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131-6116-11H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP. |
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131-6116-11D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. |
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20021611-00012T1LF
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Amphenol Communications Solutions
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1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts |
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20021611-00030T1LF
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Amphenol Communications Solutions
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1.27mm (0.05in.) pitch, Header with eject latch, 30 contacts |
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87916-113HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail. |
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