IGC70T120T6RM Search Results
IGC70T120T6RM Datasheets (1)
Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
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IGC70T120T6RM |
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IGBT Chips; Package: --; Technology: IGBT 4 Medium Power; VDS (max): 1,200.0 V; IC (max): 75.0 A; VCE(sat) (max): 2.1 V; VGE(th) (min): 5.0 V; | Original | 71.32KB | 5 |
IGC70T120T6RM Price and Stock
Infineon Technologies AG IGC70T120T6RMX1SA3- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC70T120T6RMX1SA3) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IGC70T120T6RMX1SA3 | Waffle Pack | 52 |
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IGC70T120T6RM Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: IGC70T120T6RM IGBT4 Medium Power Chip FEATURES: • 1200V Trench + Field Stop technology • low switching losses • soft turn off • positive temperature coefficient • easy paralleling This chip is used for: • medium power modules C Applications: • medium power drives |
Original |
IGC70T120T6RM L7673B, | |
IGC70T120T6RMContextual Info: IGC70T120T6RM IGBT4 Medium Power Chip FEATURES: • 1200V Trench + Field Stop technology • low switching losses • soft turn off • positive temperature coefficient • easy paralleling This chip is used for: • medium power modules C Applications: • medium power drives |
Original |
IGC70T120T6RM L7673B, IGC70T120T6RM | |
Contextual Info: IGC70T120T6RM IGBT4 Medium Power Chip FEATURES: • 1200V Trench + Field Stop technology • low switching losses • soft turn off • positive temperature coefficient • easy paralleling This chip is used for: • medium power modules C Applications: • medium power drives |
Original |
IGC70T120T6RM L7673B, |