HMP SOLDER Search Results
HMP SOLDER Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy | 
|---|---|---|---|---|---|
| CN-AC3MMDZBAU |   | 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) | |||
| CN-DSUB25SKT0-000 |   | Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals | |||
| CN-DSUBHD26SK-000 |   | Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals | |||
| CN-DSUB25PIN0-000 |   | Amphenol CN-DSUB25PIN0-000 D-Subminiature (DB25 Male D-Sub) Connector, 25-Position Pin Contacts, Solder-Cup Terminals | |||
| CN-DSUBHD26PN-000 |   | Amphenol CN-DSUBHD26PN-000 High-Density D-Subminiature (HD26 Male D-Sub) Connector, 26-Position Pin Contacts, Solder-Cup Terminals | 
HMP SOLDER Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
| Contextual Info: HIGH TEMPERATURE SMPS STACKED CAPACITORS HTS Consult factory for requirements above 250°C SOLDERING AND LEAD COATING RECOMMENDATIONS Special Code Description Blank Sn63 / HMP Compatible Sn63 or HMP (150°C / 200°C) Not Compliant X Sn96 / HMP Compatible | Original | ||
| MABACT0051
Abstract: HMP Europe 
 | Original | 50-1200MHz MABACT0051 SM-118A MABACT0051 HMP Europe | |
| EMDC-17-8-75
Abstract: M513 
 | Original | 5-1000MHz EMDC-17-8-75 EMDC-17-8-75 SM-127 M513 | |
| Contextual Info: HIGH TEMPERATURE SMPS STACKED CAPACITORS HTS Consult factory for requirements above 250°C SOLDERING AND LEAD COATING RECOMMENDATIONS Special Code Description Attachment Method Recommended Max. Temp. Blank Standard 60%Sn 40% Pb coated lead frames Sn63 or HMP | Original | ||
| Contextual Info: HIGH TEMPERATURE SMPS STACKED CAPACITORS HTS Consult factory for requirements above 250°C SOLDERING AND LEAD COATING RECOMMENDATIONS Special Code Description Attachment Method Recommended Max. Temp. Summary Standard 60%Sn 40% Pb coated lead frames Sn63 or HMP | Original | Sn96/HMP | |
| ELDC-20TR
Abstract: ELDC-20 M513 
 | Original | 5-1000MHz ELDC-20 ELDC-20 SM-55 SM-127 ELDC-20TR M513 | |
| solder wire HMP
Abstract: EMDC-17-5-75 M513 
 | Original | 5-1000MHz EMDC-17-5-75 EMDC-17-5-75 SM-127 solder wire HMP M513 | |
| Contextual Info: REV. LET. REVISION A MODIFIED THE LEAD FORM BY DATE APPR. DATE PBOHN 2/7/14 SCYGAN 2/7/14 PBOHN 2/14/14 SCYGAN 2/14/14 WITH EXEMPTION7 a for HMP SOLDER RADIAL LEADED, UNCOATED LENGTH (L) = 0.300 MAX. HEIGHT (H) = 0.350 MAX. THICKNESS (T) = 0.100 MAX. LEAD SPACING (LS) = 0.200 ± .031 | Original | Sn10Pb88Ag2 MIL-PRF-49470 125CEMPERATURE SK035X105KHAUNCOATED AOL-2742-01 | |
| MYXD30600-10CEN
Abstract: silicon carbide 
 | Original | MYXD30600-10CEN O-258 MYXD30600-10CEN silicon carbide | |
| MACP-008125-CK07F0
Abstract: ELDC-20 M513 MACP-008125-CK07TB SM55 
 | Original | 5-1000MHz MACP-008125-CK07F0 ELDC-20. MACP-008125-CK07F0 SM-55 SM-127 ELDC-20 M513 MACP-008125-CK07TB SM55 | |
| ELDC-20
Abstract: M513 MACP-008125-CK07F0 MACP-008125-CK07TB 
 | Original | 5-1000MHz MACP-008125-CK07F0 ELDC-20. MACP-008125-CK07F0 SM-55 SM-127 ELDC-20 M513 MACP-008125-CK07TB | |
| SAC387
Abstract: BS219 SAC387 solder multicore solder wire Multicore 96SC 97Cu3 LMP62 solder wire HMP Loctite 414 MSDS Multicore savbit 
 | Original | ||
| Contextual Info: HIGH TEMPERATURE SMPS STACKED CAPACITORS HTS Consult factory for requirements above 250°C GENERAL RECOMMENDATIONS FOR SOLDERING CERAMIC STACKED CAPACITORS In general, Presidio recommends against hand soldering for this type of large ceramic device. However, if the | Original | HT0805XHT473K1Q5R | |
| Contextual Info: FlipChip series FC platinum sensor For the automatic assembling on PCB by soldering or bonding Benefits & Characteristics ▪▪ Excellent long-term stability ▪▪ Optimal price-performance ratio ▪▪ Minimum space consumption on PCB ▪▪ Bondable versions available | Original | ||
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| din 43760
Abstract: DIN IEC 68 din IEC 68 soldering 
 | Original | T2-20, 1000h din 43760 DIN IEC 68 din IEC 68 soldering | |
| DIN EN 60751Contextual Info: Platinum Temperature Sensors FC – Product Series Temperature Range: –50°C.+150/250/400/600°C Platinum temperature sensor elements in FC Flip Chip construction Soldering junction (reflow solderable) Technical Data Specification: DIN EN 60751 | Original | ||
| Contextual Info: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HT HIGH TEMPERATURE DESIGNATION — CODE “HT” This code signifies that the parts are designed for high temperature use and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C are acceptable for these capacitors, in terms | Original | ||
| Contextual Info: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HT HIGH TEMPERATURE DESIGNATION — CODE “HT” This code signifies that the parts are designed for high temperature use and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C are acceptable for these capacitors, in terms | Original | ||
| Contextual Info: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HIGH TEMPERATURE DESIGNATION Code “HT”: This code signifies that the parts are designed for high temperature use, and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C are acceptable for these capacitors, in terms of the inherent | Original | ||
| hmp solderContextual Info: HIGH TEMPERATURE CERAMIC CAPACITORS Consult factory for requirements above 250°C * Contact factory regarding NPQ dielectric DIELECTRIC CHARACTERISTICS CHARACTERISTICS NPO/NPQ* DIELECTRIC XHT DIELECTRIC X7R DIELECTRIC OPERATING TEMPERATURE RANGE -55°C to 250°C | Original | ||
| Contextual Info: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HIGH TEMPERATURE DESIGNATION Code “HT”: This code signifies that the parts are designed for high temperature use, and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C are acceptable for these capacitors, in terms of the inherent | Original | ||
| Contextual Info: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HT HIGH TEMPERATURE DESIGNATION — CODE “HT” This code signifies that the parts are designed for high temperature use and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C are acceptable for these capacitors, in terms | Original | HT0805XHT473K1Q5R | |
| dielectricContextual Info: HIGH TEMPERATURE CERAMIC CAPACITORS Consult factory for requirements above 250°C * Contact factory regarding NPQ dielectric DIELECTRIC CHARACTERISTICS CHARACTERISTICS NPO/NPQ* DIELECTRIC XHT DIELECTRIC X7R DIELECTRIC OPERATING TEMPERATURE RANGE -55°C to 250°C | Original | ||
| presidio X7RContextual Info: HIGH TEMPERATURE CERAMIC CHIP CAPACITORS HT HIGH TEMPERATURE DESIGNATION Code “HT”: This code signifies that the parts are designed for high temperature use, and have followed the Group A testing program of the “HR” type listed in our catalog. Temperatures of 250°C | Original | SOLDERING/T08 presidio X7R | |