IC OF THE MOTHERBOARD Search Results

Contextual Info: IC S2407 IC S2409 IC S2419 IC S2439 _ _ Integrated Circuit Systems, Inc. Dual-PLL M oth erbo ard Frequency G enerator Description Features This ICS family of motherboard frequency generators all stem from the same basic design. They are dual-PLL phase-locked

A5625-01

Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which

free transistor equivalent book 2sc

Abstract: uPA1556AH The Japanese Transistor Manual 1981 samsung UHF/VHF TV Tuner MOSFET cross-reference 2sk PD431000A-X upper arm digital sphygmomanometer circuit diagram PD72001 uPC1237 uPC 2002
Contextual Info: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Semi-Custom IC 3 Particular Purpose 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 RF and Microwave Devices 7 Optical Device 8 Index 9 April 1999 The export of these products from Japan is regulated by the Japanese government. The export of some or all of

A5620

Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which

tungsten slug glass diode

Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which

S2419

Abstract: motherboard ic list
Contextual Info: IC S2407 IC S2409 IC S2419 IC S2439 Integrated Circuit Systems, Inc. Dual-PLL Motherboard Frequency Generator Description Features This ICS family of motherboard frequency generators all stem from the same basic design. They are dual-PLL phase-locked loop clock generators specifically designed for motherboard

Bluetooth internal circuit diagram

Abstract: ic laptop motherboard free circuit diagram of laptop motherboard GCT SEMICONDUCTOR ALL LAPTOP MOTHERBOARD CIRCUIT DIAGRAM laptop motherboard circuit diagram bluetooth based data transfer system block diagram free circuit diagram of bluetooth modem 32-MIPS mobile MOTHERBOARD CIRCUIT diagram
Contextual Info: - GDM11GDM GDM1101b Bluetooth Baseband IC GDM1101b Bluetooth Baseband IC General Descriptions The GDM1101 b is one of several chips offered in GCT's Bluetooth product family. It is a baseband IC for Bluetooth implemented with CMOS technology. Together with the GDM1100 radio

EA1 transistor smd

Abstract: equivalent del c200 SMD CAPACITOR L27 transistor c380 IR3523MPBF IR3523MTRPBF VR11 NTC Thermistor 8 kOhm
Contextual Info: IR3523 DATASHEET XPHASE3TM DUAL OUTPUT CONTROL IC DESCRIPTION The IR3523 Control IC provides a full featured and flexible way to implement a complete dual output DDR & CPU VTT multiphase power solution for Intel VR11.1 motherboards. Each output interfaces with any number of

MCH215A101JK

Abstract: C1213 aluminum capacitor C1521 10MV1200GX MCH212F104ZP ceramic capacitor 100nF AN-53 Ron Lenk MBRD835L
Contextual Info: Application Bulletin AB-18 Using the RC5051 for a Katmai Motherboard Design -Ron Lenk, Principal Applications Engineer 7/29/98 AB-18 Rev. 0.1 1 Summary Selecting the proper set of components for a Katmai power supply based on the RC5051 requires detailed understanding of both the specs and the IC. Using the

Contextual Info: 48 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Contextual Info: 28 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Contextual Info: 8 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Contextual Info: 48 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Contextual Info: 44 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Triangle Microwave

Abstract: AN0005 CHT3091RCF RF Semiconductors ic smd Triangle Microwave attenuator
Contextual Info: CHT3091RCF DC-40GHz Attenuator GaAs Monolithic Microwave IC in SMD leadless package Description Main Features The monolithic microwave IC MMIC in the package is a variable DC-40GHz attenuator. It is designed for a wide range of applications, from military to commercial

AN0005

Abstract: CHT3091RCF smd 493
Contextual Info: CHT3091RCF DC-40GHz Attenuator GaAs Monolithic Microwave IC in SMD leadless package Description Main Features The monolithic microwave IC MMIC in the package is a variable DC-40GHz attenuator. It is designed for a wide range of applications, from military to commercial

Contextual Info: 64 Pin to 72 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

AK18D300-NWSO

Abstract: SOIC Package 18-Pin Surface Mount AK16D300-WSO AK16D300-QSOP 64kx4 AK16D300-TSOP AK24D300-TSOP AK16D300-QFN5X5 AK16D-LLP4X4 AK20DS300-PLCC
Contextual Info: Accutek Microcircuit Corporation 16 Pin to 24 Pin DIP Adapters DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Contextual Info: 52 Pin to 56 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Contextual Info: 16 Pin to 18 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

28-pin SOJ SRAM

Abstract: clcc 32 socket TSOP dip adapter 28-pin SOJ SRAM 512k AK28D300-QSOP AK28D300-SOJ AK28D300-TSOP AK28D-LLP DA10 DIP600
Contextual Info: Accutek Microcircuit Corporation 28 Pin to 32 Pin DIP Adapters DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Contextual Info: 10 Pin to 14 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Contextual Info: 16 Pin to 18 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

28-pin SOJ SRAM

Abstract: DA11A
Contextual Info: Accutek Microcircuit Corporation 28 Pin to 32 Pin DIP Adapters DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are: