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HK6077 Datasheets Context Search
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Contextual Info: 4 3 i _2 REVISIONS SYM 1 ECN DESCRIPTION HK6077 DATE FIRST RELEASE APPROVED 1 / 2 6 / ’ 10 IP RECOMMENDED PCB LAYOUT G eneral to le re n c e is ± 0 .0 5 m m NOTES : 1. M aterial: Plastic: High therm o p la s tic ,U L 9 4 V -0 ,B la c k |
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HK6077 1000MG |