HIGH SPEED PCB DESIGN Search Results

Contextual Info: F-212-1 LSS–120–03–FM–DV–A TM LSS–130–02–LM–DV–A–K 0,635mm .025" LSS SERIES LSS–140–01–LM–DV–A SYSTEM HIGH SPEED HERMAPHRODITIC STRIP High Speed/High Density SPECIFICATIONS Mates with: LSS For complete specifications and recommended PCB layouts

MAVCML0027

Abstract: MAVCML0032 MAVCML0033 MAVCML0035 MAVCML0036 vco using varactor diode for carrier generation power varactor construction of varactor diode
Contextual Info: MAVCMLSeries V2 Surface Mount TO8 Voltage Controlled Oscillators Features • • • • • • • Extremely Linear Tuning High Tuning Speed Low Phase Noise Surface Mount PCB Hermetically Sealed Suitable for High Reliability Applications Custom Designs Available

HFE4023-323

Contextual Info: 28 January 1998 HFE4023-323/ABA High Speed Fiber Optic LED FEATURES • High speed: 150 MHz • Optimized for linear optical output with drive currents between 10 and 50 mA • Wave solderable • SMA pcb mounting fiber optic connector • Popular straight lead, low profile package

hmzd connector

Contextual Info: tifca Internal Equipment Connection Backplane 2 .5 0 mm Centreline Electronics ATCA / Advanced TCA Connectors • Designed specifically for high speed differential applications ■ Designed to PICMG 3.0 Standards ■ Additional PCB retention hardware not required

c850

Abstract: 255 marking code c650 diode fultec C650 C650-180-WH GR-1089 GR-974 C65C
Contextual Info: PL IA NT CO M *R oH S Features Applications • Formerly ■ Combo voice / xDSL linecards ■ ■ Voice linecards brand Extremely high speed performance Blocks high voltages and currents Very high bandwidth; GHz compatible Small package, minimal PCB area Simple, superior circuit protection

resistor packs

Abstract: TN1046 LTC3718 QDR pcb layout
Contextual Info: ORSPI4 PCB Design Guidelines for SPI4.2 and QDR Memory Controller Interfaces November 2003 Technical Note TN1046 Introduction The ORSPI4 has several electrical interfaces for high-speed data transfer to other components. This note will discuss and highlight the system design considerations when implementing board designs using the ORSPI4. This

54AC11181

Abstract: TI018
Contextual Info: 54AC11181, 74AC11181 ARITHMETIC LOGIC UNITS/FUNCTION GENERATORS T I0184— D 3119, APRIL 1989— REVISED MARCH 1990 Flow-Through Architecture to Optimize PCB Layout 54AC11181 . . . JT PACKAGE 74AC11181 . . . DW OR NT PACKAGE TOP VIEW Minimize High-Speed Switching Noise

PIN photodiode 850 nm

Abstract: HFD3002 850 nm LED
Contextual Info: 18 September 1997 HFD3002-002/ABA Silicon PIN Photodiode FEATURES • Low capacitance • High speed: t² = 30 ns max. at Vß = 5 V; 10 ns max. at Vß = 15 V • High responsivity • SMA pcb mounting fiber optic connector • Housing electrically isolated

erm8

Contextual Info: F-212 ERM8–013–05.0–S–DV–DS–L–TR ERM8–030–02.0–S–DV–TR 0,80mm .0315" ERM8–060–05.0–L–DV–TR ERM8 SERIES RUGGED HIGH SPEED HEADER SPECIFICATIONS Board Mates: ERF8 For complete specifications and recommended PCB layouts see

54ACT11021

Abstract: 74ACT11021 D2957
Contextual Info: 54ACT11021, 74ACT11021 DUAL 4-INPUT POSITIVE-AND GATES SCAS012B – D2957, JULY 1987 – REVISED APRIL 1993 • • • • Inputs Are TTL-Voltage Compatible Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise

ADN4663

Contextual Info: Dual, 3 V, CMOS, LVDS High Speed Differential Driver ADN4663 ±15 kV ESD protection on output pins 600 Mbps 300 MHz switching rates Flow-through pinout simplifies PCB layout 300 ps typical differential skew 700 ps maximum differential skew 1.5 ns maximum propagation delay

Contextual Info: 74AC11008 QUADRUPLE 2-INPUT POSITIVE-AND GATE SCAS014C – AUGUST 1987 – REVISED APRIL 1996 D D D D D D, N, OR PW PACKAGE TOP VIEW Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise

QsH rt1

Abstract: QTH rt1
Contextual Info: F-212 QSH–060–01–L–D–DP–A QSH–060–01–L–D–A–K 0,50mm .0197" QSH–030–01–F–D–A–RT1 QSH SERIES HIGH SPEED GROUND PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QSH

74AC11620

Contextual Info: 74AC11620 OCTAL BUS TRANSCEIVER WITH 3–STATE OUTPUTS SCAS062A – JULY 1987 – REVISED APRIL 1993 • • • • • DW OR NT PACKAGE TOP VIEW Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise

Sockets equivalent

Contextual Info: I The use of sockets in networking gear provides the advantages of reparability, lower service costs, future expansion, and manufacturing ease. Whether the need is for reduced sized sockets supporting PCB real estate constraints or sockets to address high speed requirements, AMP has an array of sockets

Contextual Info: 74ACT11004 HEX INVERTER SCAS215B – JANUARY 1988 – REVISED JUNE 1997 D D D D D D DB, DW, N, OR PW PACKAGE TOP VIEW Inputs Are TTL-Voltage Compatible Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise

Contextual Info: HFE4003-02X/XXX High Speed Fiber Optic LED FEATURES • Highspeed: 150 MHz • Optimized for linear optical output with drive currents between 10 mA and 100 mA • Wave solderable • Mounting options SMA single hole ST single hole SMA PCB STPCB SMA 4 hole

Contextual Info: 74ACT11004 HEX INVERTER SCAS215B – JANUARY 1988 – REVISED JUNE 1997 D D D D D D DB, DW, N, OR PW PACKAGE TOP VIEW Inputs Are TTL-Voltage Compatible Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise

Contextual Info: 74AC11158 QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER SCAS071 – JULY 1989 – REVISED APRIL 1993 • • • • • DW OR N PACKAGE TOP VIEW Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise

smd diode r5a

Abstract: R7B Connector smd j1a jack p2 3.5mm R5B transistor smd r4b smd r5b L2 SOT23-8
Contextual Info: DEM-OPA2652E EVALUATION FIXTURE DESCRIPTION COMPONENTS Components that have RF performance similar to the ones in Table I may be substituted. The DEM-OPA2652E demonstration board is an unpopulated printed circuit board PCB for the high speed dual op amps in SOT23-8 packages. Figure 1

SMD resistors 364

Abstract: smd R2C smd transistor r4c smd transistor R5B smd transistor r5c OPA3680U OPA3681U OPA3682U
Contextual Info: DEM-OPA368xU EVALUATION FIXTURE DESCRIPTION COMPONENTS Components that have RF performance similar to the ones in Table I may be substituted. The DEM-OPA368xU demonstration board is an unpopulated printed circuit board PCB for the high speed triple op amps with disable available in SO-16

Contextual Info: 74AC11158 QUADRUPLE 2ĆLINE TO 1ĆLINE DATA SELECTOR/MULTIPLEXER ą ą SCAS071 − JULY 1989 − REVISED APRIL 1993 • • • • • DW OR N PACKAGE TOP VIEW Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise

Contextual Info: 74AC11157 QUADRUPLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER SCAS183 – D2957, JULY 1989 – REVISED APRIL 1993 • • • • • DW OR N PACKAGE TOP VIEW Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise

VME COnnector

Contextual Info: Data downloaded from http://www.angliac.com - the website of Anglia - tel: 01945 474747 har•link connector system The connector system of HARTING complies with the requirements of IEC 61 076-4-107 and is a compact and robust pcb-to-cable interface with excellent data transmission properties for high-speed