HEADER 2X20 PIN Search Results

header 2X20 pin

Abstract: header 2X20 ISL5927 digital clock evaluation ISL5217 J22 transistor AN1190 ISL5627 ISL5627EVAL1 ISL5x27
Contextual Info: ISL5x27EVAL1 User’s Manual Application Note April 7, 2005 AN1190.0 Description Getting Started The ISL5x27EVAL1 evaluation board provides a quick and easy method for evaluating the ISL5627, ISL5727, ISL5827, ISL5927 8-, 10-, 12-, or 14-bit , 260MSPS high-speed dual

AN1189

Abstract: quietzone ISL5857 ADT1-1WT header 2X20 pin ISL5757 ISL5757EVAL1 ISL5757EVAL2 ISL5857EVAL1 ISL5857EVAL2
Contextual Info: ISL5x57EVAL1 and EVAL2 User’s Manual Application Note AN1189.0 Functional Block Diagram The ISL5x57EVAL1 and EVAL2 evaluation boards provide a quick and easy method for evaluating the ISL5757, ISL5857, ISL5957 10-, 12-, or 14-bit , 260MSPS high speed DACs.

ISL5217EVAL1

Abstract: header 2X20 quietzone ISL5x29EVAL1 ISL5217 ISL5629 ISL5629EVAL1 ISL5729EVAL1 ISL5829EVAL1 ISL5929EVAL1
Contextual Info: ISL5x29EVAL1 User’s Manual TM Application Note February 2002 AN9997 Description Getting Started The ISL5x29EVAL1 evaluation board provides a quick and easy method for evaluating the ISL5629, 5729, 5829, 5929 8-,10-, 12-, or 14-bit , 130/210MSPS high-speed dual

gore quietzone

Abstract: quietzone header 2X20 pin connector 2x20 pins J11 connector T-Connector digital clock evaluation ISL5217 T1-1T DAC ISL5761EVAL2
Contextual Info: ISL5x61EVAL1 and EVAL2 User’s Manual TM Application Note September 2001 Functional Block Diagram The ISL5x61EVAL1 and EVAL2 evaluation boards provide a quick and easy method for evaluating the ISL5761/5861/5961 10-, 12-, or 14-bit , 130/210MSPS high speed DACs. EVAL1 is populated with an SOIC package and

4216 d-1

Abstract: 77339 2x25 pin header flame retardant 2X32
Contextual Info: r i ' 2|3 I o PRODUCT NUMBER 7 7 3 3 9 -XYY DIM "A" H t 1 I I I 1 DIM "C" DIM ”D" j MISSING PINS SEE TABLE SHEET 213 2 / 2 POS 4 0 2.6 l NOTES. DIM "A" POS 2 5? 1 4- é A 1T ♦ h- POS 1 if POS 3 Î 3 as * c i 1 - MATERIAL CONTACT: PHOSPHOR BRONZE. 2 - MATERIAL PLASTIC: POLYESTER 30% GLASSFILLED

Contextual Info: PRODUCT NO SEE TABLE _ c e s c b i p t i o n _ ADDED -037 AODED -036 S. NO T E ® ©© ®® © @ @ ® @ @ @ ® @ ® ® ® ® ® ® ® ® ® ® ® © 10 LWP MDF 6/29/89 7 /7 /8 9 •ROW A ROW B 0.O45±.003 nCCOMMD B CP HOUE RUTTEHN SCALE 10/ I

ma 3810

Contextual Info: PRODUCT NO SEE CHART REMOVE DA3H N03. 3H. I EJH 8 /6 /8 5 :v NOTES E NOTE 5 . PIN DIM 13 D & ♦ X Y X Y ® M ¡REV CHARTS EJH II0/1/8S 0.25/.010 ® 0. 41/.016 ® f 3.76 MAX .03 FLASH NOTE C SEE DETAILS CSHT 3D & CHARTS FOR POLARIZING FEATURE ARRANGEMENT AND STYLE

PL14C

Abstract: PR15D PR13C LCMXO2280C-3FTN256C PL15C FT2232HL PT10c PR11D ISPVM LCMXO2280C-B-EVN
Contextual Info:  MachXO2280 Breakout Board Evaluation Kit User’s Guide March 2011 Revision: EB66_01.0  MachXO2280 Breakout Board Evaluation Kit User’s Guide Lattice Semiconductor Introduction Thank you for choosing the Lattice Semiconductor MachXO 2280 Breakout Board Evaluation Kit!

ERG+INC+1715

Contextual Info: i - »-«.-T— .yn ngKBfT -r-im- 1— - âwsapÿwr*'1 PRODUCT NO DESCRIPTION SEE TABLE JA RDS 1/ 8 / 8 8 REDRAWN ADD -256 THRU -265. DGA 4 / 12/88 SEE TABULATION RECOMMENDED HOLE PATTERN 2 '54±'003N0N~ACCUM VIEW L SCALE 6/1 2.54 ± .08 fsjQN-ACCUM

20 pin header 2x40 gold

Abstract: AWLA header 2x5 2X40 20 pin pin Header 2x40 gold HEADER 2x8 16 pin 0441
Contextual Info: A3SMANN Dual row Pin header E le ctro n ic C o m p o n e n ts Dual row pin-header, straight or angled pins can bo cut to size can be cut to size j *-5 1.2 ? . 2.54 Part no. No. Of contacts Plating Dimensions mm / inch A AWL 04/11,2/G' AWL 04/11,2/2* MWL 04/12,4/G

AN60590

Contextual Info: 1 CONTENTS CHAPTER 1 INTRODUCTION TO THE TME EBK .3 1.1 Features .4

Contextual Info: 1 Copyright 2003-2012 Terasic Technologies Inc. All Rights Reserved CONTENTS Chapter 1 INTRODUCTION TO THE TME EBK . 3 1.1 Features. 4

MC7805DT

Contextual Info: Freescale Semiconductor, Inc. User’s Guide Document Number: KT33887UG Rev. 2.0, 4/2013 KIT33887EKEVB Evaluation Board Featuring the MC33887EK 5.0 A H-Bridge IC Figure 1. KIT33887EKEVB Evaluation Board Contents 1 Kit Contents/Packing List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Contextual Info: V1.1 ORDER INFORMATION: PHa00X-RtXX02Gf-CP PH: PIN HEADER a: 2.54mmX2.54mm PITCH 00X: SERIES NO. -001: POST HEIGHT = 6.00mm -002: POST HEIGHT = 8.13mm -003: POST HEIGHT = 10.67mm -004: POST HEIGHT = 3.05mm Rt: PCB TYPE. RIGHT ANGLE SURFACE MOUNT TYPE XX: NO. OF PINS PER ROW

W68310

Abstract: J10B W6810DK J15B W6810 J15A J16A J17A IC socket 2X20 pin fsync in PCM
Contextual Info: Winbond W6810 Codec Evaluation System User’s Guide W6810DK Evaluation Board Rev 1.06 1 WECA 2727 N First Street, San Jose CA 95134 W6810DK Chapter - 1 . 3

Contextual Info: V1.1 REVISIONS SYM DISCRETION DATE APPROVED SYM DISCRETION A A A A ♦ ♦ CUSTOMER DRAWING FOR REFERANCE ONLY, SAMPLES APPROVAL ARE REQUIRED!! 1.00 •I L „ „J o r-O DO ON o CM ORDER INFORMATION: SPHbl 750-PtXX02Gf-0820-0930-XX SPH: STACK PIN HEADER b: 2.0mmX2.0mm PITCH

kc 4369

Abstract: ztth 102 90CV 359 AU ztth 209
Contextual Info: PRODUCT NUMBER SEE TABLE R E V IS IO N S BY ecu/DDK# 140002 IS S DATE SH EET IN D E X IS S U E SH NO. 3 4 w F 07/22/94 z z ZI Z 5 6 10 NOUS OQt 01 /.Ot 3 - M-SMYK 1/16/90 M .SMYK ' / } 6/99 oo at o o s / o o T T T 00001 0020 /OOOt .05 NQTÇ; THfS D0CUMÇNT

F407

Contextual Info: 11 PRODUCT NUMBER 7 1 9 1 4 —XYY # f c r z f c DIM ’A" DIM "C" DIM "D" SEE TABLE SHEET 2 1 3 2.6 2 /2 DIM "A" NOTES. I £ ♦ *1 ♦ * T t I MATERIAL CONTACT: PHO SPHO R BRONZE. 2 - MATERIAL PLASTIC: POLYESTER 3 0 % GLASSFILLED FLAME RETARDANT PER U L - 9 4 - V 0 COLOR GREY.

7805DT

Abstract: US153CLV-0405 PINHD TP20r 2X20PIN CPOL-US153CLV-0405 KT33887UG usc1206 2X20 Y-31k
Contextual Info: Freescale Semiconductor User’s Guide Document Number: KT33887UG Rev. 1.0, 11/2008 KIT33887EKEVB Evaluation Board Figure 1. KIT33887EKEVB Table of Contents 1 2 3 4 5 6 7 8 9 Kit Contents / Packing List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Contextual Info: r PRODUCT NO. SEE TABLE '2 54 ± 083 ^ NON-ACCUMULATIVE „.1 0 9 2 .7 7 - ¿ A ï $ — à — ¿ — <*> il «i i t u .1 0 0 ± .0 0 3 2 .5 4 ± .0 8 NOTE 10 I § £ +* « 2 RECOMMENDED 8IK HOLE PATTERN SCALE 10:1 ï ! I « • i i SÌ I* .045 1 .1 4 ' h ?

X200 LAPTOP schematics

Contextual Info: E valu atio n B oar d For XMC4000 Family XMC 450 0 Rela x Ki t & XMC 450 0 Rela x Lit e Kit Kit Version 1 Boa rd Us er‘s Ma nu al Revision 1.2, 2014-01-13 Mic rocon t rolle r Edition 2014-01-13 Published by Infineon Technologies AG 81726 Munich, Germany

IC 74HC14

Abstract: 74HC14 oscillator application note crystal 16MHZ Header 2x5 Pitch 2mm IC 74HC573 IC 3528 TANTAL 74HC14 oscillator smd IC 74HC14 DATA SHEET HEADER 2MM 20PIN
Contextual Info: BD REV : 1.2 IIM7300 No. COUNT LOCATION 1 1 U6 2 1 U7 3 1 U1 4 1 U2 5 1 U4 6 1 U4 7 1 U3 8 1 U5 9 1 OSC1 10 1 Y1 11 2 L1, L2 12 2 C1, C2 BC2, BC3, BC4, C5, BC5, C6, C7, 13 16 BC8,BC1-1, BC1-2, BC6-1, BC6-2, BC6-3,BC6-4, BC7-1, BC7-2 14 1 C3 15 1 CP1 16 2 D1, D2

UMFT313EV Development Module

Abstract: CAPC1608 RESC1608
Contextual Info: UMFT313EV Datasheet Version 1.0 Document Reference No.: FT_000762 Clearance No.: FTDI# FTDI Chip UMFT313EV Datasheet USB2.0 Hi-Speed Host Development Module General Purpose USB2.0 Hi-Speed USB Host Contoller 1 Introduction The UMFT313EV is a development module

2x5 berg header

Abstract: 65530 P5424
Contextual Info: PflOOUCTNO See CHr 4r NO TES: .0 3 0 MAX. FLASH PERMIS3BLE AROUND TERMINAL THIS SIDE. 3 0 7o GLASS FILLED POLYESTER. FLAME RETARDENT 94VE0 VATL. COLOR BLUE . TERMINALS. 3/4 HARD PHOSPHOR BRONZE ALLOY A). 4. I 3 MAX. DRAFT PERMITTED ON ALL SURFACES UNLESS OTHERWISE