing method Plastic mold 44-pin plastic QFJ PLCC (LCC-44P-M02) 44-pin plastic QFJ (PLCC)