HBP MITEL Search Results

Contextual Info: MITEL MP02 XXX 175 Series Phase Control Dual SCR, SCR/Diode Modules SEM ICON D UCTOR Supersedes Septem ber 1992 version, 2.2 DS4477-3.0 Decem ber 1998 FEATURES Dual Device Module Electrically IsolatedPackage Pressure Contact Construction International Standard Footprint

HBP SCR

Contextual Info: MITEL MP02 XXX 130 Series Phase Control Dual SCR, SCR/Diode Modules SEM ICON D UCTOR Supersedes O ctober 1992 version, 2.0 DS4477-2.0 Decem ber 1998 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint

HBP MITEL

Contextual Info: MITEL MP02 XXX 190 Series Phase Control Dual SCR, SCR/Diode Modules SEM IC O N D U C T O R Supersedes Septem ber 1992 version, 2.2 DS4479-3.0 D ecem ber 1998 FEATURES • Dual device module ■ Electrically isolated package ■ Pressure contact construction

RK 51-200 E

Contextual Info: MITEL MP03 XXX 130 Series Phase Control Dual SCR, SCR/Diode Modules SEMICONDUCTOR Supersedes O ctober 1992 version, 2.0 DS4480-3.0 Decem ber 1998 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint

MTO thyristor

Abstract: thyristor SCR 1000A unial thyristor INR 330 HBP MITEL
Contextual Info: MITEL MP03 XXX 330 Series Phase Control Dual SCR, SCR/Diode Modules S E M IC O N D U C T O R Supersedes January 1994 version, 3.2 DS4483-4.0 D ecem ber 1998 FEATURES • ■ ■ ■ ■ Dual Device M odule Electrically Isolated Package Pressure C ontact Construction

Contextual Info: MITEL MP02 XXX 190 Series Phase Control Dual SCR, SCR/Diode Modules SEMICONDUCTOR Supersedes Septem ber 1992 version, 2.2 DS4479-3.0 D ecem ber 1998 FEATURES Dual device module Electrically isolated package Pressure contact construction International standard footprint

TIC 44 SCR

Contextual Info: MITEL MP03 XXX 190 Series Phase Control Dual SCR, SCR/Diode Modules SEMICONDUCTOR Supersedes O ctober 1992 version, 2.0 DS5099-3.0 Decem ber 1998 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint

TIC 44 SCR

Abstract: SCR TIC 44 MTO thyristor unial
Contextual Info: MITEL MP02 XXX 175 Series Phase Control Dual SCR, SCR/Diode Modules SEMICONDUCTOR Supersedes Septem ber 1992 version, 2.2 DS4477-3.0 Decem ber 1998 FEATURES • ■ ■ ■ ■ KEY PARAMETERS VDRM 1600V 'ts m 6800A lT AV (per arm) 175A Visol 2500V Dual Device M odule

HBP MITEL

Abstract: RECTIFIER DIODE 1000A 2500V 3-phase 50hz Bridge Rectifier
Contextual Info: MITEL MP03 XXX 275 Series Phase Control Dual SCR, SCR/Diode Modules SEM IC O N D U C T O R Supersedes January 1994 version, 3.2 DS4481-4.0 Decem ber 1998 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction

Contextual Info: MITEL MP02 XXX 130 Series Phase Control Dual SCR, SCR/Diode Modules SEMICONDUCTOR Supersedes O ctober 1992 version, 2.0 DS4477-2.0 Decem ber 1998 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint

scr tic 106

Contextual Info: MP03 XXX 360 Series MITEL Phase Control Dual SCR, SCR/Diode Modules SEMICONDUCTOR Supersedes January 1994 version, 3.2 DS4484-4.0 Decem ber 1998 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint

scr tic 106

Abstract: HBP MITEL
Contextual Info: M ITEL MP03 XXX 300 Series Phase Control Dual SCR, SCR/Diode Modules SEMICONDUCTOR Supersedes January 1994 version, 4.2 DS4482-5.0 Decem ber 1998 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint

scr tic 106

Contextual Info: M ITEL MP03 XXX 275 Series Phase Control Dual SCR, SCR/Diode Modules SEMICONDUCTOR Supersedes January 1994 version, 3.2 DS4481-4.0 Decem ber 1998 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint

scr tic 106

Abstract: HBP MITEL
Contextual Info: M ITEL MP03 XXX 300 Series Phase Control Dual SCR, SCR/Diode Modules SEMICONDUCTOR DS4482-5.0 December 1998 Supersedes January 1994 version, 4.2 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint

HBP MITEL

Contextual Info: M ITEL MP03 XXX 175 Series Phase Control Dual SCR, SCR/Diode Modules S E M IC O N D U C T O R Supersedes O ctober 1992 version, 2.0 DS5098-3.0 Decem ber 1998 FEATURES • Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction

HBP MITEL

Abstract: MP03A MTO thyristor
Contextual Info: M ITEL MP03 XXX 175 Series Phase Control Dual SCR, SCR/Diode Modules S E M IC O N D U C T O R Supersedes O ctober 1992 version, 2.0 DS5098-3.0 Decem ber 1998 FEATURES Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint

CAMERA MOD CCP2 SMIA 85

Abstract: IHI Rotary Encoder Samsung Nexus S JTAG pins sharp CMOS Camera Module CSI lm 741 using schmitt trigger Nexus S camera SCR FIR 3 D LCD MIPI PANEL sharp mmu ericsson Camera mod ccp2
Contextual Info: STn8815A12 Mobile multimedia application processor Features • Smart video accelerator – MPEG-4 Simple Profile L5 encoding/decoding up to SDTV 30 fps – DVB-H class C H264 BP L2 2Mbps CIF 30fps – DVB-H class B VC1 SP 384kbps QVGA 20fps – H.264 decode resolution up to VGA bit-rate