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54112-109061700LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10131319-0612100LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
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10132449-0611GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing. |
PDF
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10127819-06121LF
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Amphenol Communications Solutions
|
Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 6 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
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10131319-06111G0LF
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Amphenol Communications Solutions
|
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 6 Positions, GW Compatible Nylon66, Tray Packing. |
PDF
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