HEAT SINKS Search Results
HEAT SINKS Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| UE36C2620005011 |
|
1x2 QSFP-DD cage with open top and heat sink clip, no heat sink | |||
| U79A1123041 |
|
XFP CAGE WITHOUT HEAT SINK | |||
| U79A1123031 |
|
XFP CAGE WITHOUT HEAT SINK | |||
| U79A1Z1200A |
|
XFP CAGE WITH HEAT SINK | |||
| U79A1212001 |
|
XFP CAGE WITH HEAT SINK |
HEAT SINKS Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| Heatsinks | ABL Heatsinks | TO-66, TO-3, TO-9 Heatsinks | Scan | 217.92KB | 4 |
HEAT SINKS Price and Stock
Sensata Technologies HK1Relay Sockets & Hardware SSR Mounting Hardware Kit |
|||||||||||
| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
|
HK1 | Each | 100 | 50 |
|
Buy Now | |||||
Sensata Technologies HS259DRRelay Sockets & Hardware Heatsink 2.5deg C/W DIN Rail Mnt |
|||||||||||
| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
|
HS259DR | Each | 10 |
|
Buy Now | ||||||
OMRON ELECTRONICS LLC J1MOTORHEATSINK.SHORT.I4HUNKNOWN |
|||||||||||
| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
|
J1MOTORHEATSINK.SHORT.I4H | 1 |
|
Buy Now | |||||||
HEAT SINKS Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: Accessories Heat Sinks Power-One has a wide range of standard and specialized heat sinks available for our converters. Shown below are standard product heat sinks. The heat sink kits include the heat sink, thermal pad, and mounting hardware. On horizontal heat |
Original |
HAS/HBC/HBCS/HHSK-HBX500-24H HSK-HBX500-45H HSK-HBX500-60H HSK-HBX500-95H HSK-HBX500-24V HSK-HBX500-45V HSK-HBX500-60V HSK-TQD500-95H HSK-TQD500-24V HSK-TQD500-45V | |
050234
Abstract: LGA1257 heat pipes
|
Original |
||
050074
Abstract: heat pipes X5570 E5520 E5530 LGA1366 E5506 heat pipes intel
|
Original |
||
E5520
Abstract: LGA1366 E5530 E5506 heat pipes E5540
|
Original |
||
050232
Abstract: Intel Xeon 5500 heat pipes LGA1366 X5570 AAvid 050232 Xeon 5500 X557
|
Original |
||
050235
Abstract: heat pipes E5520 E5504 E5530 LGA1366 E5506 shinetsu
|
Original |
||
CRYDOM ssr panel mount
Abstract: Heat Sinks heat sink what is an Relay HS50 HS351 HS271DR solid state relay
|
Original |
||
050075
Abstract: E5540 LGA1366 Intel Xeon 5500 l5520 heat pipes E5506 W3520 E5520 E5530
|
Original |
||
050233
Abstract: E5504 Aavid thermalloy 9000 heat pipes intel E5520 E5530 LGA1366 x.25 intel E5506 aavid
|
Original |
||
|
Contextual Info: CHEMTRONICS CW7250 Technical Data Sheet CircuitWorks Boron Nitride Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Boron Nitride Heat Sink Grease facilitates heat transfer away from electrical/electronic components and into heat sinks. The material |
Original |
CW7250 MIL-C-47113 | |
|
Contextual Info: Extruded Heat Sinks for DC/DC Converters 14 Heat sinks for “Full-Brick” DC/DC Converters Heat sinks for “Full-Brick” DC/DC Converters Standard mounting slots mate with Vicor DC/DC converters. Optimized aluminum extruded fin construction transfers heat efficiently |
Original |
RT3830C00000 RT3835C00000 RT3845C00000 RT3840C00000 RT3830C00000 RT3835C00000 RT3840C00000 | |
|
Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES |
Original |
O-126, O-202, O-218 O-220 | |
642-45ABContextual Info: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 660 SERIES Standard P/N 660-29AB ̆ Unidirectional Fin Heat Sink for PowerPC™ 603 32 mm, 40 mm C4QFP Base Dimensions in. mm Height in. (mm) Heat Sink Finish |
Original |
660-29AB 642-25AB 642-35AB 642-45AB 642-60AB 642-45AB | |
80486DX
Abstract: AMD 80486DX AM486TMdx4 helium gas sensor module 80486DX2 AM29030 AM486 heat sink Heat Sinks 80486DX intel
|
Original |
80486DX, AM29030 662-15AG 628-20AB 628-25AB 628-35AB 628-40AB 628-65AB 80486DX2TM, AM486TMDX2, 80486DX AMD 80486DX AM486TMdx4 helium gas sensor module 80486DX2 AM29030 AM486 heat sink Heat Sinks 80486DX intel | |
|
|
|||
|
Contextual Info: 901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vette’s 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more! These heat sinks are designed for air flow applications. Enclosed pages |
Original |
||
|
Contextual Info: heatsink C40 Heat Sink System The C40 Series Heat Sink System Patent Pending offers flexible, high performance and compact heat sinks with an exchangeable cam clip system for TO247, TO-264 and SOT-227 (clip in development) devices. This powerful heat sink can be thru-hole |
Original |
O-264 OT-227 C40-058-VE C40-058-AE CLA-T247-21E O-247 O-264 1-866-9-OHMITE | |
|
Contextual Info: Technical Data July, 2010 3M Thermally Conductive Interface Pads 5592 and 5592S Product Description 3M™ Thermally Conductive Interface Pads 5592 and 5592S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. |
Original |
5592S 5592S 225-3S-06 | |
573300D00000G
Abstract: 411399
|
Original |
||
|
Contextual Info: Technical Data July, 2010 3M Thermally Conductive Interface Pads 5595 and 5595S Product Description 3M™ Thermally Conductive Interface Pads 5595 and 5595S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. |
Original |
5595S 5595S 225-3S-06 | |
|
Contextual Info: Technical Data December 2013 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These |
Original |
5519S 5519S 225-3S-06 | |
PF435
Abstract: PF434 PF436 PF432G PF435G 576802B04000G PF432 576802B03100G PF436G PF433
|
Original |
O-220 O-262 PF436G PF432, PF433, PF434, PF435, PF436 PF435 PF434 PF436 PF432G PF435G 576802B04000G PF432 576802B03100G PF436G PF433 | |
Heat SinksContextual Info: HEAT SINKS FOR LEDs Preliminary JTI – HEAT SINKS FOR POWER LEDs 882 SERIES – RADIAL FIN HEAT SINK FOR “STAR” LED PACKAGES Wakefield's new 882 series heat sinks can be used with LEDs in the star package from Lumileds, Osram, and others. The radial design and |
Original |
||
zif rodContextual Info: – THERMAL MANAGEMENT PRODUCTS CATALOG www.ctscorp.com CTS TABLE OF CONTENTS PAGE HI-TEMP FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES 10 ZIF STANDARD CIRCUIT BOARD RETAINERS |
Original |
O-126, O-202, O-218 O-220 zif rod | |
QTM-500
Abstract: 5519S 5519
|
Original |
5519S 5519S 225-3S-06 QTM-500 5519 | |