HEAT SINKS Search Results

050235

Abstract: heat pipes E5520 E5504 E5530 LGA1366 E5506 shinetsu
Contextual Info: Xeon 5500 Series Blade High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,

Contextual Info: Extruded Heat Sinks for DC/DC Converters 14 Heat sinks for “Full-Brick” DC/DC Converters Heat sinks for “Full-Brick” DC/DC Converters Standard mounting slots mate with Vicor DC/DC converters. Optimized aluminum extruded fin construction transfers heat efficiently

642-45AB

Contextual Info: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 660 SERIES Standard P/N 660-29AB ̆ Unidirectional Fin Heat Sink for PowerPC™ 603 32 mm, 40 mm C4QFP Base Dimensions in. mm Height in. (mm) Heat Sink Finish

80486DX

Abstract: AMD 80486DX AM486TMdx4 helium gas sensor module 80486DX2 AM29030 AM486 heat sink Heat Sinks 80486DX intel
Contextual Info: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs 662 SERIES Pin Fin Heat Sink for Limited Height Applications for Intel 80486DX, AMD AM29030 17 x 17 PGA Standard P/N Base Dimensions in. mm Height in. (mm) Heat Sink

MATERIAL SAFETY DENATURED ALCOHOL

Abstract: TC-2707
Contextual Info: Technical Data November 2011 3M Thermally Conductive Interface Pads 5591 and 5591S Product Description 3M™ Thermally Conductive Interface Pads 5591 and 5591S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.

Contextual Info: Technical Data July, 2010 3M Thermally Conductive Interface Pads 5592 and 5592S Product Description 3M™ Thermally Conductive Interface Pads 5592 and 5592S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.

573300D00000G

Abstract: 411399
Contextual Info: Slalom Surface Mount Heat Sink for D2PAK RoHS Compliant SLALOM SURFACE MOUNT HEAT SINK Aavid Thermalloy introduces it newest innovation in SMT compatible heat sinks to meet the needs of newer higher power semiconductors. The heat sinks’ unique design Patent Pending combines the technology of

Contextual Info: Technical Data July, 2010 3M Thermally Conductive Interface Pads 5595 and 5595S Product Description 3M™ Thermally Conductive Interface Pads 5595 and 5595S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.

Contextual Info: Technical Data December 2013 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These

PF435

Abstract: PF434 PF436 PF432G PF435G 576802B04000G PF432 576802B03100G PF436G PF433
Contextual Info: TO-220 & TO-262 Heat Sinks Plug in style heat sink featuring four spring action clips FIGURE B FIGURE A 14.48 0.570 MAX 19.05 (0.750) Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to

Heat Sinks

Contextual Info: HEAT SINKS FOR LEDs Preliminary JTI – HEAT SINKS FOR POWER LEDs 882 SERIES – RADIAL FIN HEAT SINK FOR “STAR” LED PACKAGES Wakefield's new 882 series heat sinks can be used with LEDs in the star package from Lumileds, Osram, and others. The radial design and

zif rod

Contextual Info: – THERMAL MANAGEMENT PRODUCTS CATALOG www.ctscorp.com CTS TABLE OF CONTENTS PAGE HI-TEMP FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES 10 ZIF STANDARD CIRCUIT BOARD RETAINERS

QTM-500

Abstract: 5519S 5519
Contextual Info: Technical Data February 2012 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These products consist

AAVID 1020

Abstract: 7106D 573100D00010 573100D00000 573300D00010 573400D00010 7109D 573300D00000 TO-263 footprint
Contextual Info: Surface Mount Heat Sinks For D-PAK, D2 PAK, D3 PAK, and SO-10 SURFACE MOUNT HEAT SINKS Aavid’s line of low profile surface mount heat sinks are suitable for SMT power semiconductor devices in D-PAK, D2PAK, D3PAK and SO-10 packages.Their unique design removes heat indirectly through conduction without making

ebonol

Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

8810

Abstract: Tape UL746A MH17478 UL746C UL-746A UL-746C UL-746C silicone rubber E213134 adhesive rubber based msds
Contextual Info: Technical Data April, 2008 3M Thermally Conductive Adhesive Transfer Tapes 8805 • 8810 • 8815 • 8820 Product Description 3M™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices e.g., fans, heat spreaders

ebonol

Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

680-125220

Abstract: TO-220 footprint Heat Sinks 680-5K 680-125A 680-Series TO66 PLASTIC package 6903b 6805A
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES HIghest Efficiency/Lowest Unit Cost Heat Sinks Height Above PC Board in. mm Standard P/N Thermal Performance at Typical Load Natural Forced Convection Convection Outline Dimensions

274-1-AB

Abstract: 274-1ab 274-2AB 240-118ABH-22 273-AB 273-AB-01 274-1AB-01 281-1AB 240-118ABS-22 2743a
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 273 SERIES Low-Cost, Low-Height Wavesolderable Heat Sinks Height Above PC Board in. mm Standard P/N Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style

624-25AB

Abstract: IN625
Contextual Info: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for 21mm BGAs Standard P/N Base Dimensions in. Sq. Fin Height “A” in. mm Typical Applications Adhesive Options

TUBE 1625

Abstract: MO-169 217-36CT6 230-75AB-10 230-75AB-01 217-36CTT6 234-75AB-05
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOL-20 MECHANICAL DIMENSIONS BOARD LAYOUT RECOMMENDATIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESDMaterial with Nail Stops

Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Self-Locking Wavesolderable Heat Sinks 233 AND 236 SERIES Standard P/N PATENT PENDING Height Above PC Board in. mm Footprint Dimensions in. (mm) TO-220 Mounting Solderable Configuration Tab Options

TO-220 footprint

Abstract: 235-85AB 243-3PAB 239-75AB-04 235-85AB-01
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 235 SERIES Standard P/N Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Height Above PC Board in. mm Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting

0.3mm pitch BGA

Abstract: vme 3u board standards 4-40 Kapton Washer led matrix 16X16 c2929 rod 456 LAT03B5U PGA zif socket 478 t410 TRANSISTOR up3-to3-b
Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS CTS Electronic Components - California CTS ® TABLE OF CONTENTS PAGE CORPORATE PROFILE 2 ADHESIVE PEEL AND STICK HEAT SINKS 3 FORGED HEAT SINKS WITH PLATE FINS 4 FORGED HEAT SINKS WITH PIN FINS