| 
TPN12008QM
 | 
 | 
Toshiba Electronic Devices & Storage Corporation
 | 
MOSFET, N-ch, 80 V, 26 A, 0.0123 Ohm@10V, TSON Advance | 
Datasheet
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| 
XPN12006NC
 | 
 | 
Toshiba Electronic Devices & Storage Corporation
 | 
N-ch MOSFET, 60 V, 20 A, 0.0120 Ω@10V, TSON Advance(WF) | 
Datasheet
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 | 
| 
54112-108081200LF
 | 
 | 
Amphenol Communications Solutions
 | 
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch. | 
PDF
 | 
 | 
| 
54112-109101200LF
 | 
 | 
Amphenol Communications Solutions
 | 
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. | 
PDF
 | 
 | 
| 
54112-108201200LF
 | 
 | 
Amphenol Communications Solutions
 | 
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. | 
PDF
 | 
 |