IGC50T120T6RL Search Results
IGC50T120T6RL Datasheets (1)
Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
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IGC50T120T6RL |
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IGBT Chips; Package: --; Technology: IGBT 4 Low Power; VDS (max): 1,200.0 V; IC (max): 50.0 A; VCE(sat) (max): 2.1 V; VGE(th) (min): 5.0 V; | Original | 72.37KB | 5 |
IGC50T120T6RL Price and Stock
Infineon Technologies AG IGC50T120T6RLX1SA1- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC50T120T6RLX1SA1) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IGC50T120T6RLX1SA1 | Waffle Pack | 74 |
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IGC50T120T6RL Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: IGC50T120T6RL IGBT4 Low Power Chip FEATURES: • 1200V Trench + Field Stop technology • low switching losses • positive temperature coefficient • easy paralleling This chip is used for: • low / medium power modules C Applications: • low / medium power drives |
Original |
IGC50T120T6RL L7663C, | |
Contextual Info: IGC50T120T6RL IGBT4 Low Power Chip FEATURES: • 1200V Trench + Field Stop technology • low switching losses • positive temperature coefficient • easy paralleling This chip is used for: • low / medium power modules C Applications: • low / medium power drives |
Original |
IGC50T120T6RL L7663C, | |
Contextual Info: IGC50T120T6RL IGBT4 Low Power Chip FEATURES: • 1200V Trench + Field Stop technology • low switching losses • positive temperature coefficient • easy paralleling This chip is used for: • low / medium power modules C Applications: • low / medium power drives |
Original |
IGC50T120T6RL L7663C, |