HYSOL 4323 Search Results

underfill

Abstract: SN63A FR4 substrate hysol with or without underfill PCB design for csp package FR4 substrate epoxy hysol 4520
Contextual Info: CHIP SCALE PACKAGE ASSEMBLY GUIDE INTRODUCTION Dallas Semiconductor developed Chip Scale Package CSP to be assembled with processes typical of Surface Mount Technology (SMT). Applying some special considerations to the traditional SMT assembly processes, customers realize reliable product assemblies. This document supplies the process

420L

Abstract: hysol adhesive magneto resistor
Contextual Info: Packing and Handling Instruction Direction of Unreeling TAB: FP 410 L; FP 420 L; FP 425 L AL-nap-tape for TAB Backside Leader tape start of reel and end of reel approx. 1.5-2.0 m length. Frontside of die Backside of die visible Leader tape Metal reel Direction of unreeling

Contextual Info: SIEMENS Differential Magneto Resistor FP 412 L 100 t If delivery as tape,separate at punching-points 2) Connections on both sides free of lacquer g p x o 6777 3) Mechanical connections 4) Center—distance of Diff.-System s Approx. weight 0.2 g 2 1.3 pin connection

Contextual Info: SIEMENS Double Differential Magneto Resistor FP 420 L 90 2 6 fingers on both sides free of lacquer 3) Center-distance between the Oiff.-Systems. Approx. w e ig h t 0.2 g GPX06896 Dimensions in mm Features Typical applications • • • • • • • •

Contextual Info: SIEMENS Differential Magneto Resistor FP 412 D 250 1 If delive ry a s ta p e , se p a ra te a t p u n ch in g —points 2 ) C on n e ctio n s on both sid e s fre e o f la c q u e r 3 ) M ech a n ica l co n n e c tio n s 4 ) C e n te r - d is ta n c e o f D iff.- S y s t e m s

PPC601

Abstract: PANASONIC Memory card 32kbyte hysol 4323 A23 862-1 DL10 DL12 DL13 DL14 MPC601 PowerPC 601
Contextual Info: MPR601HSU-03 IBM Order Number MPC601EC/D (Motorola Order Number) 1/95 REV 3 Advance Information PowerPC 601™ RISC Microprocessor Hardware Specifications The PowerPC 601 microprocessor is the first implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains

a23 862-1

Abstract: hysol 4323 PPC601 DL10 DL12 DL13 DL14 MPC601 PowerPC 601 601V 244
Contextual Info: Freescale Semiconductor, Inc. MPR601HSU-03 IBM Order Number MPC601EC/D (Motorola Order Number) 1/95 REV 3 Advance Information PowerPC 601 RISC Microprocessor Hardware Specifications The PowerPC 601 microprocessor is the first implementation of the PowerPC™ family of

a23 862-1

Abstract: ppc601 601V 244 Epx 5341 hysol 4323 52 signals PowerPC 601 Hysol MPC601 PowerPC 601
Contextual Info: Freescale Semiconductor, Inc. MPR601HSU-03 IBM Order Number MPC601EC/D (Motorola Order Number) CT OR , IN C.2 006 DU ON Advance Information MIC PowerPC 601™ RISC Microprocessor Hardware Specifications LE SE The PowerPC 601 microprocessor is the first implementation of the PowerPC™ family of

tdb 158 dp

Abstract: tdb 0124 ap0aa
Contextual Info: MPR604HSU-01 IBM Order Number MPC604EC/D (Motorola Order Number) 2/95 Advance Information PowerPC 604™ RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains