IPC7525 LGA MATERIAL Search Results

IPC7525 LGA MATERIAL Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
UE62B46230S021		Amphenol Communications Solutions	1x4 OSFP cage with stainless steel material	PDF
UE62B46200S021		Amphenol Communications Solutions	1x4 OSFP cage with stainless steel material	PDF
CSD83325L		Texas Instruments	12V, N ch NexFET MOSFET™, dual LGA, 5.9mOhm 6-PICOSTAR
CSD87501L		Texas Instruments	30V, N ch NexFET MOSFET™, dual common drain LGA, 5.5mOhm 10-PICOSTAR
CSD25483F4		Texas Instruments	-20V, P ch NexFET MOSFET™, single LGA 0.6x1.0, 245mOhm 3-PICOSTAR -55 to 150

IPC7525 LGA MATERIAL Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
IPC-7527 Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT Contextual Info: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single	Original	101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT	PDF
LGA voiding Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux Contextual Info: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.	Original	101752C 01049A an100fc AN100-14 LGA voiding IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux	PDF
IPC-7527 Abstract: IPC-7525 koki solder paste IPC7527 Contextual Info: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single	Original	101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527	PDF
Contextual Info: Sample & Buy Product Folder Technical Documents Support & Community Tools & Software TPS82740A, TPS82740B SLVSCE3 – JUNE 2014 TM TPS82740x 360nA IQ MicroSIP Step Down Converter Module for Low Power Applications 1 Features • • • • • • • •	Original	TPS82740A, TPS82740B TPS82740x 360nA 100mV 200mA	PDF
Contextual Info: Sample & Buy Product Folder Technical Documents Support & Community Tools & Software TPS82740A, TPS82740B SLVSCE3 – JUNE 2014 TM TPS82740x 360nA IQ MicroSIP Step Down Converter Module for Low Power Applications 1 Features • • • • • • • •	Original	TPS82740A, TPS82740B TPS82740x 360nA 100mV 200mA	PDF
Contextual Info: Sample & Buy Product Folder Technical Documents Support & Community Tools & Software TPS82740A, TPS82740B SLVSCE3 – JUNE 2014 TM TPS82740x 360nA IQ MicroSIP Step Down Converter Module for Low Power Applications 1 Features • • • • • • • •	Original	TPS82740A, TPS82740B TPS82740x 360nA 100mV 200mA	PDF
Contextual Info: Sample & Buy Product Folder Technical Documents Support & Community Tools & Software TPS82740A, TPS82740B SLVSCE3A – JUNE 2014 – REVISED JUNE 2014 TPS82740x 360nA IQ MicroSIPTM Step Down Converter Module for Low Power Applications 1 Features • • •	Original	TPS82740A, TPS82740B TPS82740x 360nA 100mV 200mA	PDF