HEAT SINK FOR DIODE Search Results

J137

Abstract: nissei capacitor nissei capacitors capacitor list nissei datasheet G32A-A20-VD G32A-A430 capacitor list nissei G3PA-220B-VD i2t graph phototriac
Contextual Info: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. (Except for

Contextual Info: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 695 SERIES Standard P/N 695-1B Space-Saving Heat Sinks for Small Stud-Mounted Diodes Maximum Width in. mm Height in. (mm) 1.330 (33.8) 0.530 (13.7) Mount and effectively heat sink small stud-mounted diodes with the 695 Series

rf transmitter circuit diagram

Abstract: laser transmitter circuit diagram block diagram for catv optical fiber transmitter Ortel model 1611 Ortel laser Block Diagram and ortel 1611 lucent DFB laser application ORTEL DFB laser circuit diagram of rf transmitter
Contextual Info: Application Note October 2000 Introduction to the 3641-Type Transmitter Subassembly Features The 3641-type is mounted to an OEM transmitter main assembly using six screws for rapid, secure contact with the main assembly’s heat sink. The heat sink should be designed with large fins and be able

BR5005L-G

Contextual Info: COMCHIP Silicon Bridge Rectifiers SMD Diodes Specialist BR5005L-G Thru. BR5010L-G Reverse Voltage: 50 to 1000V Forward Current: 50A RoHS Device Features BR-L Metal Heat Sink -Plastic case with heatsink for heat dissipation. -Surge overload -500 Amperes peak.

1123 smd

Abstract: BR5010l marking code EA SMD BR5005L-G
Contextual Info: COMCHIP Silicon Bridge Rectifiers SMD Diodes Specialist BR5005L-G Thru. BR5010L-G Reverse Voltage: 50 to 1000V Forward Current: 50A RoHS Device Features BR-L Metal Heat Sink -Plastic case with heatsink for heat dissipation. -Surge overload -500 Amperes peak.

G3PA-210BL-VD

Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.

G3PA-210BL-VD

Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.

Contextual Info: HRW2502B-Silicon Schottky Barrier Diode for Rectifying Features Pin Arrangement • Low forward voltage drop and suitable for high effifiency rectifying. • Full molded fin enables easy insulation from heat sink. Ordering Information Type No. Laser Mark

G3PA-210BL-VD

Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-450B-VD-2
Contextual Info: Solid State Relays G3PA CSM_G3PA_DS_E_2_1 Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.

Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.

G3PA-210BL-VD

Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-430B-VD-2 G3PA-450B-VD-2
Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.

Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.

Contextual Info: Solid State Relays G3PA CSM_G3PA_DS_E_3_1 Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.

EN60947

Abstract: EN6094 G32A-A10-VD G3PA-210B-VD DC5-24 G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G32A-A430 G3PA-240B-VD
Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.

W1002

Contextual Info: HRW1002B-Silicon Schottky Barrier Diode for Rectifying Features Pin Arrangement • Low forward voltage drop and suitable for high effifiency rectifying. • Full molded fin enables easy insulation from heat sink. 1 2 3 Ordering Information Type No.

TO220FM

Abstract: W1002 Hitachi DSA001653
Contextual Info: HRW1002B Silicon Schottky Barrier Diode for Rectifying ADE-208-241A Z Rev. 1 Aug. 1994 Features • Low forward voltage drop and suitable for high effifiency rectifying. • Full molded fin enables easy insulation from heat sink. Ordering Information Type No.

Contextual Info: STD02N and STD02P Darlington Transistors for Audio Amplifiers Features and Benefits Description Built-in temperature compensation diodes High power 130 W handling in a small package (TO-3P), for minimized heat sink requirements Built-in drivers and temperature compensation diodes,

HRW2502B

Contextual Info: HRW2502B Silicon Schottky Barrier Diode for Rectifying HITACHI ADE-208-243B Z Rev. 2 Jan. 1996 Features • Low forward voltage drop and suitable for high effifiency rectifying . • Full molded fin enables easy insulation from heat sink. Ordering Information

diode hitachi schottky

Abstract: HRW1002B
Contextual Info: HRW1002B Silicon Schottky Barrier Diode for Rectifying HITACHI ADE-208-241A Z Rev. 1 Aug. 1994 Features • Low forward voltage drop and suitable for high effifiency rectifying. • Full molded fin enables easy insulation from heat sink. Ordering Information

diode lt 445

Contextual Info: ADE-208-243B Z HRW2502B Silicon Schottky Barrier Diode for Rectifying HITACHI Features Rev. 2 Ja n .1996 Pin Arrangement • Low forward voltage drop and suitable for high effifiency rectifying. • Full molded fin enables easy insulation from heat sink.

Contextual Info: STD03N and STD03P Darlington Transistors for Audio Amplifiers Features and Benefits Description Built-in temperature compensation diodes High power 160 W handling in a small package (TO-3P), for minimized heat sink requirements Built-in drivers and temperature compensation diodes,

W1002

Contextual Info: ADE-208-241 A Z HRW1002B Silicon Schottky Barrier Diode for Rectifying HITACHI Features Rev. 1 Aug. 1994 Pin Arrangement • Low forward voltage drop and suitable for high effifiency rectifying. • Full molded fin enables easy insulation from heat sink.

Hitachi DSA001653

Contextual Info: HRW2502B Silicon Schottky Barrier Diode for Rectifying ADE-208-243B Z Rev. 2 Jan. 1996 Features • Low forward voltage drop and suitable for high effifiency rectifying . • Full molded fin enables easy insulation from heat sink. Ordering Information Type No.

Contextual Info: STD01N and STD01P Darlington Transistors for Audio Amplifiers Features and Benefits Description Built-in temperature compensation diodes High power 100 W handling in a small package (TO-3P), for minimized heat sink requirements Built-in drivers and temperature compensation diodes,