Part Number
    Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    IGC189T120T6RL Search Results

    SF Impression Pixel

    IGC189T120T6RL Price and Stock

    Infineon Technologies AG

    Infineon Technologies AG IGC189T120T6RLX1SA1

    - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC189T120T6RLX1SA1)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas IGC189T120T6RLX1SA1 Waffle Pack 19
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Get Quote

    IGC189T120T6RL Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: IGC189T120T6RL IGBT4 Low Power Chip Features: • 1200V Trench + Field Stop technology • low switching losses • positive temperature coefficient • easy paralleling This chip is used for: • low / medium power modules C Applications: • low / medium power drives


    Original     		IGC189T120T6RL L7703C, PDF