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    IC51-3244-1 Search Results

    IC51-3244-1 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10132445-18LF
    Amphenol Communications Solutions Minitek® Pwr 3.0 HCC, Dual Row, Receptacle Housing, 18 Positions, Black Color, Nylon 66, GW Compatible. PDF
    10132449-1621GLF
    Amphenol Communications Solutions Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 16 Positions, GW Compatible PA9T, Tray packing. PDF
    10132449-0411GLF
    Amphenol Communications Solutions Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 4 Positions, GW Compatible PA9T, Tray packing. PDF
    10132449-0421GLF
    Amphenol Communications Solutions Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 4 Positions, GW Compatible PA9T, Tray packing. PDF
    86832-446HLF
    Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail. PDF

    IC51-3244-1 Datasheets (4)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    IC51-3244-1331
    Yamaichi Electronics Tape Carrier Package/Tape Automated Bonding (TCP/TAB) Original PDF 461.4KB 2
    IC51-3244-1331-2
    Yamaichi Electronics Tape Carrier Package/Tape Automated Bonding (TCP/TAB) Original PDF 461.4KB 2
    IC51-3244-1333
    Yamaichi Electronics Tape Carrier Package/Tape Automated Bonding (TCP/TAB) Original PDF 461.4KB 2
    IC51-3244-1333-2
    Yamaichi Electronics Tape Carrier Package/Tape Automated Bonding (TCP/TAB) Original PDF 461.4KB 2