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Catalog Datasheet	Type	Document Tags	PDF
Mil-Std-202F 215j Abstract: Polyimide Contextual Info: Polyimide Component Labels SPECIFICATION SHEET specifications Thermal transfer polyimide adhesive label material shall be specially designed for circuit board manufacturing where there will be direct contact with wave solder and IR flow. The label shall withstand flash temperatures as high as 617°F for up	Original	IDSP02 SA-IDSP02 Mil-Std-202F 215j Polyimide	PDF

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Mil-Std-202F 215j

Abstract: Polyimide
Contextual Info: Polyimide Component Labels SPECIFICATION SHEET specifications Thermal transfer polyimide adhesive label material shall be specially designed for circuit board manufacturing where there will be direct contact with wave solder and IR flow. The label shall withstand flash temperatures as high as 617°F for up

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IDSP02 SA-IDSP02 Mil-Std-202F 215j Polyimide

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