HEAT SINK COPPER AREA Search Results

Contextual Info: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION 6 5 3 2 20 LOC ALL RIGHTS RESERVED. BY - 4 1 2 D GP MATERIAL: CAGE ASSEMBLY: 0.25mm THICK NICKEL SILVER ALLOY EMI SPRINGS: COPPER ALLOY HEAT SINK: ALUMINUM HEAT SINK CLIP: STAINLESS STEEL.

Contextual Info: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 2010 RELEASED FOR PUBLICATION 6 5 4 3 2 2010 LOC GP ALL RIGHTS RESERVED. BY - CAGE ASSEMBLY MATERIAL: NICKEL SILVER, 0.25 THICK HEAT SINK MATERIAL: ALUMINUM HEAT SINK CLIP MATERIAL: STAINLESS STEEL EMI SPRING MATERIAL: COPPER ALLOY

AMPLIFIER 5W

Abstract: NTE1116
Contextual Info: NTE1116 Integrated Circuit Audio Power Amplifier, 5W Description: The NTE1116 is a monolithic integrated circuit designed for use as a low frequency class B amplifier. The external cooling tabs enable 2.5 watts of output power to be achieved without the use of an external heat sink and 5 watts of output power using a small area of the P.C. board copper as a heat sink.

Thermal Management

Abstract: Heatsinks for 14 pin dip 16 pin dip with heat sink njm3717 NJM3771 NJM3772 NJM3774 NJM3770A NJM3777
Contextual Info: Thermal Management New JRC’s stepper motor ICs are power Ics encapsulated in Dual in Line DIP , EMP and PLCC (Plastic Leaded Chip Carrier) packages. The silicon die is directly bonded to a heat-spreading lead-frame for efficient heat-transfer to an external heat sink, or to a copper ground plane on the printed circuit board.

Contextual Info: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION BY - 6 4 3 2 20 LOC GP ALL RIGHTS RESERVED. FIN TYPE HEAT SINK 1 MATERIAL: CAGE ASSEMBLY - NICKEL-SILVER ALLOY. EMI SPRINGS - COPPER ALLOY. HEATSINK - ALUMINUM. HEATSINK CLIP - STAINLESS STEEL.

N10015

Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

ebonol

Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

217-36CTT6

Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

mosfet SOA testing

Abstract: AN9409 RFP70N06 RFD3055 mosfet transistor checking and testing 407 transistor
Contextual Info: Safe Operating Area Testing Without A Heat Sink Application Note Introduction Most manufacturers of PowerMOS transistors specify the Safe Operating Area for their devices at 25oC case temperature and derate them linearly to zero at the maximum rated junction temperature. The circuits to maintain a fixed current

ebonol

Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

AN9409

Abstract: transistors 9409 477J mosfet SOA testing Harris Semiconductor to220 power transistor RFD3055 RFP70N06 DB233 transistors+9409
Contextual Info: Harris Semiconductor No. AN9409 Harris Power MOSFETs August 1994 SAFE OPERATING AREA TESTING WITHOUT A HEAT SINK Authors: Wally Williams and Stan Benczkowski Introduction package at a very predictable rate since constant power circuits are usually used in SOA testing. There is also heat flow

mosfet SOA testing

Abstract: AN-7516 RFD3055 RFP70N06 TO-251 fairchild
Contextual Info: Safe Operating Area Testing Without A Heat Sink Application Note Introduction Title N94 bt AFE ERING REA STG THUT AT NK utho eyrds er ) OCI O frk geode setes OCEW frk Most manufacturers of PowerMOS transistors specify the Safe Operating Area for their devices at 25oC case temperature and derate them linearly to zero at the maximum rated

ebonol

Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

mosfet SOA testing

Abstract: AN-7516 RFD3055 RFP70N06 TO-251 fairchild
Contextual Info: Safe Operating Area Testing Without A Heat Sink Application Note Introduction Title N75 ubct AFE PERTING REA ESTG ITHUT EAT NK) utho ) eyords reor ) OC FO fark ageode seute OCEW fark Most manufacturers of PowerMOS transistors specify the Safe Operating Area for their devices at 25oC case temperature and derate them linearly to zero at the maximum rated

ebonol

Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

AMPLIFIER 5W TBA800

Abstract: TBA800 TBA-800 tba 396
Contextual Info: L I NEAR I N T E G R A T E D C I R C U I T TBA 800 AUDIO POWER AMPLIFIER The TBA 800 is an m on olith ic integrated pow er am p lifie r in a 12-lead quad in -lin e plastic package. The external coo lin g tabs enable 2.5 W ou tput pow er to be achieved w ith out external he a t-sin k and 5 W ou tput pow er using a sm all area of the P.C.

Contextual Info: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

SIL-PAD to-247

Abstract: ASTM-A228 SIL-PAD 1000 TO 247 SIL-PAD density Tgon 800 A228 A366 MV102
Contextual Info: Ohmite introduces the M series, patented Pat. No. 7,151,669 , high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. It is the ideal type

SIL-PAD density

Abstract: ASTM-A228 A228
Contextual Info: Ohmite introduces the M series, patented Pat. No. 7,151,669 , high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. It is the ideal type

TO-268

Contextual Info: • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets • Unique aluminum extrusion

pcb board of miniskiip 2

Abstract: miniskiip board MiniSKiiP 1 Package MiniSKiiP MiniSKiiP Package SEMIKRON BOARD Wacker silicone paste p 12 wacker rubber Wacker Silicones
Contextual Info: MiniSKiiP Assembly Instructions 1. Preparation, surface specification 1.2 Heat sink ≤ 20 µm Heat sink > 10 µm ≤ 6,3 µm Fig. 1: Heat sink surface specification ♦ Heat sink must be free from grease and particles ♦ unevenness of heat sink mounting area must be ≤ 20 µm

Contextual Info: HEATSINK Heatsink with clips for TO-264 and TO-247 F E AT U R E S • Minimum assembly cost and labor. Spring Clips make the mounting holes and fasteners obsolete in assembly operations & reduce costs. • Maximum Thermal Transfer. Maximum surface area per unit volume, efficient cooling fins & consistent

to-268

Contextual Info: HEATSINK D Series THERMAL MANAGEMENT Heatsink For SMT devices F e at u r e s • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum