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    INTEL BGA PACKAGE TOP MARK Search Results

    INTEL BGA PACKAGE TOP MARK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH1R306PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    		Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    XPH2R106NC
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Datasheet

    INTEL BGA PACKAGE TOP MARK Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    M25P08

    Abstract: MD2800-D08 pmc flash pm49fl004t-33jc MD2810-D08 m25p04 SDTB-128 MD2811-D32-V3 M25P08-V-MN-6-T Sandisk TSOP EPROM databook am27c256 120
    Contextual Info: SST Base Memory Cross Reference Table Silicon Storage Technology, Inc. Density Voltage Organized as x8/ x16 SST AMD ST Microelectronics Atmel Intel Winbond Flash 512K 5V 8 SST39SF512; SST29EE512 AM28F512 M29F512 AT49F512, AT29C512 - W29EE512 1M 5V 8 SST39SF010; SST29EE010


    Original     		SST39SF512; SST29EE512 AM28F512 M29F512 AT49F512, AT29C512 W29EE512 SST39SF010; SST29EE010 AM29F010, M25P08 MD2800-D08 pmc flash pm49fl004t-33jc MD2810-D08 m25p04 SDTB-128 MD2811-D32-V3 M25P08-V-MN-6-T Sandisk TSOP EPROM databook am27c256 120 PDF

    heller 1700

    Abstract: BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse
    Contextual Info: APPLICATION NOTE Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide April 1998 Order Number: 243759-001 Mobile Pentium ® II Processor Mini-Cartridge 240-Pin BGA Connector Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		240-Pin heller 1700 BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse PDF

    strataflash 512 p30

    Abstract: Spansion Intel StrataFlash Memory j3 Spansion S29GL256N Intel J3 memory TSOP 56 SPANSION Intel SCSP S29GL-N S29GL-A S29GL-M
    Contextual Info: Migrating to the Spansion S29GL-N Flash Family from Intel StrataFlash Memory J3 /Embedded Memory (P30) Devices Application Note Introduction This application note provides conversion guidelines to Spansion™ S29GL-N Flash Family devices from Intel StrataFlash® Memory (J3) and Intel StrataFlash® Embedded Memory (P30) devices.


    Original     		S29GL-N S29GL-N J3/P30 strataflash 512 p30 Spansion Intel StrataFlash Memory j3 Spansion S29GL256N Intel J3 memory TSOP 56 SPANSION Intel SCSP S29GL-A S29GL-M PDF

    intel packaging handbook 240800

    Abstract: heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759
    Contextual Info: A AP-759 APPLICATION NOTE Intel Embedded Processor Module EMBMOD133 Thermal Design Guide December, 1997 Order Number: 273143-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		AP-759 EMBMOD133) Inte31 intel packaging handbook 240800 heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759 PDF

    PPGA-B615

    Abstract: CKDM66-M Intel Mobile Celeron Processor BGA
    Contextual Info: MOBILE INTEL CELERON® PROCESSOR IN MICRO-PGA AND BGA PACKAGES AT 466 MHZ, 433 MHZ, 400 MHZ, 366 MHZ, 300 MHZ, AND 266 MHZ DATASHEET + Available at 266 MHz, 266 MHz at low voltage, 300 MHz, 333 MHz, 366 MHz, 400 MHz, 433 MHz, and 466 MHz + Supports Intel Architecture with


    Original     		16-Kbyte 128Kbyte) PPGA-B615 CKDM66-M Intel Mobile Celeron Processor BGA PDF

    82801DB

    Abstract: ICH4 intel 82801DB thermal specifications ICH4 Datasheet 82870P2 ATA-33 P64H2 82870P2 64-bit Hub 2 bga thermal cycling reliability
    Contextual Info: R Intel 82801DB I/O Controller Hub 4 ICH4 Design Guide Intel® 82801DB ICH4 Thermal and Mechanical Design Guidelines October 2002 Document Number: 298651-002 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		82801DB ICH4 intel 82801DB thermal specifications ICH4 Datasheet 82870P2 ATA-33 P64H2 82870P2 64-bit Hub 2 bga thermal cycling reliability PDF

    443BX

    Abstract: 041H 245112 Intel Celeron D43 M4 DIODE V001000
    Contextual Info: MOBILE CELERON PROCESSOR IN BGA PACKAGE AT 300 MHZ AND 266 MHZ DATASHEET + + + + Available at 266 MHz and 300 MHz Supports the Intel Architecture with Dynamic Execution Integrated primary 16-Kbyte instruction cache and 16-Kbyte write back data cache + Integrated second level cache 128-Kbyte


    Original     		16-Kbyte 128-Kbyte) USA/96/POD/PMG 443BX 041H 245112 Intel Celeron D43 M4 DIODE V001000 PDF

    pin diagram i3 processor

    Abstract: basics of intel i3 processor capacitor 2200 micro M pin configuration of i3 processor 400 mhz filter intel core i3 processor intel i3 intel pentium IV microprocessor pin diagram jtag mhz pentium II
    Contextual Info: MOBILE PENTIUM II PROCESSOR IN Micro-PGA AND BGA PACKAGES AT 400 MHz, 366 MHz, 333 MHz, 300PE MHz, AND 266PE MHz      Available at 400 MHz, 366 MHz, 333 MHz, 300PE MHz, and 266PE MHz  Fully compatible with previous Intel microprocessors — Binary compatible with all applications


    Original     		300PE 266PE 16-Kbyte 256-Kbyte) pin diagram i3 processor basics of intel i3 processor capacitor 2200 micro M pin configuration of i3 processor 400 mhz filter intel core i3 processor intel i3 intel pentium IV microprocessor pin diagram jtag mhz pentium II PDF

    443BX

    Abstract: 245103 pbga-b615
    Contextual Info: MOBILE PENTIUM II PROCESSOR IN BGA PACKAGE AT 366 MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ + + + Available at 266PE MHz, 300PE MHz, 333 MHz and 366 MHz + — Binary compatible with all applications Supports the Intel Architecture with Dynamic Execution Integrated primary 16-Kbyte instruction


    Original     		300PE 266PE 16-Kbyte 256-Kbyte) 443BX 245103 pbga-b615 PDF

    400 mhz filter

    Abstract: diode t40 041H 440M 440MX 443BX pbga-b615 L-11117 245112 Mini-Cartridge
    Contextual Info: MOBILE CELERON PROCESSOR IN MICRO-PGA AND BGA PACKAGES AT 466 MHZ, 433 MHZ, 400 MHZ, 366 MHZ, 300 MHZ, AND 266 MHZ DATASHEET      Available at 266 MHz, 266 MHz at low voltage, 300 MHz, 333 MHz, 366 MHz, 400 MHz, 433 MHz, and 466 MHz Supports Intel Architecture with Dynamic


    Original     		16-Kbyte 128-Kbyte) 400 mhz filter diode t40 041H 440M 440MX 443BX pbga-b615 L-11117 245112 Mini-Cartridge PDF

    Intel 82801EB MOTHERBOARD

    Abstract: Intel 82801EB 82801EB ICH5R 82801ER 82801eb ich5 intel 875P chipset motherboard geometric 298643 252516
    Contextual Info: R Intel 82801EB I/O Controller Hub 5 ICH5 and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide April 2003 Document Number: 252673-001 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		82801EB 82801ER 82801EB/82801ER Intel 82801EB MOTHERBOARD Intel 82801EB ICH5R 82801ER 82801eb ich5 intel 875P chipset motherboard geometric 298643 252516 PDF

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    GD16585

    Abstract: GD16589 STM-64 GD16585-EF B1112
    Contextual Info: 10 Gbit/s Transmitter MUX with Re-timing GD16585/GD16589 FEC an Intel company Preliminary General Description Features GD16585 and GD16589 are transmitter chips used in SDH STM-64 and SONET OC-192 optical communication systems. The device is available in two versions:


    Original     		GD16585/GD16589 GD16585 GD16589 STM-64 OC-192 GD16585-EF B1112 PDF

    bang bang phase detector

    Abstract: GD16584 GD16585 DO13 package DO15 GD16588 STM-64 HCGD16588-EF
    Contextual Info: 10 Gbit/s Receiver, CDR and DeMUX GD16584/GD16588 FEC an Intel company Preliminary General Description Features GD16584 and GD16588 are Receiver chips for use in STM-64/192 and Optical Transport Networking (OTN) systems. The component is available in two versions:


    Original     		GD16584/GD16588 GD16584 GD16588 STM-64/192 bang bang phase detector GD16585 DO13 package DO15 STM-64 HCGD16588-EF PDF

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    JS28F160B3BD70

    Abstract: flash device MARKing intel 28f016 te28F320B3BD70 BGA PACKAGE TOP MARK intel uBGA device MARKing intel GE28F160B3BC70 JS28F320B3BD70 intel BGA PACKAGE TOP MARK 28F016B3 28F160B3
    Contextual Info: Intel Advanced Boot Block Flash Memory B3 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Datasheet Product Features • Flexible SmartVoltage Technology — 2.7 V – 3.6 V read/program/erase — 12 V V PP fast production programming • 1.65 V – .5 V or 2.7 V – 3.6 V I/O option


    Original     		28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 64-KB 48-ball JS28F160B3BD70 flash device MARKing intel 28f016 te28F320B3BD70 BGA PACKAGE TOP MARK intel uBGA device MARKing intel GE28F160B3BC70 JS28F320B3BD70 intel BGA PACKAGE TOP MARK 28F016B3 28F160B3 PDF

    mini pci pcb layout

    Abstract: embedded system mini projects free intel MOTHERBOARD pcb design in SODIMM DDR2 Mechanical Dimensions mini PCI express pcb us power supply atx 250w mini projects based on embedded systems ICH10DO SODIMM DDR3 Mechanical Dimensions m0811
    Contextual Info: Ver. 28H About Portwell Who is Portwell, Inc.? Portwell, founded in Taiwan in 1993, is a world-leading innovator in the Industrial PC IPC market by providing wide-range Non-PC platforms and services to meet customers' needs of Mission-Critical Applications. Today, our


    Original     		M081110 mini pci pcb layout embedded system mini projects free intel MOTHERBOARD pcb design in SODIMM DDR2 Mechanical Dimensions mini PCI express pcb us power supply atx 250w mini projects based on embedded systems ICH10DO SODIMM DDR3 Mechanical Dimensions m0811 PDF

    28F128K3C

    Abstract: 28f128k3c115 RC28F128K3C115 RC28F256K3C120 28F128K18 28F128K3 28F256K18 Intel SCSP RC28F256K3C120 lead free 28F256K3
    Contextual Info: Intel StrataFlash Synchronous Memory K3/K18 28F640K3, 28F640K18, 28F128K3, 28F128K18, 28F256K3, 28F256K18 (x16) Datasheet Product Features • ■ ■ Performance — 110/115/120 ns Initial Access Speed for 64/128/256 Mbit Densities — 25 ns Asynchronous Page-Mode Reads,


    Original     		K3/K18) 28F640K3, 28F640K18, 28F128K3, 28F128K18, 28F256K3, 28F256K18 32-Word 16-MB 32-MB 28F128K3C 28f128k3c115 RC28F128K3C115 RC28F256K3C120 28F128K18 28F128K3 28F256K18 Intel SCSP RC28F256K3C120 lead free 28F256K3 PDF

    C40682-002

    Abstract: BGA Ball Crack honeywell pcm45hd intel 3001 processor cross reference honeywell pcm45 B2567-02 B3541 INTEL application notes 80333
    Contextual Info: Intel 80333 I/O Processor Thermal Design Guidelines Application Note May 2005 Document Number: 306630002US Intel® 80333 I/O Processor INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS


    Original     		306630002US rights100% C40682-002 BGA Ball Crack honeywell pcm45hd intel 3001 processor cross reference honeywell pcm45 B2567-02 B3541 INTEL application notes 80333 PDF

    strataflash 512 p30

    Abstract: RC48F4400P0VB00 Migration Guide for Intel StrataFlash Memory J 3066* intel PF48F4400P0VTQ0
    Contextual Info: Intel StrataFlash Embedded Memory P30 Family Datasheet Product Features High performance — 85 ns initial access — 52 MHz with zero wait states, 17ns clock-todata output synchronous-burst read mode — 25 ns asynchronous-page read mode — 4-, 8-, 16-, and continuous-word burst mode


    Original     		32-KByte 128-KByte 256-Mbit 64-Mbit RD48F2000P0ZBQ0 RD48F2000P0ZTQ0 PF48F2000P0ZBQ0 PF48F2000P0ZTQ0 128-Mbit RD48F3000P0ZBQ0 strataflash 512 p30 RC48F4400P0VB00 Migration Guide for Intel StrataFlash Memory J 3066* intel PF48F4400P0VTQ0 PDF

    Loctite 7452

    Abstract: TT 2206 datasheet TT 2206 transistor tt 2206 motherboard with multimeter pcm45 PCM45F Loctite 3733 631X TT 2206 transistor
    Contextual Info: Intel 5000 Series Chipset Memory Controller Hub MCH for Embedded Applications Thermal and Mechanical Design Guidelines September 2006 Order Number: 315344-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


    Original     		315344-001US Loctite 7452 TT 2206 datasheet TT 2206 transistor tt 2206 motherboard with multimeter pcm45 PCM45F Loctite 3733 631X TT 2206 transistor PDF

    strataflash 512 p30

    Abstract: JS28F128P30B85 pc28f128p30b JS28f256P30 1GB EASY BGA NOR FLASH JS28F256P30B95 TSOP 48 stacked die package JS28F256P PC28F PF48F4400
    Contextual Info: Intel StrataFlash Embedded Memory P30 1-Gbit P30 Family Datasheet Product Features High performance • Security — 85 ns initial access — One-Time Programmable Registers: • 64 unique factory device identifier bits — 40 MHz with zero wait states, 20 ns clock-to• 64 user-programmable OTP bits


    Original     		128-KByte 64-Mbit 128-Mbit RD48F3000P0ZBQ0 RD48F3000P0ZTQ0 PF48F3000P0ZBQ0 PF48F3000P0ZTQ0 256-Mbit RD48F4000P0ZBQ0 RD48F4000P0ZTQ0 strataflash 512 p30 JS28F128P30B85 pc28f128p30b JS28f256P30 1GB EASY BGA NOR FLASH JS28F256P30B95 TSOP 48 stacked die package JS28F256P PC28F PF48F4400 PDF

    RC28F256K18C120

    Abstract: GE28F256K18C RC28F256K3C120 GE28F256K18C120 RC28F256K3C120 lead free flowchart of bluetooth technology RC28F128K18
    Contextual Info: 3 Volt Synchronous Intel StrataFlash Memory 28F640K3, 28F640K18, 28F128K3, 28F128K18, 28F256K3, 28F256K18 x16 Datasheet Product Features • Performance — 110/115/120 ns Initial Access Speed for 64/128/256 Mbit Densities — 25 ns Asynchronous Page-Mode Reads,


    Original     		28F640K3, 28F640K18, 28F128K3, 28F128K18, 28F256K3, 28F256K18 32-Word 16-MB 32-MB RC28F640K3C110 RC28F256K18C120 GE28F256K18C RC28F256K3C120 GE28F256K18C120 RC28F256K3C120 lead free flowchart of bluetooth technology RC28F128K18 PDF

    GD16585

    Abstract: bang bang phase detector DO15 GD16584 GD16588 STM-64
    Contextual Info: 10 Gbit/s Receiver, CDR and DeMUX GD16584/GD16588 FEC an Intel company Preliminary General Description Features GD16584 and GD16588 are Receiver chips for use in STM-64/192 and Optical Transport Networking (OTN) systems. The component is available in two versions:


    Original     		GD16584/GD16588 GD16584 GD16588 STM-64/192 GD16585 bang bang phase detector DO15 STM-64 PDF