HELIUM LEAK RATES AND TESTING Search Results
HELIUM LEAK RATES AND TESTING Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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DE6B3KJ101KA4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6B3KJ331KB4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6E3KJ102MN4A | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6E3KJ472MA4B | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6B3KJ331KA4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
HELIUM LEAK RATES AND TESTING Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Helium Leak Rates and TestingContextual Info: Introduction to Hermetic Connectors A Helium Leak Rates and Testing Hermeticity Hermeticity is defined as “the state or condition of being airtight”. Sophisticated military electronics enclosures can experience electrical failure from ingress of moisture. System engineers can design the enclosure to withstand exposure |
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cc/10 cc/100 cc/24 cc/30 cc/3000 Helium Leak Rates and Testing | |
IEC749
Abstract: Hybrid Memory Products Krypton-85 202F leak
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consid5x10-8 1x10-7 1x10-6 IEC749 Hybrid Memory Products Krypton-85 202F leak | |
Contextual Info: Gla ss-to -m e ta l s e a l hermetic connectors military qpl and commercial connectors for harsh environment air-tight-seal applications APRIL 2013 mission critical high pressure hermetics Resolve gas, moisture, and particle ingress problems with advanced performance glasssealed hermetic connectors—the world’s |
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Mil-DTL-38999 MIL-DTL-24308 1X10-7 1X10-10 comp100 | |
IPC-T-50
Abstract: JEDEC JESD22-B116 free NCSL Z540.3 MIL-STD-883H EIA/JESD22-B116 ultrasonic atomizer Infant Radiant Warmer JESD22-B116 JEDEC JESD22-B116 free download Hybrid Microcircuits GENERAL INSTRUMENT
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MIL-STD-883H MIL-STD-883G STD883 IPC-T-50 JEDEC JESD22-B116 free NCSL Z540.3 MIL-STD-883H EIA/JESD22-B116 ultrasonic atomizer Infant Radiant Warmer JESD22-B116 JEDEC JESD22-B116 free download Hybrid Microcircuits GENERAL INSTRUMENT | |
210895
Abstract: 22-0150
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lst292x LST3821, LST3921 LST292X QP0044) LST282X QB000112 QB000211 QB000217 QB000323 210895 22-0150 | |
210895
Abstract: hfbr series LST282X LST292X LST3821 LST3921 197412 HFBR 5000 CMAC 20063
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LST292X QP0044) LST282X/LST292X QB000217 QB000323 QB000324 QB000326 QB000415 QB000416 QB000426 210895 hfbr series LST282X LST3821 LST3921 197412 HFBR 5000 CMAC 20063 | |
in-process quality inspections
Abstract: mitsubishi metal oxide varistor 011AT phase controlled thyristers MITSUBISHI GATE TURN-OFF THYRISTOR gto thyristor handbook design GTO switching test mitsubishi conclusion of zener diode voltage report 4000BX-90DA zener diode reliability fit
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capture and electronic packaging
Abstract: teledyne Microelectronics microwave transceiver specification Optical-Pressure-Sensor Optic-Pressure-Sensor military relay pro mechanica Arrayed Waveguide Grating DAR090709 TOSA
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AG100714 DAR090709 capture and electronic packaging teledyne Microelectronics microwave transceiver specification Optical-Pressure-Sensor Optic-Pressure-Sensor military relay pro mechanica Arrayed Waveguide Grating DAR090709 TOSA | |
Pi filter array design
Abstract: Pi capacitor tubular Tubular Pi type capacitor LC PI FILTER DESIGN mil-dtl-38999 assembly procedures Beacon ferrite space qualified Pi tubular capacitor MIL-DTL-38999 series II
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MIL-DTL-38999 Pi filter array design Pi capacitor tubular Tubular Pi type capacitor LC PI FILTER DESIGN mil-dtl-38999 assembly procedures Beacon ferrite space qualified Pi tubular capacitor MIL-DTL-38999 series II | |
chn 610Contextual Info: PRECISION BULK METAL FOIL “ TE CHN OL OG Y “ GLOSSARY a c o m p a n y V I S H A of Y VISHAY RESISTORS ACCURACY: The degree to which the measured value of resistance approximates the specified value of resistance. This is normally expressed in percent deviation but in precision resistor work, the percent is often so small that the results are |
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Contextual Info: APPLICATION NOTES 4 W HAT ARE JAN COM PONENTS? W HAT ARE JAN S COM PONENTS? JAN components are standard 1N" type devices, MIL quali fied and subjected to environmental and life sample tests to assure quality conformance. The JAN devices are 100% tested, lot traceable, and are subjected to other tests as |
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K1135A
Abstract: K1135B K1135 K1135C 8210 microprocessor ultrasonic receiver MOTOROLA ultrasonic generator 1 Mhz 5A/K1135
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K1135 K1135A, K1135B, K1135C. K1135A K1135B R-29-3-24C K1135C 8210 microprocessor ultrasonic receiver MOTOROLA ultrasonic generator 1 Mhz 5A/K1135 | |
TRU200D
Abstract: M1014 TRU200
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TRU200 C105264493 C105313472 C105360424 C105264089 C106733587 C105659726 C106733595 TRU200D TRU200D M1014 | |
electrolytic ELITEContextual Info: QUALITY ASSURANCE and RELIABILITY PROGRAM 1. Introduction Samsung utilizes rigorous qualification and reliability programs to monitor the integrity of its devices. All industry stan dard {and various non-standard} stresses are run. Testing is done not only to collect data, but also to detect trends |
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KSC945 KSD288 KSD288 168HRS) 200CYC) electrolytic ELITE | |
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K1135
Abstract: EK1135 K1135A K1135B
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K1135Series K1135 K1135A, K1135B, 1135B R-29-3-24C EK1135 K1135A K1135B | |
dlva
Abstract: transmission line model orcad pspice 24 GHz Microwave Sensor surface mount htcc capture and electronic packaging E8257C manual 86142B 8703A E4407B Flip Chip on flex
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SC090624 DAR060930 MIL-PRF-38534, MIL-STD-883 D6-82479 D1-9000 MIL-STD-790, MIL-PRF-28750, dlva transmission line model orcad pspice 24 GHz Microwave Sensor surface mount htcc capture and electronic packaging E8257C manual 86142B 8703A E4407B Flip Chip on flex | |
Contextual Info: Glossary Vishay Foil Resistors Bulk Metal Foil Technology Glossary of Terms ACCEPTABLE QUALITY LEVEL AQL : The maximum percent defective (or maximum number of defects per hundred units) that, for the purpose of sampling inspection, can be considered satisfactory as a process average. Defects may be |
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Contextual Info: Quality and Reliabilty Introduction Superior integrated circuit device reliability is attained when it is an integral part of process devel opment, design and manufacturing. This section describes the methodology used by the IBM Micro electronics Division to achieve robust DRAM |
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Contextual Info: Quality and Reliabilty Introduction Superior integrated circuit device reliability is attained when it is an integral part of process devel opment, design and manufacturing. This section describes the methodology used by the IBM Micro electronics Division to achieve robust DRAM |
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he804
Abstract: ati connector HE809 smd diode ED MMSD32032602S-C-xx Microspire MB he807 eurofarad TCN30 MMEE08510804S-C-xx mmfl16016604s-c mmfl16016604s-d
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cecc 50000Contextual Info: RELIABILITY REPORT RELIABILITY AND FAILURE M ECHANISMS FUNDAM ENTALS In its sim plest form the failure rate at a given tem perature is: F.R. : -Through accelerated stresses we ascertain the value of the com ponents failure rates, in term s of how many devices (in percent) are expected to fail |
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failures/10 cecc 50000 | |
Contextual Info: QUARTZ CRYSTALS GTS Reeves FREQUENCY PRODUCTS Crystal Product Summary The following is a brief summary of the crystal units offered by CTS Reeves. We offer a broad range of crystal products that include: • Low Frequency Crystals; NT, DT, 5X10 kHz to 1 MHz |
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arstechContextual Info: Proceedings of IPACK2007 ASME InterPACK '07 July 8-12, 2007, Vancouver, British Columbia, CANADA IPACK2007-33870 CLOSED LOOP LIQUID COOLING FOR HIGH PERFORMANCE COMPUTER SYSTEMS Sukhvinder Kang kang@aavid.com David Miller John Cennamo Aavid Thermalloy LLC, |
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IPACK2007 IPACK2007-33870 D2570-96 arstech | |
atm lu 738Contextual Info: RELIABILITY REPORT RELIABILITY AND FAILURE M ECHANISMS FUNDAM ENTALS -Through accelerated stresses we ascertain the value of the com ponents failure rates, in term s of how many devices in percent are expected to fail every 1000 hours of operation (X or F.R.) |
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failures/10 100cC/watt atm lu 738 |