IS 1632 N Search Results
IS 1632 N Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| DS1632J-8/883 |
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DS1632 - Buffer/Inverter Based Peripheral Driver - Dual marked (5962-9052201PA) |
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| DS1632J-8/B |
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DS1632 - Dual Peripheral Driver |
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| 54122-116322000LF |
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch | |||
| RJMG163268101NR |
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RJMG, Input output Connectors, 1x1,10/100 with LEDs | |||
| 75844-116-32LF |
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BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 32 Positions, 2.54mm (0.100in) Pitch. |
IS 1632 N Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Thin Film Chip Attenuators PAT Series ^ 1.0 Application These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is Ideal for low noise, inductance and parasitic capacitance applications. |
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1-10dB | |
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Contextual Info: PAT series, RAT series, high-precision chip attenuators These 3042, 1632, 1220, 1010 and 0510 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. |
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PAT0510S, RAT1010X RAT1010X, PAT1220, PAT1632, PAT3042 PAT0816 PAT1220 PAT1632 PAT3042S | |
EP1W
Abstract: PAT1220 PAT3042
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PAT0510S, RAT1010X, PAT1220, PAT1632, PAT3042 RAT1010X PAT0510S 10GHz 100mW EP1W PAT1220 | |
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Contextual Info: PAT series, RAT series, high-precision chip attenuators These 3042, 1632, 1220, 1010 and 0510 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. |
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PAT0510S, RAT1010X RAT1010X, PAT1220, PAT1632, PAT3042 PAT0816 PAT1220 PAT1632 PAT3042S | |
PAT1220
Abstract: PAT0510S
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PAT0510S, RAT1010X PAT0510S PAT0816 100mW 125mW 100pcs/package 000pcs/reel PAT1220 PAT0510S | |
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Contextual Info: PAT series, RAT series, high-precision chip attenuators These 3042, 1632, 1220, 1010 and 0510 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. |
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PAT0510S, RAT1010X, PAT1220, PAT1632, PAT3042 RAT1010X PAT0510S 000pcs/reel 000pcs/reel PAT1220 | |
PAT1220
Abstract: PAT1632 PAT0510 PAT0510S RAT1010X
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PAT0510S, RAT1010X RAT1010X, PAT1220, PAT1632, PAT3042 PAT0816 PAT1220 PAT1632 PAT3042S PAT1220 PAT1632 PAT0510 PAT0510S RAT1010X | |
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Contextual Info: PAT series, RAT series, high-precision chip attenuators These 3042, 1632, 1220, 1010 and 0510 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. |
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PAT0510S, RAT1010X, PAT1220, PAT1632, PAT3042 RAT1010X PAT0510S 040mW 000pcs/reel 000pcs/reel | |
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Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Application These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, inductance and parasitic capacitance applications. Thin film metallization provides for very stable characteristics over temperature and time. |
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3042S | |
RFH25P10
Abstract: RFH25P08 rfh25p
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RFH25P08, RFH25P10 RFH25P08 RFH25P10* 92CS-37243 AN-7254 AN-7260. RFH25P10 92CS-37Z45 rfh25p | |
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Contextual Info: Thin Film Chip Attenuator PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time. |
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3042S 5000pcs/reel ISO9001 ISO14001 | |
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Contextual Info: Thin Film Chip Attenuator PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time. |
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3042S 5000pcs/reel ISO9001 ISO14001 | |
PAT1220Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metallization provides for very stable characteristics over temperature and time. |
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3042S 1-10dB, 0-10dB, 1-10dB PAT1220 | |
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Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time. |
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3042S 5000pcs/reel | |
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Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Application These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, inductance and parasitic capacitance applications. Thin film metallization provides for very stable characteristics over temperature and time. |
OCR Scan |
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Contextual Info: Thin Film Chip Attenuator PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time. |
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3042S 5000pcs/reel | |
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Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time. |
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3042S 5000pcs/reel | |
is 1632 n
Abstract: H1632C 010DB
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3042S 0-10dB, 5000pcs/reel 0-10dB is 1632 n H1632C 010DB | |
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Contextual Info: Thin Film Chip Attenuator PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time. |
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3042S 5000pcs/reel | |
DSA0017435Contextual Info: MNR04 Resistors Chip resistor networks MNR04 1005 x 4 size !Features 1) Extremely small and light Area ratio is 60% smaller than that of chip 1632 (MNR14), while weight ratio has been cut 75%. 2) High-density mounting Can be mounted even more densely than four 1005 chips (MCR01), and mounting costs are lower. |
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MNR04 MNR14) MCR01) ISO-9001. ET-7001 MNR02 MNR04 DSA0017435 | |
H1632CContextual Info: Thin Film Chip Attenuators PAT Series 6 dB 1.0 Description H 2.0 Mechanical H H H These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metallization provides for very stable characteristics over temperature and time. |
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3042S 0-10dB, 5000pcs/reel 0-10dB H1632C | |
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Contextual Info: Thin Film Chip Attenuators PAT Series 6 dB 1.0 Description H 2.0 Mechanical H H H These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metallization provides for very stable characteristics over temperature and time. |
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3042S 0-10dB, 5000pcs/reel 0-10dB | |
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Contextual Info: DWG. NO. DO NOT SCALE DRAWING S D -5 4 6 1 3 -0 0 3 fet34NO. DRWN: CH'Ks APPR: CO m o o feB3NO. DRWN: CH'Ks APPR: it i fet32NO. DRWN: IS M CH'Ks APPR: > 4 W R EV ISED fesi no.JD 2 0 0 I - 1632 DRWN: S.HOSHIKAWA '01/05/31 ch 'K s A.NODA APPR: HoIKESUGI go vim |
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fet34NO. fet32NO. fe00NO. EN-02JI097) MXJ-54 | |
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Contextual Info: Instruction Sheet 408- 1632 Terminal and Splice Crimping Die Assemblies 19 APR 11 Rev C Cumulative Trauma Disorders can result from the prolonged use of manually powered hand tools. Hand tools are intended for occasional use and low volume applications. A wide selection of powered application equipment for extended- use, production operations is available. |
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