IS 1632 N Search Results

Contextual Info: Thin Film Chip Attenuators PAT Series ^ 1.0 Application These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is Ideal for low noise, inductance and parasitic capacitance applications.

Contextual Info: PAT series, RAT series, high-precision chip attenuators These 3042, 1632, 1220, 1010 and 0510 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications.

EP1W

Abstract: PAT1220 PAT3042
Contextual Info: PAT series, RAT series, high-precision chip attenuators These 3042, 1632, 1220, 1010 and 0510 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications.

Contextual Info: PAT series, RAT series, high-precision chip attenuators These 3042, 1632, 1220, 1010 and 0510 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications.

PAT1220

Abstract: PAT0510S
Contextual Info: PAT series, RAT series, high-precision chip attenuators These 3042, 1632, 1220, 1010 and 0510 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications.

Contextual Info: PAT series, RAT series, high-precision chip attenuators These 3042, 1632, 1220, 1010 and 0510 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications.

PAT1220

Abstract: PAT1632 PAT0510 PAT0510S RAT1010X
Contextual Info: PAT series, RAT series, high-precision chip attenuators These 3042, 1632, 1220, 1010 and 0510 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications.

Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Application These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, inductance and parasitic capacitance applications. Thin film metallization provides for very stable characteristics over temperature and time.

RFH25P10

Abstract: RFH25P08 rfh25p
Contextual Info: Standard Power MOSFETs . RFH25P08, RFH25P10 File N u m be r 1632 Power MOS Field-Effect Transistors P-Channel Enhancement-Mode Power Field-Effect Transistors terminal diagram 25 A, -80 V - -100 V fD SIo n l = 0.15 Ci Features: • SOA is power-dissipation lim ited

Contextual Info: Thin Film Chip Attenuator PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

Contextual Info: Thin Film Chip Attenuator PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

Contextual Info: Thin Film Chip Attenuator PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

is 1632 n

Abstract: H1632C 010DB
Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

Contextual Info: Thin Film Chip Attenuators PAT Series 6 dB 1.0 Description H 2.0 Mechanical H H H These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metallization provides for very stable characteristics over temperature and time.

Contextual Info: DWG. NO. DO NOT SCALE DRAWING S D -5 4 6 1 3 -0 0 3 fet34NO. DRWN: CH'Ks APPR: CO m o o feB3NO. DRWN: CH'Ks APPR: it i fet32NO. DRWN: IS M CH'Ks APPR: > 4 W R EV ISED fesi no.JD 2 0 0 I - 1632 DRWN: S.HOSHIKAWA '01/05/31 ch 'K s A.NODA APPR: HoIKESUGI go vim

Contextual Info: Instruction Sheet 408- 1632 Terminal and Splice Crimping Die Assemblies 19 APR 11 Rev C Cumulative Trauma Disorders can result from the prolonged use of manually powered hand tools. Hand tools are intended for occasional use and low volume applications. A wide selection of powered application equipment for extended- use, production operations is available.

BGA256

Abstract: lpc1800 TBGA100 LQFP144 LPC1810 LPC1833 LPC1837 LPC1850 LQFP208 LPC1817
Contextual Info: NXP 150 MHz, 32-bit Cortex-M3 microcontrollers LPC1800 Fastest Cortex-M3 MCU, Largest SRAM, High Speed USB The LPC1800 series of low power, high-performance Cortex-M3 MCUs features frequencies up to 150 MHz and flexible Dual-Bank Flash for the highest reliability in-application re-programming.

BGA256

Contextual Info: NXP 204-MHz, 32-bit Cortex-M4/ Cortex-M0 MCU LPC4300 series Cortex-M4 MCUs with Cortex-M0 coprocessor, HS USB, and more Multiple cores and a unique set of configurable peripherals make it easy to develop advanced applications within a single architecture and development environment.

Contextual Info: NXP 204 MHz, 32-bit Cortex-M4 /Cortex-M0 DSC LPC4300 series First asymmetrical, dual-core digital signal controller featuring Cortex-M4 & Cortex-M0 A dual-core architecture and a unique set of configurable peripherals make it possible to develop DSP and MCU applications within a single architecture and development environment.

BGA180

Contextual Info: NXP 150 MHz, 32-bit Cortex-M4 /Cortex-M0 DSC LPC4300 series First asymmetrical, dual-core digital signal controller featuring Cortex-M4 & Cortex-M0 A dual-core architecture and a unique set of configurable peripherals make it possible to develop DSP and MCU applications within a single architecture and development environment.

CI 2272 AN

Contextual Info: SMART SM5643240UUN4GU Modular Technologies July 24, 1997 256MByte 32M x 64 DRAM Module - 16Mx4 based 168-pin DIMM, Non-Buffered Features Part Numbers • • • • • • • • • • • SM56432400UNUGU SM56432401UNUGU SM56432408UNUGU SM56432409UNUGU

4x0402

Abstract: capacitor rse 104
Contextual Info: Approval sheet Capacitor Arrays Series MULTILAYER CERAMIC CAPACITORS Capacitor Arrays Series 10V to 100V 4 x 0402, 4 x 0603 Size NP0, X7R & Y5V Dielectrics RoHS Compliance *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_ Cap_Arrays_005N_AS

PCF-W0805LF-03-XXXX-B-P-LT

Abstract: Cross Reference Venkel ERA6YEB102V RNC RESISTORS 1K32 resistors Cross Reference 10w Vishay Dale resistors SUSUMU UPTF0805-10W
Contextual Info: Cross Reference Guide Ultra Precision Thin Film Chip Resistors Venkel P/N UPTF0805-10W — P — XXXX A T Packaging T: Tape Series TCR P: o5PPM/nC N: o10PPM/nC E: o25PPM/nC Resistance Value Resistance Tolerance U: o0.01% A: o0.05% B: o0.1% C: o0.25% D: o0.5%