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GQM2195G2E101GB12D
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Murata Manufacturing Co Ltd
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High Q Chip Multilayer Ceramic Capacitors (＞100Vdc) for General Purpose |
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10127720-101GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 10 Positions, 100u\\ Tin plating, GW Compatible LCP, With Pegs, Tray Packing. |
PDF
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10127721-101GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 10 Position, 3.2mm Kink Tail (100u\\ Tin) plating, GW Compatible LCP, Black Color,Tray Packing. |
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54101-G32-04
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch. |
PDF
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54101-G30-00
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 0 Positions, 2.54 mm Pitch. |
PDF
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