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    HEDT-9040, Search Results

    HEDT-9040, Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    78290-409HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail. PDF
    93690-407-16LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch. PDF
    69190-406HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 06 Positions, 2.54 mm (0.100in) Pitch. PDF
    69190-402001HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 02 Positions, 2.54 mm (0.100in) Pitch. PDF
    69190-404
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 04 Positions, 2.54 mm (0.100in) Pitch. PDF

    HEDT-9040, Datasheets (2)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    HEDT-9040
    		Agilent Technologies High Temperature 140°C Three Channel Optical Incremental Encoder Module Original PDF 245.55KB 9
    HEDT-9040
    		Hewlett-Packard High Temperature 140-C Three Channel Optical Incremental Encoder Modules Original PDF 279.55KB 10