H63A FLOW SOLDER Search Results

Senju

Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
Contextual Info: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).

Senju

Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
Contextual Info: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).

H63A

Abstract: H60A DSA0038169
Contextual Info: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is

VCM11R

Abstract: H63A H60A
Contextual Info: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is

NFM60R

Abstract: NFM60 H63A H60A NFM51R
Contextual Info: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is

H63A

Abstract: H60A
Contextual Info: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is

H60A

Abstract: H63A H63A FLOW SOLDER
Contextual Info: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is

H63A

Abstract: nfm39r H60A nfm39
Contextual Info: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is

plm250

Abstract: H63A FLOW SOLDER H60A H63A PLM3216K
Contextual Info: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is

0330M

Contextual Info: Ferrite Chip Wideband EMI Suppressors W ide Frequency Range, Rated Current: 1.5 and 3A max. ACC Series ACC201209 TYPE SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERNS 2 ± 0.2 REFLOW AND FLOW SOLDERINGS Term inal electro d e F errite _ t l_ ' p 1 1 0 .3 1 0 .2

LQG21

Abstract: LQN2A LQP21 coil LQP21A LQS33N LQS33 lqp21
Contextual Info: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD RECOMMENDED SOLDERING CONDITIONS 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N, LQM32C, LQP21A/31A should be reflow soldered only. Please contact Murata Electronics regarding other

C7022

Abstract: cutting paste C-7022 H63A
Contextual Info: Hybrid 1C Notes About Quality Assurance Notes About Quality Assurance Rohm hybrid ICs are guaranteed in terms of high prod­ uct quality and high reliability through the manufactur­ ing flow shown below. H y b rid 1C manufacturing process flow v1/ •Q u a lity assurance testing program

Contextual Info: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N and LQP21A/31A should be reflow soldered only. Please contact Murata Electronics regarding other soldering methods. RECOMMENDED SOLDERING CONDITIONS

C7022

Abstract: JIS-C-7022 H63A
Contextual Info: Notes About Quality Assurance Hybrid 1C Notes About Quality Assurance Rohm hybrid IC s are guaranteed in terms of high prod­ uct quality and high reliability through the manufactur­ ing flow shown below. • H y b rid !C manufacturing process flow \ y /

NFE31P

Abstract: H60A H63A 02MG
Contextual Info: for reflow and flow soldering NFW31S for reflow soldering NFE31P Chip mounting side Land Solder Resist Back side Small diameter thru hole φ0.4—φ0.6 3.0 3.0 Connect to ground pattern of mounting side 2.6 1.0 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFp

Contextual Info: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N and LQP11A/21A should be reflow soldered only. Please contact Murata Electronics regarding other soldering methods. The volume of solder can cause minor fluctuations in

H60A

Contextual Info: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. Reflow soldering should be applied for LQS33N 5.5 1.0 2.0 LQH3Nxx24/3Cxx24 LQS33N Solder:Use H60A,H63A JIS Z 3282 or equivalent.

murata chip suppression filter NFA

Abstract: NFA81
Contextual Info: 2. Solder Paste Printing and Adhesive Application When reflow soldering the chip EMI suppression filter, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will prone to be

flux NF-3000

Abstract: LQH3ER MURATA LQW18A transistor tip 31c LQW18A LQM31F 025030
Contextual Info: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. a Land Pattern Solder Resist c b Series LQG15H LQG18H a b c 0.5-0.6 1.4-1.5 0.4 0.6-0.8 1.8-2.2

MURATA LQH

Abstract: flux NF-3000 LQS33
Contextual Info: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. Reflow soldering should be applied for LQS66C Land Solder Resist 3.5 8.0 3 Standard Soldering Conditions

LQN4N

Abstract: C2404 LQN21
Contextual Info: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. 7.5 1.5 3.0 LQH4N LQN4N LQH4C Solder:Use H60A,H63A JIS Z 3282 or equivalent. Use solder paste equivalent to H60A for

LQH3ER

Abstract: MURATA LQW18A H60A H63A LQH43C LQH43M LQH43N LQW18A jis magnetic
Contextual Info: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. LQH43M LQH43N LQH43C 1.5 3.0 7.5 1.5 1.5 1.5 Land Pattern Solder Resist in mm Solder : Use H60A,H63A JIS Z 3282 or equivalent.

flux NF-3000

Abstract: C2404 LQN21A LQG3 LQS33N MURATA LQH
Contextual Info: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. Solder:Use H60A,H63A JIS Z 3282 or equivalent. Use solder paste equivalent to H60A for LQP10A/11A and LQG10A/11A.

BUT 11A equivalent

Abstract: LQP10A
Contextual Info: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. LQG10A b 0.5-0.6 1.4-1.5 Flow Solder c 0.4 LQG11A 0.6-0.8 1.8-2.2 0.6-0.8 2.2-2.6 Flow 0.7 0.7