IN SNEC Search Results

204209-1

Contextual Info: AMP Specifications subject to change. Protective Hardware Dimensioning: Dimensions are in inches and millimeters. Values in brackets are metric equivalents. For latest design specifications. 1- 800- 522-6752 Pin Hoods, Internal Open-End and Closed-End Material and Finish:

EP-754304GS-R

Abstract: IE-75000-R IE-75001-R IE-75300-R-EM PD754304
Contextual Info: USER'S MANUAL E P -7543G 4G S -R EMULATION PROBE Document No. <§> NSC Corporation '995 U10877EJ1 VOUV.OO {1st edition Date Pub^snec December ,995 P Printed in Japan The export of this product from Japan is prohibited without governmental license. To export or re-export this product from

BUK427-400B

Contextual Info: Philips Components Data sheet status P roduct specification date of issue March 1991 N-channel enhancement mode field-effect power transistor in a plastic full pack envelope. The device is intended for use in Switched Mode Power Supplies SMPS , motor control, welding,

TRANSISTOR P3

Abstract: BUK427-400B philips kt
Contextual Info: Philips Components D ata sheet status Product specification date of issue March 1991 PowerMOS transistor SbE PHILIPS INTERNATIONAL GENERAL DESCRIPTION N-channe! enhancem ent mode field-effect pow er transistor in a plastic full pack envelope. The device is intended fo r use in

Contextual Info: SOLDER TERMINALS - P R E S S 5 7 1 -4 1 4 0 ,4 2 8 1 MOUNT .152 3,86 Mounting Hole Diameter I, 1M DU. I"I \ | .ISSDi«. 571 • 4281 571 - 4140 ~ i — B a sic P a rt N o . T e rm in a l F in is h IN S U LATO R C O L O R TERMINAL FINISH COOED DASH No. HOW TO ORDER CODE: 571 - 4XXX - 01 - XX - XX

74LS257PC

Abstract: 74S257DC ls257 54LS257DM 54S257DM 54S257FM 74LS257DC 74LS257FC 74S257FC 74S257PC
Contextual Info: 257 C O N N E C T IO N D IA G R A M P IN O U T A 54S/74S257 . 54LS/74LS257* C ! lA s [T Q U A D 2 -IN P U T M U LTIP LEXER Ida (W ith 3 -S ta te O u tp u ts m vcc QF 15] 01 iT] loc I.E ] iic h T 2I Zc io t [ T iib U Zu D E S C R IP T IO N — T h e '257 is a quad 2 -in p u t m u ltip le x e r w ith 3 -sta te o u tp u ts.

Contextual Info: 17,1 1 DO NOT SCALE d im en sio n s METRIC in 3rd ANGLE P R O J E C T IO N BRONZE FOSFOROSO -//- BRONZE FOSFOROSO ESTANHADO OTHER TREATMENT CUSTOMER E see 094 //- LATAO FI NI SH MATERIAL DWG fo r R E FE R E N C E -5 LATAO PRATEADO ESTANHADO ONLY in I t OftAHIH« I» u n m h l i s h e o

Contextual Info: b2E ]> • k427525 GG3SA32 35b H N E C E Ï E C N EC ELECTRONICS INC nPD17005 S IN G L E C H IP M IC R O C O N T R O LLE R FO R D IG IT A L TU N IN G S Y S T E M The j i P D 17005 is a 4 bit single chip C M O S microcontroller equipped with the hardware exclusively for digital

Contextual Info: O E S IO N E O .1 ^ 1 C - f:« .E FO R u s e R E V IS IO N S w ith REV | S .R . R G ¿ 0 2 / U E i-lT R Y D I - K E t S f t O E S C R tP T lO fi ~ o 7 7 l R E V iS E D < -E R S C N I ° " JE APPRO VED T ' d CAM 9 3 -0 1 S 3 7 /7 / jS M IN IM U M H O U S IN G

MSM5416250

Abstract: 11CC11
Contextual Info: OKI Semiconductor MSM5416250 ~ OKI SUPER HIGH SPEED GRAPHICS DRAM Technical Inform ation 262, DESCRIPTION The MSM5416250 is a 262,144-word x 16-bit dynamic RAM fabricated in OKI's CMOS silicon gate technology. The MSM5416250 is especially designed for high performance PC graphics. The MSM5416250 is

amp plcc socket

Contextual Info: AMP Products for Surface Mount Assembly Catalog 65230 • Surface M ount Revised 11-95 Low Profile 0.8 mm [.031] Pitch SOJ-Style PLCC Socket Product Facts ■ 0.8 mm [.031] pitch permits greater memory in less real estate ■ Low profile allows tighter board spacing

MSC 1697 IC pin diagram

Abstract: sf 1565 sg syy 155 415 TC75 Temperature Sensor xo 405 mf DSP5630 timer eft disco TL 434 FM receiver module diagram LG 21 fs 4 bg model circuits
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL Order this document by: DSP56304/D DATA DSP56304 Advance Information 24-BIT DIGITAL SIGNAL PROCESSOR ,*!. ‘*{,3, Motorola designed the ROM-based DSP56304 to support multifunction wireless and eg$\.*:<2~, embedded DSP applications. In addition to the large on-tip ROM spaces, the DSP56304,@~~~}t.”

MCM4132L20

Abstract: pir 325 MCM4116 MCM4132L15 MCM4132L25 MCM4132L30
Contextual Info: - r ? M O TO R O LA MCM4132 3 2 ,7 6 8 x 1 BIT D Y N A M IC R AM MOS T h e M C M 4 1 3 2 is a 3 2 ,7 6 8 -b it h ig h -s p e e d D y n a m ic R a n d o m A c c e s s M e m o ry d e s ig n e d fo r h ig h -p e rfo r m a n c e , lo w - c o s t a p p lic a tio n s in m a in ­

65039-032

Contextual Info: Discrete Crimp-to-Wire Pins/Receptacles/ Housings 2.54 x 2.54 m m 0.100 x 0.10 0 in. C enterlines Latching System II Features Specifications • Uses Mini-PV Receptacles and drawn-wire pins for high reliability. ■ ASTM B-122 ■ ASTM B-159 ■ ASTM B-579

Diode 0.6V

Abstract: tc9314f GK19f toshiba 250 SERVICE MANUAL
Contextual Info: TOSHIBA TC9314F TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC 9 3 1 4 F SINGLE-CHIP DTS MICROCONTROLLER DTS-22 TC9314F is a 4bit CMOS microcontroller for single-chip digital tuning systems with built-in prescaler, PLL and LCD driver. The CPU has 4bit parallel addition/subtraction (eg, Al

DT-18X

Contextual Info: 28.8 & I M COMMUNICATORS Voi« and Cellular The Easy Way To Send And Receive Communications From Your Laptop Simple Technology's 28.8 and 14.4 Communicators are the: perfect w ay to stay in touch w hen you're out on the road. Simply plug your Com municator into your laptop's PC Card

Contextual Info: S P E C T R U M C O N T R O L INC. Hermetically Sealed Threaded Case Filters This series of filters features hermetic glass seals and high EMI filtering performance. They are excellent for critical applications that demand high reliability in the toughest environmental conditions and provide broad­

MSM5416250

Abstract: nu ja8
Contextual Info: OKI Semiconductor MSM5416250 ~ OKI SUPER HIGH SPEED GRAPHICS DRAM T echnical Inform ation 262,144-W ord x 16-Bit D Y N A M IC RA M : FA ST PA G E M O D E T Y PE W ITH ED O DESCRIPTION The MSM5416250 is a 262,144-word x 16-bit dynamic RAM fabricated in OKI's CMOS silicon gate

MEB-12C-5

Abstract: MEB-12c-5 buzzer citizen CB-16BP-06B citizen MEB CHB-04F-04 HP 12CP CHB-03N CHB-03M CB-16BP-12B CHB-04F
Contextual Info: C IT IS O U N D C itizen tradem ark d rive rs are w id e ly used as sound so u rce s in m obile tele p ho n e s, pagers, and o th e r h ig h -te ch n o lo gy po rta b le co m m unication devices. The lineup includes m icro-buzzers which com bine clear sound with high sound pressure

marking SAIo

Abstract: in snec 0IKE 08x4 RK09K RK09K1110 code C3J marking code C3J marking c3j
Contextual Info: No. KX-97-T793 Cus t ome r• Date: Feb. 19. 1997 Att.t»nt. i on : Your ref. No : Your Part. No :29 SPEC IFI CATIONS ALPS'; 29 0007 MODEL Snec. No. Sample RECEIPT : No. : W1 01 1 758M STATUS RECEIVED By. Date Si Enature Name Title ALPS.ELECTRIC CO., LTD.

54ACS34

Abstract: qml-38535 54ACS
Contextual Info: REVISIONS LTR DESCRIPTION APPROVED DATE YR-MO-DA REV SHEET REV SHEET REV STATUS OF SHEETS PMIC N/A STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REV SHEET 8 PREPARED BY

S72 SMD

Abstract: tu34 qml-38535 001T smd marking S72
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED REV SHEET REV SHEET 15 16 17 REV STATUS OF SHEETS 18 REV SHEET PMIC N/A STANDARD M ICRO CIRC UIT DRAW ING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE 8 PREPARED BY

S6706

Abstract: UJT pin identification applications of ujt with circuits Burr Brown part marking AZS5734 DAC702 DAC72 DAC72-COB 8W-1S10
Contextual Info: COMPONENTS DAC702SH/883B B U R R -B R O W N * [ ] REVISION NONE FEBRUARY, 1989 Monolithic 16-Bit DIGITAL-TO-ANALOG CONVERTER FEATURES • FULLY COMPLIANT MIL-STD-883 PROCESSING • MONOLITHIC CONSTRUCTION • HIGH ACCURACY: Linearity Error: ±0.003% of FSR max

Vortex86

Abstract: DO25 circuit cellar ICOP-6050
Contextual Info: by George Novacek FEATURE ARTICLE Fault-Tolerant Electronic Systems There’s no escaping it: sooner or later, all electronic systems fail. /As a designer of embed­ ded systems, how can you prepare for system failures? Is there a way to plan for the unfore­