HEATSINK FOR STUD DEVICES Search Results

Contextual Info: P 4SEMIKRON, leading manufacturer of diode thyristor power semicondictor modules !    # $ &-# ./01203 % & ' ()*      +#* )(4 &-#()./(-203 )(5  %  +#* , -0 Dimensions in mm Heatsink For stud devices P4 Features   

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semikron

Contextual Info: P 30       " #$%&$ " #$%+$ " #$&$$ % & #      ! %'$ $!* %') (##!* &'$ (#$!* " #$#$$ # %') (#-!*    !  % %', %') &', Heatsink Dimensions in mm For stud devices P 30 Features         

Contextual Info: P 31       " #$$%& " #$%&& $ %      ! $'&# &!* $'#& (+&!* " #$#&& # $'#- (.+!*  Heatsink   !  $'$ $', %'- Dimensions in mm For stud devices P 31 Features               

Contextual Info: P 31       " #$$%& " #$%&& $ %      ! $'&# &!* $'#& (+&!* " #$#&& # $'#- (.+!*  Heatsink   !  $'$ $', %'- Dimensions in mm For stud devices P 31 Features               

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SEMIKRON

Contextual Info: P 0,8     #*+",# #*+"'#   "   !"##$%     $ #*-,  & ! '  %     )$ #*".  "*/' " #*'0 #*" "*+  Dimensions in mm Heatsink For stud devices P 0,8 Features         1    

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P-12

Contextual Info: P 1,2       *(## (   ! "#$%     '$ ()( ()**## * ()#   & '$  #)+ (),* Dimensions in mm Heatsink For stud devices P 1,2 Features         1              

P-12

Contextual Info: P 1,2       *(## (   ! "#$%     '$ ()( ()**## * ()#   & '$  #)+ (),* Dimensions in mm Heatsink For stud devices P 1,2 Features         1              

Contextual Info: P4 !    # $ &-# ./01203 % & ' ()*      +#* )(4 &-#()./(-203 )(5  %  +#* , -0 Dimensions in mm Heatsink For stud devices P4 Features             1            

Contextual Info: P4 !    # $ &-# ./01203 % & ' ()*      +#* )(4 &-#()./(-203 )(5  %  +#* , -0 Dimensions in mm Heatsink For stud devices P4 Features             1            

heatsink

Contextual Info: K9        % *       %& (+, !,&#   !" #     %& $ ' -+-, Dimensions in mm Heatsink For stud devices K9 Publish Data Features         1               

semikron K3

Contextual Info: K3        %  *+       %& (,* !*- &#   !" #     %& $ ' .,+ Dimensions in mm Heatsink For stud devices K3 Publish Data Features         1               

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Contextual Info: C3        * +,"# ,   ! "#$%     $  & ! '  %     )$  "-" #-.+ #-. Dimensions in mm Heatsink For stud devices C3 Features         1              

DIN ISO 1302

Abstract: ISO 1302 DC340
Contextual Info: Mounting Instructions Montagehinweise The IXYS Semiconductor devices are thoroughly checked before leaving the factory. To avoid any damage during mounting, please note the following instructions. IXYS Leistungshalbleiter verlassen das Werk nach Prüfung in

IXAN0027

Abstract: DIN iso 1302 ISO 1302 DC340 DIN ISO 965 DIN 1302
Contextual Info: IXAN0027 Mounting Instructions Montagehinweise The IXYS Semiconductor devices are thoroughly checked before leaving the factory. To avoid any damage during mounting, please note the following instructions. IXYS Leistungshalbleiter verlassen das Werk nach Prüfung in

Penetrox A-13

Abstract: CMK450B19M CMK450B25M penetrox A SCX13 penetrox a 13 450B19M 1500B34M CMK1500B34M 450B25M
Contextual Info: M ounting Procedures It is important to observe the correct mounting procedures when using Power Semiconductors to ensure effective cooling, good current conduction and reliability. Heatsink preparation is a vital part of the procedure . 1 ALUMINIUM HEATSINKS w for CAPSULE and FLAT BASE devices:Apply a small amount of mounting grease(b) to the heatsink. Scrub the heatsink area with a wire brush (a

SOT333

Abstract: SOT423 sot468 thermal compound wps II TO metal package aluminum kovar SOT439 Transistor Packages sot262 SOT443 rf transistor smd pages
Contextual Info: Philips Semiconductors RF transmitting transistor and power amplifier fundamentals 4 RF and microwave transistor packages RF AND MICROWAVE TRANSISTOR PACKAGES handbook, halfpage The packages of electronic devices are, in general, designed to: metal cap – Protect the electronics from mechanical damage

P4855-1

Abstract: Ablestik Transistor Substitution 1993 2088AB belleville washer 33702 SIL-PAD density 208ab 2088a 814a
Contextual Info: Order this document by AN1040/D MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1040 MOUNTING CONSIDERATIONS FOR POWER SEMICONDUCTORS Prepared by: Bill Roehr Staff Consultant, Motorola Semiconductor Sector TABLE OF CONTENTS Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

thermafilm

Abstract: 2088AB thermasil EB107/D sync nut eb107 ierc heatsink richco Silicone Rubber 35 Shore A thermafilm 1 mhw 592
Contextual Info: AN1040/D Mounting Considerations For Power Semiconductors http://onsemi.com Prepared by: Bill Roehr APPLICATION NOTE INTRODUCTION Current and power ratings of semiconductors are inseparably linked to their thermal environment. Except for lead–mounted parts used at low currents, a heat exchanger

2088AB

Abstract: eb107 TO-210AA Package AAVID THERMALLOY COMPOUND 250 814a TO-210AB TRANSISTOR SUBSTITUTION DATA BOOK 1993 AN1040 DO-203AA DO-203AB
Contextual Info: Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE . Archived 2005 MOTOROLA Order this document by AN1040/D AN1040 NOTE: The theory in this application note is still applicable, but some of the products referenced may be discontinued. Mounting Considerations for Power