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    IGP-28111-* Search Results

    IGP-28111-* Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54112-811121900LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch. PDF
    10114828-11115LF
    		Amphenol Communications Solutions 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions PDF
    10114828-11110LF
    		Amphenol Communications Solutions 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 10 Positions PDF
    54122-811161900LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch PDF
    10114828-11111LF
    		Amphenol Communications Solutions 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 11 Positions PDF

    IGP-28111-* Datasheets (4)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    IGP-28111J
    		Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF 1.18MB 17
    IGP-28111J-07
    		Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF 1.18MB 17
    IGP-28111J-08
    		Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF 1.18MB 17
    IGP-28111J-09
    		Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF 1.18MB 17