HERMETIC PACKAGES PCB LAND Search Results

qfn 32 land pattern

Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

SOD-323 land pattern

Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
Contextual Info: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

smema

Abstract: land pattern for TSOP ultrasonic bond tensile-strength soft solder die bonding IPC-SM-780 TO metal package aluminum kovar dual beam laser land pattern for SOP material composition of chip capacitors
Contextual Info: CHAPTER 13 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.

SOT333

Abstract: SOT423 sot468 thermal compound wps II TO metal package aluminum kovar SOT439 Transistor Packages sot262 SOT443 rf transistor smd pages
Contextual Info: Philips Semiconductors RF transmitting transistor and power amplifier fundamentals 4 RF and microwave transistor packages RF AND MICROWAVE TRANSISTOR PACKAGES handbook, halfpage The packages of electronic devices are, in general, designed to: metal cap – Protect the electronics from mechanical damage

IPC-SM-780

Contextual Info: 2 Glossary 1/17/97 11:08 AM GLOSSARY.DOC INTEL CONFIDENTIAL until publication date 2 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide(s) access to the surface of the land in one or more layers of the board.

CERAMIC PIN GRID ARRAY wire lead frame

Abstract: IPC-SM-780 nickel corrosion electroplating
Contextual Info: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.

IPC-SM-780

Contextual Info: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.

SAA7136E

Abstract: saa7136 SAA7135 TO-220F JEDEC SAA7134 hso16 philips SAA7134 SAA7131E Philips SAA7130 SAA7133
Contextual Info: PCI Digital A/V Decoders PCI DIGITAL AUDIO/VIDEO DECODERS Typenumber SAA7130H SAA7134H SAA7133H SAA7135H SAA7131E SAA7136E SAA7136HS PCI PCI PCI PCI PCI PCI PCI Description Digital Audio/Video Decoders Digital Audio/Video Decoders Digital Audio/Video Decoders

smd t2a

Abstract: smd t2a 01 SP-T2B SP-T1A SP-T1B
Contextual Info: SP-T Series Surface Mount Quartz Crystal Units for Low Frequencies FEATURES • Plastic mold package incorporated tubular type quartz crystal. • Suitable for automatic and high density surface mounting. • Excellent shock and heat resistance. APPLICATIONS

MIL-C-26482 interchangeable KPD series

Abstract: 16 3 PIN CIRCULAR MS CONNECTORS D SUB connector ITT Cannon veam cir 290
Contextual Info: Interconnect Solutions Cannon, VEAM, BIW and over 20 billion interconnects Interconnect Solutions Product Portfolio Cannon, VEAM, BIW A Historical Achievement Approaching Nearly a Century of Technology Innovation THINK ITT Reliability, Engineered Solutions, and Interconnect Science these terms collectively describe ITT

hitachi tuffy

Abstract: smd glass diode color codes TR1141 TF1154 smd glass zener diode color codes tuffy TF-1150 Zener diode smd marking code 5t TR-1141 medical application of ultrasonic waves
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky Diodes

Contextual Info: FEATURE ARTICLE PAGE 1 • NOVEMBER 2009 www.mpdigest.com The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky Diodes by Rick Cory, Skyworks Solutions, Inc. Introduction he incessant drive to miniaturize electronic systems places pressure on semiconductor manufacturers to offer ever-smaller components. This trend is rapidly

gold embrittlement

Abstract: ADXL278 application note ADXL278 ADXL78 AN-652 cte table LCC-8 LCC-8 land pattern ADXL193 IPC-SM-782
Contextual Info: AN-652 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/326-8703 • www.analog.com Considerations for Soldering Accelerometers in LCC-8 Packages onto Printed Circuit Boards By Hubert Geitner

PGA68

Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
Contextual Info: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE

D2863-77

Abstract: Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208
Contextual Info: GENERAL INFORMATION Packages INTRODUCTION P lastic surface-mount package designs were developed in the late 1970s in answer to the demand for costeffective solutions to achieving greater board density without sacriÞcing reliability or functionality. Recent developments in these

Contextual Info: SP-T Series Surface Mount Quartz Crystal Units for Low Frequencies New FEATURES • Low height 2.0mm max. • Plastic mold package incorporated tubular type quartz crystal. • Suitable for automatic and high density surface mounting. • Excellent shock and heat resistance.

DIP-16L

Abstract: BD429B
Contextual Info: Device Engineering Incorporated BD429/BD429A/BD429B/BD429C ARINC 429/RS-422 Line Driver 385 E. Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: admin@deiaz.com Integrated Circuit Features: • ARINC 429 Line Driver for HI speed (100 kHz) and LOW speed (12.5 kHz) data rates

land pattern for TSOP 2 86 PIN

Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS

dei0429-wms

Abstract: BD429A-G BD429A DEI0429-NES DEI0429-WMB BD429 MS-018-AB ARINC429 BD429B-G 5V RS422
Contextual Info: Device Engineering Incorporated BD429/BD429A/BD429B/BD429C ARINC 429/RS-422 Line Driver 385 E. Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: admin@deiaz.com Integrated Circuit Features: • ARINC 429 Line Driver for HI speed (100 kHz) and LOW speed (12.5 kHz) data rates

DEI0429

Abstract: DEI0429-WMB BD429A-G BD429B DEI0429-NMS DEI0429-NES BD429 MS-030-AC BD429-G ARINC
Contextual Info: Device Engineering Incorporated BD429/BD429A/BD429B/DEI0429 ARINC 429/RS-422 Line Driver 385 E. Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: admin@deiaz.com Integrated Circuit Features: • ARINC 429 Line Driver for HI speed (100 kHz) and LOW speed (12.5 kHz) data rates

BD429A

Contextual Info: Device Engineering Incorporated BD429/BD429A/BD429B/BD429C ARINC 429/RS-422 Line Driver 385 E. Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: admin@deiaz.com Integrated Circuit Features: • ARINC 429 Line Driver for HI speed (100 kHz) and LOW speed (12.5 kHz) data rates

BD429A

Abstract: ARINC 739 BD429A1 hermetic packages PCB land DEI0429-NES dei0429-wmb DEI-0429-WMB dei0429-wms 125KB BD429-G
Contextual Info: Device Engineering Incorporated BD429/BD429A/BD429B/BD429C ARINC 429/RS-422 Line Driver 385 E. Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: admin@deiaz.com Integrated Circuit Features: • ARINC 429 Line Driver for HI speed (100 kHz) and LOW speed (12.5 kHz) data rates

w2 mark 5 pin mosfet smd

Abstract: Philips SC07 Small-signal Transistors transistor bf 175
Contextual Info: For an update of this information, please go to the package website. SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

transistor smd G46

Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
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