HOT AIR BGA Search Results

7007S

Abstract: BARb TRANSISTOR SMD Diode HER 507
Contextual Info: WOW! Catalogue World of Weller Inhalt 2 Page 06 – Seite 219 Soldering, Microtools, Desoldering, Hot Air, Rework, Fume Extraction, Electronic Screwdrivers, Dispensing Systems, Accessories, etc. Page 220 – Seite 323 Tweezers, Cutters, Pliers, EROP, Stripping Tools, Kits, etc.

Contextual Info: PCBs for SMD Solder Practice RE713001-LF - PCB for solder practices pick-and-place for BGA 169 and 225 grid 1.50 mm including daisychain test points - introduction into trend-setting technology - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air leveling coated HAL-leadfree ; solder stop mask and additional print

850 SMD Rework Station

Abstract: EC 2000 weller weller t 3000 WRS3000 Weller Electronics WST20 WRS1001 weller soldering station wrs3000 WTA50 WHA700
Contextual Info: Weller Cooper Tools Soldering, Desoldering and Rework Systems Weller Thermal Tweezer and Tips Weller¨ WHA 700 and WHA 2000 Hot Air SMD Rework Systems The Weller WTA50 Thermal Tweezers are designed for quick and easy removal of small two-sided SMT components. Tips ranging in size from 1 mm .040" to 12.5 mm (.492") tip are available. These

reballing

Abstract: Alpha WS609 solder reflow hot air BGA solder paste alpha WS609 WS609 Lead Free reflow soldering profile BGA BGA PROFILING BGA Ball Crack Alpha WS609 reball
Contextual Info: BGA REBALLING INSTRUCTIONS Notice Mention of third-party products is for informational purposes only and constitutes neither an endorsement nor a recommendation. Emulation Techology assumes no responsibility with regard to the performance of these products.

WQB3000

Contextual Info: 1 BGAI QFP-Rework System WQB 3000 Betriebsanleitung Operating Instruction Version 1.1 2 T a b la of Contents 1 Description T&çhnfcal u'ata 2 Start-up 2.1 Eei-up 2.2 Preliminaries 2.3 Attachment and al.gnmentof the circuit boarri and soldering nozzle 3 Operation with the Programming unit

spst reed relay

Abstract: Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile
Contextual Info: BGA Series BGA SERIES MEDER electronic CRF Series High Frequency Reed Relays CRR Series SPST Reed Relays RM Series 4pol Relay Module RM Series 6pol Relay Module 2 bga.p65 www.meder.com Europa # +49- 0 7733-94870, USA # 800-870-5385 2 22.09.2004, 14:59 MEDER electronic

wsp80

Abstract: weller wsd81 WRS3000 weller MT1500 WSD81 WQB3000 weller soldering tip wsd81 weller wsp80 WHA2000 WES50
Contextual Info: CooperTools Weller ELECTRONIC SOLDERING AND DESOLDERING TOOLS 1 Weller® Soldering Table of Contents Founded in 1945, Weller® has become the world’s leading supplier of professional quality soldering equipment, including the famous Weller® temperature controlled irons and soldering guns. Weller® also makes advanced

Intel reflow soldering profile BGA

Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Contextual Info: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.

all ic data

Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
Contextual Info: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as

WELLER EC 2001

Abstract: WELLER LR 20 TIP weller WECP-80 weller soldering ecp weller soldering tip TCP weller wecp 20 weller wecp 50 DS801 WELLER "5 10 201 99" WELLER 5 24 110 99
Contextual Info: S o l d e r i n g , D e s o l d e r i n g , R e w o r k / R e p a i r To o l s a n d To r c h e s Weller Contents Temtronic / SL-Series 77 - 97 Stations Options Soldering Tips Exin-5 IC-Extractor SFA / SFC 78 80 84 92 94 96 - 79 83 91 93 95 97 Magnastat

Contextual Info: PCB for Pick and Place Soldering Practice for BGA 169 and 225 RE713001-LF - PCB for solder practices pick-and-place for BGA 169 and 225 grid 1.50 mm including daisychain test points - introduction into trend-setting technology - EPOXY resin FR4 1.50 mm single-sided 35 µm CU

IPC-7525

Abstract: ipc 7525 IPC-9502 AN-9036 IPC9502 FDMS8660S JESD22-102D Soldering guidelines pin in paste JESD22-102 FDMS8660AS
Contextual Info: AN-9036 Guidelines for Using Fairchild's Power56 Dennis Lang, Staff Engineer Introduction The Power56 minimizes both Printed Wiring Board PWB space and RDS(ON) in a convenient, familiar SO-8 sized footprint, with the addition of a large drain tab for improving thermal

heller 1700

Abstract: BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse
Contextual Info: APPLICATION NOTE Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide April 1998 Order Number: 243759-001 Mobile Pentium ® II Processor Mini-Cartridge 240-Pin BGA Connector Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any

BGA-169

Contextual Info: PCB for Pick and Place Soldering Practice for BGA 169 and 225 HP = FR2 - P henolharzhartpapier / S RBP-Paper / Résine phénolplaste / papel duro a base de résina fenôlica EP = FR4 - E poxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epöxido

TSOP infrared

Abstract: proof hot air bga reflow hot air BGA "Humidity Indicator Card" Hitachi DSA0015 baking
Contextual Info: ASSEMBLY 7-1 Soldering Methods for Various Surface Mount Packages QFP SOP TQFP TSSOP QFJ LQFP SSOP TSOP HQFP SOJ HSOP Soldering Methods Partial Heating Methods QFI HSOI G-QFP G-QFJ QFN LDPAK S Other discrete BGA HQFI packages not FBGA (CSP) listed to the left

IPC-7525

Abstract: IPC-9502 IPC9502 IPC7525 FDS7066N7 defect analysis to-220 Solder paste stencil life FDS7066N3 J-STD-020B 96SC
Contextual Info: www.fairchildsemi.com Application Note 7006 Guidelines for Using Fairchild’s SO-8 FLMP Dennis Lang, Applications Engineer Introduction Board Layout The Flip chip in Leaded Molded Package FLMP SO-8 minimizes both Printed Circuit Board (PCB) space and RDS(ON) in a convenient, familiar SO-8 sized package,

Application Note SO8 Exposed

Abstract: hot air bga FDS7066N3 FDS7066N7 J-STD-020B AN-705
Contextual Info: November 2002 Application Note 7005 Mounting Techniques for BottomlessTM SO-8 Dennis Lang, Applications Engineer Introduction The Bottomless SO-8 minimizes both Printed Circuit Board PCB space and RD S ( O N ) in a convenient SO-8 sized package. The Bottomless SO-8 employs a breakthrough in packaging

M9627

Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
Contextual Info: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in

marking code SMD Transistor 2ak

Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written

hand movement based fan speed control

Contextual Info: InnovationS in thermal management DESIGN SERVICES and rapid prototyping E CREATE CREAT Through its computational facilities and thermal/fluids laboratories, ATS specializes in providing thermal analysis, mechanical and design services for telecommunications,

Intel reflow soldering profile BGA

Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems

GE4F

Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written

ceramic rework

Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Contextual Info: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability

marx and generator

Abstract: SIMCARD disfim GUNS marx generator varicon avx quartz
Contextual Info: High Power Capacitors Calculation Form DESIGN Specification Your Choice Capacitance Working voltage Rms current Frequency Ripple voltage Ambient temperature Lifetime @ Vw,Irms and θamb Parasitic inductance Cooling conditions C µF Vw (V) Irms (Arms) F (Hz)