HEATSINK U FORM Search Results

Contextual Info: Package outline HBGA584: plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT707-1 A ball A1 index area A E A2 A1 detail X C e1 b e AH AF AD AB Y V T P M K H F D B AJ AG e AE AC AA W heatsink U e2 R N L

Contextual Info: Package outline HBGA600: plastic thermal enhanced ball grid array package; 600 balls; body 40 x 40 x 0.9 mm; heatsink B D SOT605-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y F B AJ AG AE e AC heatsink AA e2 R M D AL U T P H N L J

Contextual Info: Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y V T P M K H F D B AJ AG AE e AC heatsink AA W U e2 R N

Contextual Info: Package outline HBGA504: plastic thermal enhanced ball grid array package; 504 balls; body 35 x 35 x 0.9 mm; heatsink B D SOT604-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AF AB T F D B heatsink R M H e AA U P K AE AC W V y ∅w M C AG AD Y y1 C

Contextual Info: Package outline HBGA520: plastic thermal enhanced ball grid array package; 520 balls; heatsink SOT1088-1 B D A D1 ball A1 index area A j A2 E1 E A1 detail X C e1 e AF AD AB Y V AE AC AA e W heatsink U T R P e2 N M L K 1/2 e J H G F E D C B A 1 shape 2 optional 4x

Contextual Info: Package outline HBGA329: plastic, thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink SOT714-1 B D A D1 ball A1 index area A j A2 A1 E1 E detail X C e1 b e AC AB AA Y W V U T R P N M L K J H G F E D C B A e heatsink e2 1 shape

Contextual Info: Package outline HBGA552: plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT706-1 A ball A1 index area A E A2 A1 detail X C e1 b e AH AF Y AE e AC AA W V heatsink U T e2 R P N M L K J H G F E D C B A 1

Contextual Info: Package outline HBGA324: plastic thermal enhanced ball grid array package; 324 balls; heatsink SOT1123-2 B D D1 A ball A1 index area E1 j E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e heatsink e2

Contextual Info: Package outline HBGA352: plastic, heatsink ball grid array package; 352 balls; body 35 x 35 x 0.9 mm B D SOT546-2 A ball A1 index area A2 E A1 A A3 detail X e1 b e AE AC AA W U R N L J G E C A C v M B ZD1 ∅w M y y1 C v M A AF AD AB e Y heatsink V T P e1

Contextual Info: Package outline HBGA324: plastic thermal enhanced ball grid array package; 324 balls; heatsink SOT1123-1 B D D1 A ball A1 index area E1 j E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e heatsink e2

Contextual Info: Package outline HBGA360: plastic, thermal enhanced ball grid array package; 360 balls; heatsink SOT1163-1 B D D1 A ball A1 index area E1 j E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e heatsink e2

Contextual Info: l e l u o m Semiconductor, Inc. TC622 TC624 LOW COST, SINGLE TRIP POINT TEMPERATURE SENSOR FEATURES • ■ ■ ■ Temperature Set Point Easily Programs with a Single External Resistor Operates with 2.7V Power Supply TC624 TO-220 Package for Direct Mounting to Heatsink

d0311

Abstract: Schottky 2,1A 40v MTBF
Contextual Info: Technical Specification IQ1BxxxHPXxx 66-160V 3.3-48V 255W 3000V dc Half-brick Continuous Input Outputs Max Power REINFORCED INSULATION DC-DC Converter A N @ 48 T U PC 5V O IN V -1 IQ 66 High efficiency, 91% at full rated load current Delivers full power with minimal derating - no heatsink required

PC1215

Abstract: BPC35
Contextual Info: :m ic q n d u c to r T m GBPC 12,15, 25, 35 SERIES H O L E FOR # 1 0 S C R E W Features 0.22 5.59i • Integrally m olded heatsink provided very low therm al resistance for maximum heat dissipation. GBPC 0.25(6.35 • Surge overload rartings from 300 am peres to

Contextual Info: Package outline Ceramic single-ended flat package; heatsink mounted; 2 mounting holes; 12 in-line tin Sn plated leads SOT347B D y U q A P F S U1 G E L 1 12 e Z b c v A w M Q A 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c D E e F G

Contextual Info: Package outline Ceramic single-ended flat package; heatsink mounted; 1 mounting hole; 11 in-line gold-metallized leads SOT451A D y U A p F S U1 G E L 1 11 e b c v A w M Q A 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A b c D E e F G L p

Contextual Info: Package outline HBGA456: plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink SOT900-1 B D A D1 ball A1 index area A j A2 E1 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C AF AD AB Y AE AC AA e W V U T R

Contextual Info: Package outline HBGA736: plastic thermal enhanced ball grid array package; 736 balls; heatsink SOT1035-1 B D D1 A ball A1 index area E1 j E A2 A A1 detail X e1 e C ∅v ∅w b 1/2 e AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E

Contextual Info: Package outline HBGA624: plastic thermal enhanced ball grid array package; 624 balls; heatsink SOT1095-1 B D D1 A ball A1 index area j E1 E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D

Contextual Info: Package outline HBGA456: plastic thermal enhanced ball grid array package; 456 balls; heatsink SOT610-1 B D A D1 ball A1 index area j E1 E A2 A A1 detail X C e1 e ∅v ∅w b 1/2 e AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A M y y1 C C A B C

Contextual Info: Package outline HBGA640: plastic thermal enhanced ball grid array package; 640 balls; heatsink SOT1151-1 B D D1 A ball A1 index area E1 E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e e2

Contextual Info: Package outline HBGA543: plastic thermal enhanced ball grid array package; 543 balls; heatsink SOT1142-1 B D D1 A ball A1 index area E1 j E A A2 A1 detail X e1 e AF AD AA V R M J F C AC Y U P L H E 1/2 e ∅v ∅w b AE C C A B C y y1 C e AB W T e2 N 1/2 e

Contextual Info: Package outline HBGA432: plastic thermal enhanced ball grid array package; 432 balls; heatsink SOT1119-1 B D A D1 ball A1 index area E1 j E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e

SME2411BGA-66

Abstract: W48C60
Contextual Info: microsystems November 1998 UltraSPARC -!!/ CPU Module DATA SHEET 333/360 M Hz CPU, 2MB E-cache, UPA64S, 66 M Hz PCI F u n c t io n a l D e s c r ip t io n The UltraSPARC™-IIi CPU Module ^ is a high performance, SPARC V9-compliant, small form-factor proces­