HEAT SINK DESIGN TOSHIBA Search Results

equivalent 2sk2837 mosfet

Contextual Info: Power MOSFET Heat Sink Design Power MOSFET in Detail 6. Heat Sink Design 6.1 Maximum Allowable Power Dissipation and Radiation Equivalent Circuits When the circuit has been designed for fully adequate thermal stability, the maximum allowable power dissipation PDmax for power MOSFETs can be determined based on the power MOSFET’s

J137

Abstract: nissei capacitor nissei capacitors capacitor list nissei datasheet G32A-A20-VD G32A-A430 capacitor list nissei G3PA-220B-VD i2t graph phototriac
Contextual Info: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. (Except for

G3PA-210BL-VD

Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-450B-VD-2
Contextual Info: Solid State Relays G3PA Refer to Warranty and Application Considerations page 1 , Safety Precautions (page 4), and Technical and Safety Information (page 6). Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink.

G3PA-210BL-VD

Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.

G3PA-210BL-VD

Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.

G3PA-210BL-VD

Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-430B-VD-2 G3PA-450B-VD-2
Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.

Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.

Contextual Info: Solid State Relays G3PA CSM_G3PA_DS_E_3_1 Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.

G3PA-210BL-VD

Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-450B-VD-2
Contextual Info: Solid State Relays G3PA CSM_G3PA_DS_E_2_1 Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.

Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.

EN60947

Abstract: EN6094 G32A-A10-VD G3PA-210B-VD DC5-24 G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G32A-A430 G3PA-240B-VD
Contextual Info: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.

G3PA

Abstract: TOSHIBA DIODE CATALOG Wiring Duct G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD
Contextual Info: Solid State Relays G3PA CSM_G3PA_DS_E_2_2 Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.

TL12

Abstract: TL12W01-D TL12W02-D TL12W02-L
Contextual Info: Application note for Power LED 1 Application note for Power LED (1) <Thermal design for TL12series> 1. Introduction Applications for LED lamps are increasing in many fields, such as cellular phones, automotive interiors/exteriors, amusement equipment, signs/displays and consumer electronic devices. Toshiba provides various

TD62064AFG

Abstract: TD62064 TD62064APG TD62074AFG TD62074APG DARLINGTON SINK DRIVER TD62074
Contextual Info: TD62064,074APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62064APG,TD62064AFG,TD62074APG,TD62074AFG 4ch High-Current Darlington Sink Driver The TD62064APG/AFG and TD62074APG/AFG are high-voltage, high-current darlington drivers comprised of four

TA7267BP

Abstract: YG6260 working of fused tube light using diodes TOSHIBA DIODE GLASS MOLD
Contextual Info: [ 2 ] Handling Precautions [ 2 ] Handling Precautions 1. Using Toshiba Semiconductors Safely TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity

ignition coil npn power darlington

Abstract: HSOP16 TD62064 TD62064BFG TD62064BP1G
Contextual Info: TD62064BP1G/BFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62064BP1G,TD62064BFG 4ch High-Current Darlington Sink Driver The TD62064BP1G and TD62064BFG are high-voltage, high-current darlington drivers comprised of four NPN darlington pairs. All units feature integral clamp diodes for

2SB553

Contextual Info: TO SH IBA 2SB553 TOSHIBA TRANSISTOR SILICON PNP TRIPLE DIFFUSED TYPE PCT PROCESS 2SB553 INDUSTRIAL APPLICATIONS Unit in mm HIGH CURRENT SWITCHING APPLICATIONS. POWER AMPLIFIER APPLICATIONS. 10.3MAX, Low Collector Saturation Voltage : v CE(sat)= —0.4V (Max.) at 1C= -4 A

TD62064AP

Abstract: td62064af equivalent ic ignition coil npn power darlington TD62064AF TD62064AP DIP-16
Contextual Info: TD62064AP/AF TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62064AP, TD62064AF 4ch High-Current Darlington Sink Driver The TD62064AP/AF is high-voltage, high-current darlington drivers comprised of four NPN darlington pairs. All units feature integral clamp diodes for switching inductive

Contextual Info: TD62318BPG/BFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318BPG,TD62318BFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318BPG and TD62318BFG are non-inverting transistor array which are comprised of four NPN darlington output stages

Contextual Info: TD62308AP/AF TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62308AP,TD62308AF 4ch Low Input Active High-Current Darlington Sink Driver The TD62308AP/AF is a non−inverting transistor array which is comprised of four NPN darlington output stages and PNP

Contextual Info: TD62318APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318APG,TD62318AFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318APG and TD62318AFG are non-inverting transistor arrays which are comprised of four NPN darlington output stages

TD62308APG

Abstract: ignition coil npn power darlington TD62308AFG
Contextual Info: TD62308APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62308APG,TD62308AFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62308APG/AFG is a non−inverting transistor array which is comprised of four NPN darlington output stages and

HSOP16-P-300-1

Contextual Info: TD62318BPG/BFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318BPG,TD62318BFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318BPG and TD62318BFG are non-inverting transistor array which are comprised of four NPN darlington output stages

TD62318AFG

Abstract: TD62318APG
Contextual Info: TD62318APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318APG,TD62318AFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318APG and TD62318AFG are non-inverting transistor arrays which are comprised of four NPN darlington output stages