IC 935 Search Results

EEPROM 71005

Abstract: HITAG 2 coding algorithm hitag s256 HITAG s transponder antenna design guide form passive enter philips hts HITAG command HITAG 2 algorithm timing hitags256 Hitag S256 Philips Semiconductors
Contextual Info: INTEGRATED CIRCUITS DATA SHEET HITAG S HTS IC H32/HTS IC H56/HTS IC H48 Transponder IC Product Specification Revision 3.0 PUBLIC INFORMATION 2003 November 12 079230 Philips Semiconductors Product Specification Revision 3.0 2003 November 12 HITAG S HTS IC H32/HTS IC H56/HTS IC H48

h48 diode

Abstract: HITAG s hitag s256 Car security system block diagram HITAG PROTOCOL EEPROM 71005 diode H48 HITAG 2 algorithm timing Transponder ID 48 HITAG 2 coding algorithm
Contextual Info: INTEGRATED CIRCUITS DATA SHEET HITAG S HTS IC H32/HTS IC H56/HTS IC H48 Transponder IC Product Specification Revision 3.1 PUBLIC INFORMATION 2006 July 18 079231 Philips Semiconductors Product Specification Revision 3.1 2006 July 18 HITAG S HTS IC H32/HTS IC H56/HTS IC H48

X118

Abstract: S7001
Contextual Info: MF1 IC S70 01 Standard 4Kbyte card IC bumped sawn wafer on UV-tape addendum Rev. 3.1 — 4 April 2007 Product data sheet 101831 PUBLIC 1. General description The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the mifare card IC coil design guide and is qualified to work properly in NXP reader

MIFARE Card IC Coil Design Guide

Abstract: Mifare MF1 IC S 70 MIFARE s70 chip X118 AN MIFARE Card Coil Design Guide 101730 S7001
Contextual Info: MF1 IC S70 01 Standard 4Kbyte card IC sawn wafer on UV-tape addendum Rev. 3.1 — 18 April 2007 Product data sheet 101731 PUBLIC 1. General description The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the MIFARE card IC coil design guide and is qualified to work properly in NXP reader

ic u11

Abstract: MIFARE Card IC Coil Design Guide 74x74 LCR meter for ICs package MIFARE Card Coil Design Guide
Contextual Info: MF0 IC U10 01 MF0 IC U11 01 Bumped sawn wafer on UV-tape Rev. 3.2 — 16 March 2007 Product data sheet 102132 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 and the MF0 IC U11 01 are contactless Smart Card ICs designed for card IC coils following the mifare card IC coil design guide and are qualified to work

MIFARE Card IC Coil Design Guide

Abstract: MIFARE s70 chip Philips MF1 IC S70 General Wafer Specification MF1 IC S70 k 1356 12NC ordering code philips MIFARE s70 philips application notes philips 15601
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Wafer Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Wafer Specification Rev. 3.1 October 2002 Standard 4Kbyte Card IC MF1 IC S70 01

MIFARE Card IC Coil Design Guide

Abstract: Philips MF1 IC S50 Mifare MF1 S50 Philips Mifare 1 S50 Philips Mifare 1 S50 specifications philips S50 MF1 S50 mifare s50 MIFARE card MF1 IC S50 S5005
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Wafer Specification Revision 3.0 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Rev. 3.0 October 2002 Wafer Specification Standard Card IC MF1 IC S50 05 CONTENTS 1 SCOPE 3 2 REFERENCE DOCUMENTS

fCL16

Abstract: fCL-16 UV324
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA4995WP PANorama-IC PAN-IC Preliminary specification File under Integrated Circuits, IC02 1997 Jun 10 Philips Semiconductors Preliminary specification PANorama-IC (PAN-IC) SAA4995WP FEATURES GENERAL DESCRIPTION • Horizontal sample rate conversion in both zoom and

74x74

Abstract: Mifare* coil MIFARE Card Coil Design Guide
Contextual Info: MF0 IC U10 01 Bumped unsawn wafer on UV-tape Rev. 3.1 — 20 February 2007 Product data sheet 133131 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 is contactless Smart Card IC designed for card IC coils following the mifare Card IC Coil Design Guide and is qualified to work properly in NXP´ reader

MIFARE Card IC Coil Design Guide

Abstract: mifare s50 mifare s50 MIFARE MF1ICS2005 Mifare MF1 IC S 70
Contextual Info: MF1 IC S20 05 Sawn bumped 120µm wafer addendum Rev. 3.0 — 18 July 2007 Product data sheet 141130 PUBLIC 1. General description The MF1 IC S20 05 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

uv-tape

Abstract: Philips MF1 IC S50 Philips Mifare 1 S50 Mifare MF1 S50 MF1 S50 mifare s50 mifare s50 MIFARE mifare mf1 ic s50 MF1 IC S50 MF1ICS5005
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Specification “sawn wafer on UV-tape” Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004 sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 CONTENTS

eurosil

Abstract: ic tda 6108 tda 9351 SE116 BH 37 933 Eurosil Electronic tfk 635 EL131 TDA 785 LA
Contextual Info: Te m ic TELEFUN KEN Semiconductors Addresses Sales Offices Europe Hungary Sweden T E M IC D a n sk T EM 1C T E L E FU N K E N T E M IC T E L E F U N K E N T E M IC N o rd ic A B c /o A E G D a n s k A k tie s e ls k a b m ic ro e le c tro n ic ìm h H K r u p p s tr a s s e 6

MIFARE Card Coil Design Guide

Abstract: MF0ICU1 LCR meter for ICs package contactless Functional Specification
Contextual Info: MF0 IC U10 01 120 mm Bumped unsawn wafer on UV-tape contactless single-trip ticket ICs Rev. 3.2 — 16 March 2007 Product data sheet 127632 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 is a contactless smart card IC designed for card IC coils following the

UV-tape

Abstract: MIFARE Card Coil Design Guide contactless Functional Specification
Contextual Info: MF0 IC U10 01 120 µm Bumped sawn wafer on UV-tape contactless single-trip ticket ICs Rev. 3.2 — 16 March 2007 Product data sheet 124832 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 is a contactless Smart Card IC designed for card IC coils following the

Contextual Info: MF1 IC S20 07 Sawn wafer on UV-tape addendum Rev. 1.0 — 17 January 2007 Product data sheet 132310 PUBLIC 1. General description The MF1 ICS 20 20 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

MIFARE Card IC Coil Design Guide

Abstract: Mifare MF1 S50 mifare mf1 ic s50 uv-tape S5005
Contextual Info: MF1 IC S50 05 Sawn wafer on UV-tape addendum Rev. 3.2 — 18 April 2007 Product data sheet 101932 PUBLIC 1. General description The MF1 ICS 50 05 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP

MF1ICS5005

Abstract: mifare s50 MIFARE MIFARE Card IC Coil Design Guide mifare s50 LCR meter for ICs package S5005
Contextual Info: MF1 IC S50 05 Bumped sawn wafer on UV-tape addendum Rev. 3.2 — 4 April 2007 Product data sheet 102032 PUBLIC 1. General description The MF1 ICS 50 05 is a contactless smart card IC designed for card IC coils following the mifare card IC coil design guide and is qualified to work properly in NXP reader

LA 7124

Abstract: mifare s50 mifare s50 MIFARE mifare mf1 ic s50 MF1 IC S50 CONTACTLESS SMART CARD READER
Contextual Info: MF1 IC S50 07 Sawn wafer addendum Rev. 3.2 — 16 March 2007 Product data sheet 118732 PUBLIC 1. General description The MF1 ICS 50 07 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

MIFARE Card Coil Design Guide

Contextual Info: MF1 IC S50 07 Sawn wafer addendum Rev. 3.1 — 24 January 2007 Product data sheet 118731 PUBLIC 1. General description The MF1 ICS 50 07 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

AN MIFARE Card Coil Design Guide

Abstract: marking code s20 LCR meter for ICs package MIFARE Card Coil Design Guide MF1ICS5006
Contextual Info: MF1 IC S20 07 Sawn wafer on UV-tape addendum Rev. 1.1 — 16 March 2007 Product data sheet 132311 PUBLIC 1. General description The MF1 ICS 20 20 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

MIFARE Card Coil Design Guide

Abstract: uv-tape mifare s50 mifare s50 MIFARE MF1 IC S50 LA 7124
Contextual Info: MF1 IC S50 07 Sawn bumped wafer on UV-tape addendum Rev. 3.2 — 4 April 2007 Product data sheet 118832 PUBLIC 1. General description The MF1 ICS 50 07 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

MIFARE s70 chip

Abstract: Philips MF1 IC S70 General Wafer Specification MIFARE s70 UV-tape MIFARE Card IC Coil Design Guide S7001 MIFARE Card Coil Design Guide
Contextual Info: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Specification “sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004 Sawn wafer on UV-tape MF1 IC S70 01

AN 17820 IC

Abstract: REGULATOR IC 7809 function 7809 regulator i c REGULATOR IC 7815 IC 4071 pin and internal diagram ic 7809 function ic 7809 function 7809 regulator 7836 voltage regulator ST 7809 voltage regulator
Contextual Info: KB8527B 1 CHIP CLP SUBSYSTEM IC INTRODUCTION 48 -QFP- 1010E KB8527B is a monolithic circuit which can be used in high performance 60MHz MCA type CLP System. The KB8527B is a subsystem IC for FM / FSK receiving systems and a complete one chip FM / FSK receiver IC for 60MHz

AXP 209 IC

Abstract: sem 2105 16 pin AXP 202 AEG T 51 N 1200 77480 48409 IC SEM 2105 Pioneer PA 0016 94-4033 sem 2105
Contextual Info: Tem ic Sales Offices Semiconductors Addresses Europe Poland Sweden TE M IC TELEFU N K EN m icroelectronic Gm bH Theresienstrasse 2 74072 H eilbronn Postfach 3535, PLZ 74025 Tel: 49 7131 67 3737 Fax: 49 7131 672444 TEM IC TE LE FU N K E N m icroelectronic Gm bH