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    HEAT SINK FOR 304 POINT BGA Search Results

    HEAT SINK FOR 304 POINT BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    LQW18CN4N9D0HD
    		Murata Manufacturing Co Ltd Fixed IND 4.9nH 2600mA POWRTRN PDF
    LQW18CNR33J0HD
    		Murata Manufacturing Co Ltd Fixed IND 330nH 630mA POWRTRN PDF
    DFE322520F-R47M=P2
    		Murata Manufacturing Co Ltd Fixed IND 0.47uH 8500mA NONAUTO PDF
    DFE32CAH4R7MR0L
    		Murata Manufacturing Co Ltd Fixed IND 4.7uH 2800mA POWRTRN PDF
    LQW18CNR27J0HD
    		Murata Manufacturing Co Ltd Fixed IND 270nH 750mA POWRTRN PDF

    HEAT SINK FOR 304 POINT BGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    elina fan

    Abstract: 3dfx heat sink for 304 point BGA 2319B 658-35AB VSC870 VSC880 100C G53034-0 192 BGA PACKAGE thermal resistance
    Contextual Info: VITESSE SEMICONDUCTOR CORPORATION Application Note Thermal Management for the VSC870, VSC880 AN-36 Thermal Management The VSC870 and VSC880 backplane devices can use standard heat sinks to keep their junction temperatures within the specified limits. Both devices come in a thermally enhanced BGA package. Several types of


    Original     		VSC870, VSC880 AN-36 VSC870 VSC880 G53034-0, elina fan 3dfx heat sink for 304 point BGA 2319B 658-35AB 100C G53034-0 192 BGA PACKAGE thermal resistance PDF

    IPC-9702

    Abstract: BGA PACKAGE thermal resistance Freescale JESD51-9 Freescale Tape Ball Grid Array Overview freescale 352 tbga ipc 9702 motherboard ga 151C C151C 181C
    Contextual Info: Freescale Semiconductor Tape Ball Grid Array TBGA Overview TM Revision 0 – 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. Freescale


    Original     		30C/60% 125degC. IPC-9702 BGA PACKAGE thermal resistance Freescale JESD51-9 Freescale Tape Ball Grid Array Overview freescale 352 tbga ipc 9702 motherboard ga 151C C151C 181C PDF

    LCS-68

    Abstract: 821575-1 LCS-84 1-382320-7 821574-1
    Contextual Info: Selecting Sockets for Altera Devices January 1998, ver. 2 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board


    Original     		PDF

    Yamaichi IC51-0444-1568

    Abstract: IC51-0444-1568 LCS-68 PQFP ALTERA 160 LCS-68-12 IC51-1444-1354-7 IC51-2084-1052-11 IC51-1004-809 Framatome Connectors IC51
    Contextual Info: Selecting Sockets for Altera Devices January 1999, ver. 3 Introduction Application Note 80 Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board PCB layout, different soldering processes for production


    Original     		PDF

    BGA reflow guide

    Abstract: JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile
    Contextual Info: Solder Reflow Guide for Surface Mount Devices June 2009 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which


    Original     		TN1076 1-800-LATTICE BGA reflow guide JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile PDF

    D48X

    Abstract: 11 ak 30 a4
    Contextual Info: Package Diagrams October 2004 16-Pin Plastic DIP Package Dimensions in Inches -BN/2 b1 1 WITH LEAD FINISH 5 E 6 CL E1 c1 c N SEE DETAIL A BASE METAL (b) SECTION Z-Z CL BASE PLANE -A- D c 5 6 eA Z Z 4 A2 A eB 7 -CSEATING PLANE .015 A1 L b2 10 b .010 GAGE


    Original     		16-Pin D48X 11 ak 30 a4 PDF

    84 pin plcc lattice dimension

    Abstract: C045
    Contextual Info: Package Diagrams November 2003 16-Pin Plastic DIP Package Dimensions in Inches -BN/2 b1 1 WITH LEAD FINISH E 5 6 CL E1 c1 c N SEE DETAIL A BASE METAL (b) SECTION Z-Z CL BASE PLANE c 5 -A- D 6 eA Z Z 4 A2 A eB 7 -C.015 SEATING PLANE A1 L b2 10 b .010 GAGE


    Original     		16-Pin 84 pin plcc lattice dimension C045 PDF

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo PDF

    3256E

    Contextual Info: ispLSI 3256E In-System Programmable High Density PLD Functional Block Diagram G3 H0 A0 A1 OR Array A2 A3 ORP ORP • IN-SYSTEM PROGRAMMABLE — 5V In-System Programmable ISP using Lattice ISP or Boundary Scan Test (IEEE 1149.1) Protocol — Increased Manufacturing Yields, Reduced Time-toMarket, and Improved Product Quality


    Original     		3256E 3256E-100LQ1 304-Pin 3256E-100LQA 3256E-100LB320 320-Ball 3256E-70LQ1 3256E-70LQA 3256E PDF

    AEG PS 431 relay manual

    Abstract: AEG PS 431 relay protocol caterpillar cat data link ford eec V relay AEG PS 431 LM304 HD9063 Murphy Controller TTD
    Contextual Info: an Enovation Controls Brand an Enovation Controls Brand ECONTROLS, INC 5311 South 122nd East Avenue Tulsa, Oklahoma 74146 USA Phone: +1 918 317 4100 Fax: +1 918 317 4266 E-mail: sales@fwmurphy.com Website: www.fwmurphy.com 5757 Farinon Drive San Antonio, Texas 78249 USA


    Original     		122nd AEG PS 431 relay manual AEG PS 431 relay protocol caterpillar cat data link ford eec V relay AEG PS 431 LM304 HD9063 Murphy Controller TTD PDF

    BGA 256 PACKAGE power dissipation

    Abstract: motorola transistor t75 PPC604E
    Contextual Info: SA14-2054-00 IBM Order Number MPC604E9VEC/D (Motorola Order Number) 7/96 TM Advance Information PowerPC 604e RISC Microprocessor Family: PID9v-604e Hardware Specifications The PowerPC 604e microprocessor is an implementation of the PowerPC™ family of reduced


    OCR Scan     		SA14-2054-00 MPC604E9VEC/D 604eTM PID9v-604e 604TM MPC604e PPC604e. Topic20. BGA 256 PACKAGE power dissipation motorola transistor t75 PPC604E PDF

    48V-to-12V

    Abstract: smd TRANSISTOR marking T1
    Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K120T15 Vin = 42 - 53 V Vout = 10.5 - 13.25 V Iout = 12.5 A K = 1/4 Rout = 32 mΩ max • 48V to 12V V•I Chip Converter • >96% efficiency • 150 Watt 225 Watt for 1 ms • 125°C operation • High density – up to 600 W/in3


    Original     		B048K120T15 11/03/10M 48V-to-12V smd TRANSISTOR marking T1 PDF

    marking code SMD Transistor 2ak

    Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
    Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste PDF

    3256E

    Contextual Info: ispLSI 3256E Device Datasheet June 2010 All Devices Discontinued! Product Change Notifications PCNs have been issued to discontinue all devices in this data sheet. The original datasheet pages have not been modified and do not reflect those changes. Please refer to the table below for reference PCN and current product status.


    Original     		3256E 3256E 3256E-70LB320 3256E-100LB320 3256E-70LQA 3256E-100LQA 3256E-70LQA1 3256E-100LQA1 PDF

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    GE4F

    Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
    Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00 PDF

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


    Original     		PDF

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Contextual Info: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A PDF

    panasonic inverter dv 707 manual

    Abstract: 018T A423 Mosfet FTR 03-E Arcotronics 1.27.6 nsl 7053 mkp DX 3500 manual Honeywell DBM 01A Polyester capacitors 823k 250V SPRAGUE powerlytic 36Dx sprague 68D
    Contextual Info: PASSIVE COMPONENTS Resistors Networks and Arrays Bourns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 590, 591, 592 Caddock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593 CTS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 594


    Original     		PDF

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing PDF

    ep330

    Abstract: CLASSIC EPLD FAMILY altera EP1810
    Contextual Info: Operating Requirements for Altera Devices March 1995, ver. 6 Datasheet A ltera devices com bine unique program m able logic architectures w ith advanced C M O S processes to p rovid e exceptional perform ance and re lia b ility. To m aintain the highest possible perform ance and re lia b ility of


    OCR Scan     		PDF

    P1020EC

    Abstract: P1020E P1020 QorIQ P1020 QorIQ dhrystone RGMII to SGMII bridge P1020DDR boot configuration pins in p1020 SDHC physical layer 3P1020
    Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: P1020EC Rev. M, 02/2011 P1020 P1020 QorIQ Integrated Processor Hardware Specifications The following list provides an overview of the feature set: • Dual high-performance 32-bit cores, built on Power


    Original     		P1020EC P1020 P1020 32-bit 36-bit P1020E QorIQ P1020 QorIQ dhrystone RGMII to SGMII bridge P1020DDR boot configuration pins in p1020 SDHC physical layer 3P1020 PDF

    cpcap motorola audio

    Abstract: motorola DSR 505 A0-A21 DSP56600 DSP56652 CTS 366 Nippon capacitors cpcap motorola mcu cpcap motorola 3.2 51
    Contextual Info: Order this document by: DSP56652/D Rev 1, 1/99 MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56652 Advance Information INTEGRATED CELLULAR BASEBAND PROCESSOR Motorola designed the ROM-based DSP56652 to support the rigorous demands of the cellular subscriber market. The high level of on-chip integration in the DSP56652 minimizes application


    Original     		DSP56652/D DSP56652 DSP56652 32-bit DSP56600 cpcap motorola audio motorola DSR 505 A0-A21 CTS 366 Nippon capacitors cpcap motorola mcu cpcap motorola 3.2 51 PDF

    matrix m21

    Abstract: VSC870 VSC880 X11011
    Contextual Info: VITESSE SEMICONDUCTOR CORPORATION Datasheet High Performance 16 x16 Serial Crosspoint Switch VSC880 Features • Supports Variable Length Packets in Packet Mode • 16 X 16 Synchronous Serial Cross Point Switch • Serial Data Rates are 2.0Gb/s • Built-in Flow Control Channel in Packet Mode


    Original     		VSC880 32Gb/s 32Gb/s VSC870 1300mV 1000mV. VSC880TY2 0-70oC 0-85oC G52191-0, matrix m21 VSC870 VSC880 X11011 PDF