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    IC51-3244-1331-2 Search Results

    IC51-3244-1331-2 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10118744-1133121LF
    Amphenol Communications Solutions C - Commercial Series; Mezzanine Plug, SMT; 1mm Pitch; 4.15mm Mated Height, 21p PDF
    131-3316-21D
    Amphenol Communications Solutions Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate. PDF
    69133-118HLF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch. PDF
    69133-144HLF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch. PDF
    69133-164HLF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch. PDF

    IC51-3244-1331-2 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    IC51-3244-1331-2
    Yamaichi Electronics Tape Carrier Package/Tape Automated Bonding (TCP/TAB) Original PDF 461.4KB 2