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    IGF-17311 Search Results

    IGF-17311 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    69173-117HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch. PDF
    69173-114HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100in) Pitch. PDF
    87173-112
    		Amphenol Communications Solutions Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Through Hole, Double row, 12 Positions, 2.00mm (0.079in) Pitch. PDF
    69173-110HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch. PDF
    69173-111HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 11 Positions, 2.54 mm (0.100in) Pitch. PDF

    IGF-17311 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    IGF-17311J
    		Bookham Technology XFP Optical Transceivers for 10km 10G Datacom and Storage Applications Original PDF 738.85KB 11